Altera, Xilinx to switch from TSMC CoWoS process to PoP packaging for next-generation chips, says paper
EDN, March 4; Steve Shen, DIGITIMES
Altera and Xilinx both have decided to adopt PoP (package on package) packaging technology for its next-generation chips, instead of using chip-on-wafer-on-substrate (CoWoS) process developed by Taiwan Semiconductor Manufacturing Company (TSMC), according...
The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
The coronavirus outbreak has disrupted production and weakened consumer confidence, with all ICT sectors bracing for major declines in shipments. Digitimes Research has conducted analyses on three mobile device sectors, namely notebooks, smartphones and tablets in the wake of the outbreak.