Altera and TSMC have announced the joint development of what they claim is the world's first heterogeneous 3D IC test vehicle using TSMC's chip-on-wafer-on-substrate (CoWoS) integration process.
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Altera and TSMC have announced the joint development of what they claim is the world's first heterogeneous 3D IC test vehicle using TSMC's chip-on-wafer-on-substrate (CoWoS) integration process.
