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Altera, TSMC develop 3D IC test vehicle

Press release, March 22; Jessie Shen, DIGITIMES Asia Friday 23 March 2012 0

Altera and TSMC have announced the joint development of what they claim is the world's first heterogeneous 3D IC test vehicle using TSMC's chip-on-wafer-on-substrate (CoWoS) integration process.

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