AIMobile, an AI solution joint venture between Inventec and Advantech, has partnered with Canon to integrate its AI technologies into the Japanese firm's imaging systems to strengthen...

Goodix Technology is set to ramp up shipments of its optical in-display fingerprint sensors in 2020, and has reportedly reserved sufficient 8-inch fab capacity from TSMC, according...

The supply of gaming monitor panels could exceed market demand in 2020 as a growing number of panel makers are realigning their production lines to focus more on IT panels instead...

Universal Scientific Industrial (USI), a member of Taiwan's ASE Technology Holding, has disclosed plans to acquire fellow EMS company Asteelflash for around US$450 million.

Taiwan-based IC substrate makers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen their shipments ramp up in most of fourth-quarter 2019 with...

National Center for High-performance Computer under stated-owned National Applied Research Laboratories (NARLabs) is planning to invest NT$570 million (US$18.63 million) in 2020 to...

Hewlett-Packard (HP) is looking to expand its share in Taiwan's notebook market in 2020 to a double-digit percentage, according to Wendy Wang, chairman of HP Taiwan.

Global makers of CMOS image sensors (CIS) are expected to embrace explosive demand for higher-specs CIS devices for application to autonomous vehicles in addition to handsets, which...

Now that Young Liu has taken the helm, the Foxconn Technology Group (Hon Hai Precision Industry) has begun a series of transformations targeting the business opportunity from 5G,...

Taiwan-based IC design houses have seen significant increases in orders for related ICs for 5G phones recently, particularly from first-tier Chinese handset brands, with the ramp-ups...

Global semiconductor manufacturing equipment sales will drop 10.5% to US$57.6 billion in 2019 from last year's historic peak of US$64.4 billion but stage a 2020 recovery and set a...

Robust orders for 5G smartphone application processors from the world's major Android phone vendors will allow backend house ASE Technology Holding to enjoy a particularly strong...

The global market for SoCs for true wireless stereo (TWS) earbuds is poised for exponential growth in 2020, but competition will heat up, driving IC suppliers to improve their product...

With capital expenses by semiconductor firms in Taiwan and China set to regain expansion momentum in 2020, equipment supply chain players are expected to see a bright year for their...

Taiwan-based IPC maker Ibase Gaming has announced it will partner with US-based Powin Energy and Japan-based Murata Manufacturing to develop energy storage solutions.

Taiwan's CMOS image sensor (CIS) packaging specialists including Kingpak Technology, Xintec,VisEra Technologies and Tong Hsing Electronic Industries are expected to benefit significantly...

Huawei Tachnologies is expected to ship 200 million smartphones in 2020 and its fellow first-tier vendors, including Oppo, Vivo and Xiaomi, will each ship at least 100 million units,...

AVY Precision Technology is expanding its automotive component business to cover products including electric parking braking (EPB) system module and electric vehicle motor, and expects...

Macronix International is poised to kick off commercial shipments of 48-layer 3D NAND flash chips in the second half of 2020, followed by volume shipments of 96-layer 3D NAND products...

TSMC has obtained orders for CMOS image sensors from Sony, and will fabricate the chips using 40nm process technology at Fab 14A in Tainan, southern Taiwan, according to a recent...

Acquiring Panasonic's loss-making semiconductor business will have a negative impact on Nuvoton Technology's profitability in the short term, and it may take time for the business...

Advantech will release MarketPlace 2.0 under its WISE-PaaS (platform as a service) in January 2020 to allow clients to customize software services they need.

Specialty DRAM and flash memory chipmaker Winbond Electronics is slowing down constructing and equipping its new 12-inch wafer plant in Kaohsiung, southern Taiwan, according to company...

The market for packaging materials for 5G mmWave transmission modules is set to heat up in 2020, with LTCC (low temperature co-fired ceramic) likely to replace LCP (liquid crystal...

MediaTek and Realtek Semiconductors are both gearing up to ramp up their output of Wi-Fi 6 (802.11ax) chips in 2020, according to sources at IC testing solutions providers.