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Hanwha Semitech stakes early lead in hybrid bonding race for SK Hynix's HBM4

Lillian Chen, Taipei; Levi Li, DIGITIMES Asia Thursday 18 September 2025 0

Credit: Hanwha Semitech

Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment suppliers are racing to bring their systems to market ahead of that tra...

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