112 news items tagged Xilinx
ABF substrate prices likely to rise
Tuesday 23 February 2021ABF substrate prices are likely to rise later in the first half of 2021, driven by rebounding demand for crypto mining chips and a sharp rise in demand for server applications starting...
Kinsus swings to profit in 2020 on robust BT, ABF substrates sales
Tuesday 2 February 2021IC substrate supplier Kinsus Interconnect Technology swung to net profit of NT$541 million (US$19.3 million) in 2020 from loss of NT$2.025 billion a year earlier, mainly driven by...
ABF substrate suppliers see clear order visibility stretch into 2H21
Tuesday 26 January 2021Taiwan-based IC substrate providers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen the visibility of orders for ABF substrates extend to second-half...
Kinsus to expand ABF substrate capacity by 30% in 2021
Friday 22 January 2021Taiwan-based IC substrate maker Kinsus Interconnect Technology plans to restore a fire-hit flexible PCB (FPCB) plant in Hsinchu, northern Taiwan, and convert it to produce ABF substrates...
TSMC sees 28nm process capacity utilization ramp up
Wednesday 4 November 2020TSMC has seen capacity utilization rates for 28nm process technology surge and come to nearly 100% in the fourth quarter of 2020, thanks to the bulk of orders transferred by Qualcomm...
AMD to acquire Xilinx
Wednesday 28 October 2020AMD and Xilinx have announced they have entered into a definitive agreement for the former to acquire the latter in an all-stock transaction valued at US$35 billion.
Intel faces increasing rivalry from AMD, Nvidia, Apple in core sectors
Monday 26 October 2020Intel has agreed to sell its NAND flash and storage business to SK Hynix, but the chipmaker is also facing increasingly intense competition from AMD, Nvidia and even Apple in its...
TSMC to ramp up 3nm chip production starting 2H22
Friday 25 September 2020TSMC is on track to enter 3nm chip production with monthly output set to reach 55,000 wafers in the second half of 2022, according to sources familiar with the matter. The 3nm process...
TSMC to open new packaging fabs in 2021-22 using 3D Fabric platform
Thursday 24 September 2020TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...
IC substrate makers shifting focus to US clients from Huawei
Friday 5 June 2020Taiwan-based IC substrate makers including Unimicron Technology and Na Ya PCB are gearing up to strengthen business ties with US clients seeking to offset expected losses of orders...
TSMC optimistic about HPC products in 2020
Monday 20 April 2020Taiwan Semiconductor Manufacturing Company (TSMC) expects significant sales from the the high performance computing (HPC) sector in 2020, an indication that chip vendors are still...
TSMC sees CoWoS packaging capacity utilization ramp up
Thursday 9 April 2020TSMC has seen utilization of its chip-on-wafer-on-substrate (CoWoS) packaging capacity rise substantially in the second quarter of 2020, and now runs the packaging production lines...
Nan Ya, Kinsus 1Q20 revenues spike on robust ABF substrate shipments
Wednesday 8 April 2020Robust demand for ABF substrates has significantly driven up first-quarter 2020 revenues at Nan Ya PCB and Kinsus Interconnect, with the growth momentum expected to last through at...
Niche-IC distributor ANStek posts profit growth in 2019
Wednesday 18 March 2020Taiwan-based Answer Technology (ANStek), which distributes mainly ICs for niche-market applications, has reported net profits grew 2.5% to NT$182 million (US$6.02 million) in 2019...
Xilinx announces Versal Premium developed on TSMC 7nm process
Thursday 12 March 2020Xilinx has announced Versal Premium, the third series in the Versal adaptive compute acceleration platform (ACAP) portfolio. The Versal Premium series features highly integrated,...
IC distributors post mixed February results
Wednesday 11 March 2020Taiwan's IC distributors have posted mixed revenues for February, with those distributing 5G base station, server and memory chips as well as niche applications performing better...
Xilinx keen on developing AI-based FPGA chips for automotive use
Monday 20 January 2020US FPGA chips specialist Xilinx will step up development of self-adaptive AI chips for automotive applications based on the emerging concepts of Mobility as a Service (MaaS) and Transportation...
High-end FPGA demand mounting for datacenter, 5G, AIoT applications
Tuesday 19 November 2019High-end FPGA chips demand is mounting significantly for datacenter, 5G and AIoT applications, providing growth momentum for related wafer foundry, analysis and test players as well...
TSMC 7nm process attracts multiple orders for AI processors
Friday 4 October 2019TSMC with its competitive 7nm process technology has obtained orders for made-for-AI chip processors from Nvidia, Xilinx and Qualcomm, and a number of China-based vendors such as...
TSMC to volume produce 5nm chips as early as March 2020
Monday 23 September 2019TSMC is expected to move its more advanced 5nm process technology to volume production as early as March, according to industry sources.
Taiwan semiconductor foundry sector, 2Q19
Thursday 12 September 2019With global market demand on a moderate increase in second-quarter 2019, Taiwan-based semiconductor foundries showed recovery. Taiwan Semiconductor Manufacturing Company (TSMC), United...
Xilinx intros FPGA featuring 9 million system logic cells
Friday 23 August 2019Xilinx has announced the expansion of its 16nm Virtex UltraScale+ family to now include what the company claims is the world's largest FPGA, the Virtex UltraScale+ VU19P, with 35...
TSMC to kick off shipments for new Xilinx 7nm chips
Wednesday 19 June 2019TSMC will soon enter volume shipments for new Xilinx adaptive compute acceleration processors manufactured using 7nm process technology, according to industry sources.
HiSilicon said to extend capacity guarantee pacts with Taiwan partners through 2Q20
Monday 20 May 2019China chipmaker HiSilicon is reportedly to sign with Taiwan IC supply chain partners capacity guarantee agreements valid through the second quarter of 2020, despite uncertainties...
KYEC, Qualcomm said to set up 5G chips engineering test center
Wednesday 17 April 2019Backend house King Yuan Electronics (KYEC) reportedly will team up with Qualcomm to set up an engineering test center to be installed with 20-30 sets of equipment for testing 5G radio-frequency...

Xilinx Virtex-5 TXT platform: Single FPGA solution for 40G and 100G telecommunications equipment
Photo: Company, Thursday 25 September 2008