Altera, Xilinx to switch from TSMC CoWoS process to PoP packaging for next-generation chips, says paper

EDN, March 4; Steve Shen, DIGITIMES Asia Monday 4 March 2013 0

Altera and Xilinx both have decided to adopt PoP (package on package) packaging technology for its next-generation chips, instead of using chip-on-wafer-on-substrate (CoWoS) process developed by Taiwan Semiconductor Manufacturing Company (TSMC), according...

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