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NEWS TAGGED SPIL
Tuesday 17 October 2023
Suppliers plan ahead amid potential US ban on more AI chips
The US reportedly may impose stricter restrictions on Chinese chipmakers and Nvidia's downgraded AI H800 processors. In light of this, Taiwanese testing companies and probe card providers...
Tuesday 26 September 2023
OSATs gearing up for heterogeneous integration boom in 2024
OSATs are bracing for a surge in demand for heterogeneous integration, which will necessitate CoWoS, silicon photonics (SiPh), and other new technologies in 2024, according to industry...
Wednesday 20 September 2023
Taiwan OSATs step up SiPh deployment
Taiwan-based OSATs, such as ASE Technology and Winstek Semiconductor, have stepped up their silicon photonics (SiPh) deployments and are evaluating its potential in furthering advanced...
Thursday 7 September 2023
TSMC expanding CoWoS packaging capacity
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
Friday 14 July 2023
Backend fab toolmakers see short lead-time orders from TSMC
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
Wednesday 14 June 2023
SPIL cuts into Marvell supply chain, sources say
Siliconware Precision Industries (SPIL) with its 2.5D and fan-out packaging technology has cut into the supply chain of network processor vendor Marvell, according to industry sour...
Monday 12 June 2023
TSMC on track to double CoWoS capacity for AI GPU/HPC chips
With its crucial CoWoS (chip on wafer on substrate) backend technology in high demand for AI GPU chips, TSMC's long-established "one-stop-shop" advantage for advanced chips manufacturing...
Monday 22 May 2023
ASE lands Broadcom orders for silicon photonics-based networking chips
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips...
Wednesday 3 May 2023
OSATs remain cautious about handset IC demand
OSATs remain cautious about handset IC demand despite the emergence of short lead-time orders, according to industry sources.
Tuesday 2 May 2023
OSATs see a delay in capacity demand from MediaTek
With unclear business outlook from Taiwan's mobile SoC vendor MediaTek, its backend partners including ASE Technology, Powertech Technology (PTI), Sigurd Microelectronics and King...
Tuesday 18 April 2023
3D fabric business pushes TSMC into top 3 largest OSATs
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
Friday 10 March 2023
OSAT ASEH to see revenue rebound
ASE Technology Holding (ASEH) is expected to see its revenue rebound substantially in March after reaching a low point in February, as the OSAT continues to offload "wafer bank" inventories...
Tuesday 14 February 2023
OSATs strive to reduce operating costs as orders slow
As fab utilization rates fall due to slowing customer orders, OSATs have implemented cost-cutting measures such as encouraging employees to take leave, according to industry source...
Wednesday 8 February 2023
IC test interface solution providers to start seeing HPC chip demand recovery in 2H23
High-performance computing (HPC) chip demand has been difficult for IC test interface solution vendors to predict, but they anticipate recovery could start in the second half of 20...
Wednesday 18 January 2023
SPIL starts operating new plant in central Taiwan
OSAT firm Siliconware Precision Industries (SPIL), wholly owned by ASE Technology Holding (ASEH), has kicked off operations at its new plant in Changhua, central Taiwan.
Dec 8, 10:41
ASUS Handheld Ultrasound LU700 series: lightweight, high resolution and long battery life solution for mobile healthcare
Friday 8 December 2023
Clientron garners the prestigious 2024 Taiwan Excellence Award for innovative Smart eCockpit of Electric Vehicle
Wednesday 6 December 2023
AIRA features CPU-powered face recognition to address market challenges
Tuesday 5 December 2023
PowerArena uncovers human factors causing production line bottlenecks, boosting productivity and quality
TSMC likely to win it all, with Samsung's 3nm reportedly losing several significant orders
Approximately 1,400 ASML equipment installed in China, limited application for advanced chip expected
Huawei's 5nm chip in L540 NB could be inventory made by TSMC before US ban
Global semiconductor market to rebound with 13% growth in 2024, says WSTS
Samsung and SK Hynix will both supply HBM3 for AWS Trainium 2
Huawei's NearLink wireless technology signals a decoupled connected world
Intel cuts off manufacturing in IDM2.0, TSMC is expected to benefit
Tesla's humanoid robot 'Optimus' debuts in Taiwan, showcasing AI advancements
ASML reportedly sees first big EUV equipment order cut from TSMC
US, Japanese, and Dutch semiconductor equipment export values to China dropped; more substantial strategies demanded by expert
Global top-5 notebook brands experience over 20% on-month shipment drop in October, says DIGITIMES Research
Global notebook shipments rise in 3Q23 but to slip in 4Q23, says DIGITIMES Research
Research Insight: order backlog, China demand to drive Infineon automotive segment in FY24
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