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NEWS TAGGED XILINX
Monday 26 July 2021
Zhen Ding, AT&S keen on ABF substrates
Taiwan-based leading PCB maker Zhen Ding Technology and Austria's AT&S are set to enter the high-end ABF substrate segment where demand will stay robust through 2025, both making...
Thursday 8 July 2021
Arrival of new capacity drives Nan Ya, Kinsus revenue growth
Nan Ya PCB and Kinsus Interconnect Technology both saw their June revenue climb over 30% from a year earlier, driven mainly by the arrival of new production capacity, according to...
Friday 2 July 2021
Zhen Ding to set up 4 new plants mainly for IC substrates, HDI boards
Taiwan's PCB maker Zhen Ding Technology has disclosed plans to set up four new plants in Taiwan and China in 2021, mostly dedicated to production of high-end IC substrates and rigid...
Monday 7 June 2021
Taiwan backend houses caught in cluster COVID infections
Taiwan's major dedicated IC testing house King Yuan Electronics (KYEC) has been ordered by the Central Epidemic Command Center (CECC) to have all its migrant workers undergo a 14-day...
Monday 3 May 2021
Taiwan IC substrate suppliers negotiating new deals with AMD
Major Taiwan-based IC substrate suppliers Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are negotiating with AMD a new form of supply deals under which the suppliers...
Tuesday 16 March 2021
TSMC 2Q21 capacity filled by orders for 5G, HPC and auto chips
TSMC has seen its production capacity during the second quarter filled by a strong pull-in of orders for 5G, HPC and automotive electronics chips, according to industry sources.
Tuesday 23 February 2021
ABF substrate prices likely to rise
ABF substrate prices are likely to rise later in the first half of 2021, driven by rebounding demand for crypto mining chips and a sharp rise in demand for server applications starting...
Tuesday 2 February 2021
Kinsus swings to profit in 2020 on robust BT, ABF substrates sales
IC substrate supplier Kinsus Interconnect Technology swung to net profit of NT$541 million (US$19.3 million) in 2020 from loss of NT$2.025 billion a year earlier, mainly driven by...
Tuesday 26 January 2021
ABF substrate suppliers see clear order visibility stretch into 2H21
Taiwan-based IC substrate providers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen the visibility of orders for ABF substrates extend to second-half...
Friday 22 January 2021
Kinsus to expand ABF substrate capacity by 30% in 2021
Taiwan-based IC substrate maker Kinsus Interconnect Technology plans to restore a fire-hit flexible PCB (FPCB) plant in Hsinchu, northern Taiwan, and convert it to produce ABF substrates...
Wednesday 4 November 2020
TSMC sees 28nm process capacity utilization ramp up
TSMC has seen capacity utilization rates for 28nm process technology surge and come to nearly 100% in the fourth quarter of 2020, thanks to the bulk of orders transferred by Qualcomm...
Wednesday 28 October 2020
AMD to acquire Xilinx
AMD and Xilinx have announced they have entered into a definitive agreement for the former to acquire the latter in an all-stock transaction valued at US$35 billion.
Monday 26 October 2020
Intel faces increasing rivalry from AMD, Nvidia, Apple in core sectors
Intel has agreed to sell its NAND flash and storage business to SK Hynix, but the chipmaker is also facing increasingly intense competition from AMD, Nvidia and even Apple in its...
Friday 25 September 2020
TSMC to ramp up 3nm chip production starting 2H22
TSMC is on track to enter 3nm chip production with monthly output set to reach 55,000 wafers in the second half of 2022, according to sources familiar with the matter. The 3nm process...
Thursday 24 September 2020
TSMC to open new packaging fabs in 2021-22 using 3D Fabric platform
TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...