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    OCP APAC 2026: Ayar Labs CEO says copper is holding back open compute, sees optical interconnects as way forward
    20min ago
    NEWS TAGGED SPIL
    Wednesday 12 August 2026
    SPIL breaks ground on NT$100B Douliu plant, targeting operations in 2028

    Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding (ASEH), broke ground on a new plant in Douliu, Yunlin...

    Saturday 8 August 2026
    TSMC vs. UMC and beyond: the hostile bids that forged Taiwan's chip dominance

    Powerchip chairman Frank Huang, who spent much of his career mirroring the trajectory of Taiwan's memory and foundry industries and...

    Friday 31 July 2026
    SPIL AI packaging investment boosts CTSP Erlin Park as first standard factory opens in 2H26
    The Central Taiwan Science Park's (CTSP) Erlin Park is set to reach a long-awaited milestone when its first standard factory building begins operations in the second half of 2026,...
    Thursday 16 July 2026
    Taiwan OSATs expand non-China capacity with US and SEA push
    As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China...
    Friday 10 July 2026
    TSMC CoWoS output reportedly to reach at least 200K wafers in 2027

    TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly...

    Thursday 25 June 2026
    TSMC-Amkor alliance jolts packaging map as ASE races to expand
    The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...
    Thursday 11 June 2026
    Taiwan Mask sells Zhunan plant to Siliconware Precision Industries for NT$2.8 billion
    Taiwan Mask (TMC), a Taiwanese photomask manufacturing process company, has approved the sale of its Plant 6 in Zhunan, Taiwan. The company said the move is primarily a strategic measure...
    Monday 4 May 2026
    SPIL buys multiple Nanke plants to boost advanced packaging capacity for AI demand
    Siliconware Precision Industries Co., Ltd. (SPIL), a subsidiary of ASE Technology Holding, acquired two Nanke-area plants in 2026 from HannStar Display and its affiliate HannsTouch...
    Friday 27 March 2026
    Innolux sells Fab 2 to SPIL
    Innolux is selling multiple factories to strengthen its financial position and operations. Following an announcement of a standard factory sale to ChipMOS, Innolux disclosed on March...
    Monday 2 February 2026
    ASE ramps advanced packaging in Taiwan as SPIL scales central hub
    ASE Technology Holding is accelerating capacity expansion across multiple locations to meet rising demand for advanced packaging and testing services, with projects underway in northern,...
    Friday 21 November 2025
    ASE and SPIL draw attention as Nvidia pushes for expanded US packaging capacity
    Nvidia reported strong third-quarter results for fiscal 2026 (ending October 2025), driven by robust sales of its Blackwell Ultra chips. Cloud data center revenue rose over 60% year-on-year...
    Thursday 20 November 2025
    Nvidia partners with Amkor, SPIL, and Menlo Micro to boost US IC backend capacity
    Nvidia has announced key partnerships to expand its supply chain and manufacturing capacity in the US, aiming to meet rising global demand for artificial intelligence (AI) computing...
    Thursday 13 November 2025
    Taiwan revises merger law to boost industrial holding companies
    Following the success of ASE and Siliconware Precision Industries (SPIL) in forming a joint holding company, Taiwan's government is now expanding incentives to encourage more listed...
    Tuesday 9 September 2025
    TSMC and OSATs ramp up advanced semiconductor packaging amid AI-driven demand surge
    TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced...
    Wednesday 16 July 2025
    Penang's OSAT boom: ASE, Tongfu, Inari lead charge in advanced packaging
    Malaysia has steadily developed its outsourced semiconductor assembly and testing (OSAT) industry, with Penang — often called the "Silicon Valley of the East" — at its...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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