The top-5 wafer capacity leaders saw their combined installed capacity represent 54% of total global wafer capacity in December 2020, according to IC Insights. In 2009, the top-10 wafer capacity leaders held 54% of total global capacity and the top five leaders accounted for 36% of capacity.
Each of the top-five wafer capacity leaders had installed capacity of at least 1.5 million 200mm equivalents in December 2020, said IC Insights. After the top five, wafer capacity at other semiconductor leaders quickly falls off. Intel (884K wafers/month), UMC (772K wafers/month), Globalfoundries, Texas Instruments (TI) and SMIC rounded out the top 10 capacity leaders.
Samsung Electronics had the most installed wafer capacity with 3.1 million 200mm-equivalent wafers in December, IC Insights indicated. That represented 14.7% of the world's total capacity. Second in line was pure-play foundry TSMC with capacity of about 2.7 million wafers or 13.1% of total worldwide capacity.
Micron Technology had the third largest amount of capacity at the end of 2020 with a little more than 1.9 million wafers, or 9.3% of worldwide capacity, IC Insights noted. The fourth-largest capacity holder was SK Hynix with nearly 1.9 million wafers or 9.0% of total worldwide capacity. Rounding out the top 5 companies was another memory IC supplier Kioxia with 1.6 million wafers/month (7.7% of total worldwide capacity) including a substantial amount of NAND flash memory capacity for its fab investment and technology development partner Western Digital.
The industry's five biggest pure-play foundries - TSMC, UMC, Globalfoundries, SMIC and Powerchip Technology - had a combined capacity of about 5.1 million wafers per month as of December 2020 representing about 24% of the total fab capacity in the world, according to IC Insights.