IDM & Fabless
Asia Supply Chain
Meet the Analysts
Products & Services
Colley & Friends
Biz Focus Home
Meet the Analysts
Supply Chain Summit
Market Cap 100
CONNECT WITH US
Strategize Confidently with Insights into Samsung
NEWS TAGGED 20NM
Monday 30 October 2023
Winbond upbeat about 2024 prospects
Winbond Electronics, a specialty DRAM and flash memory maker, has expressed optimism about its business and market prospects for next year, noting the resolution of the majority of...
Monday 7 August 2023
Winbond slowing output cut, to equip new plant in 4Q23
The 30–40% reduction in output at Winbond Electronics' wafer fab in Taichung (central Taiwan) has been reduced to less than 20%, and the memory chipmaker plans to begin installing...
Wednesday 22 February 2023
Macronix, Winbond gearing up for new product development and technology transitions
Macronix International and Winbond Electronics have both reduced output in response to the current decline in the memory chip market, but continue to make progress in new product...
Monday 26 September 2022
Winbond specialty DRAM cuts into largest e-bike supply chain in Europe
Taiwan's memory maker Windbond Electronics has cut into the supply chain of Europe's largest e-bike maker with its specialty DRAM, and is also actively developing sales of its flash...
Monday 14 February 2022
Winbond to boost 20nm chip output at new fab in southern Taiwan
Specialty DRAM and flash memory chipmaker Winbond Electronics expects to ramp up monthly output at its new 12-inch fab in Kaohsiung, southern Taiwan to 10,000 wafers by the fourth...
Tuesday 8 February 2022
Winbond to kick off construction of phase-2 facility at new plant
Specialty DRAM specialist Winbond Electronics plans to advance its second-phase facility construction at its new plant in Kaohsiung, southern Taiwan to ease tight capacity for specialty...
Tuesday 14 December 2021
CXMT to make 17nm DDR3 memory
China-based memory foundry ChangXin Memory Technologies (CXMT) is gearing up for its entry into the DDR3 memory market segment with its in-house developed 17nm process technology,...
Thursday 31 December 2020
Winbond expects new plant to come online in 2022
Winbond Electronics is constructing a new 12-inch wafer fab in Kaohsiung, southern Taiwan, which is scheduled to come online in the first half of 2022, according to the specialty...
Wednesday 18 November 2020
Wafer capacity by feature size shows strongest growth at sub-10nm
IC capacity for leading-edge (sub-10nm) processes is expected to grow and become the largest portion of monthly installed capacity across the industry beginning in 2024, according...
Monday 15 June 2020
Notebook demand remains robust, says Winbond chairman
Chip orders for notebooks are expected to stay robust until the end of the third quarter, according to Arthur Chiao, chairman for specialty DRAM and flash memory maker Winbond Elec...
Monday 10 February 2020
Winbond swings to loss in 4Q19
Winbond Electronics, a maker of specialty DRAM and flash memory, swung to its first quarterly loss in 27 quarters.
Monday 9 December 2019
Winbond slowing down new fab construction
Specialty DRAM and flash memory chipmaker Winbond Electronics is slowing down constructing and equipping its new 12-inch wafer plant in Kaohsiung, southern Taiwan, according to company...
Monday 28 October 2019
Winbond posts profit growth in 3Q19
Specialty DRAM and flash memory maker Winbond Electronics has announced net profit increased 27.9% sequentially to NT$591 million (US$19.3 million) in the third quarter of 2019. EPS...
Thursday 26 September 2019
TSMC leading-edge fab investments set stage for sale surge in 2H19
Taiwan Semiconductor Manufacturing Company's heavy investments in advanced wafer-fab technology are set to pay off significantly for the world's largest silicon foundry as it continues...
Friday 23 August 2019
Xilinx intros FPGA featuring 9 million system logic cells
Xilinx has announced the expansion of its 16nm Virtex UltraScale+ family to now include what the company claims is the world's largest FPGA, the Virtex UltraScale+ VU19P, with 35...
Thursday 2 June 2016
Friday 18 September 2015
Samsung 12Gb LPDDR4 DRAM
Friday 23 January 2015
Dec 8, 10:41
ASUS Handheld Ultrasound LU700 series: lightweight, high resolution and long battery life solution for mobile healthcare
Friday 8 December 2023
Clientron garners the prestigious 2024 Taiwan Excellence Award for innovative Smart eCockpit of Electric Vehicle
Wednesday 6 December 2023
AIRA features CPU-powered face recognition to address market challenges
Tuesday 5 December 2023
PowerArena uncovers human factors causing production line bottlenecks, boosting productivity and quality
TSMC likely to win it all, with Samsung's 3nm reportedly losing several significant orders
Approximately 1,400 ASML equipment installed in China, limited application for advanced chip expected
Huawei's 5nm chip in L540 NB could be inventory made by TSMC before US ban
Global semiconductor market to rebound with 13% growth in 2024, says WSTS
Samsung and SK Hynix will both supply HBM3 for AWS Trainium 2
Huawei's NearLink wireless technology signals a decoupled connected world
Intel cuts off manufacturing in IDM2.0, TSMC is expected to benefit
Tesla's humanoid robot 'Optimus' debuts in Taiwan, showcasing AI advancements
ASML reportedly sees first big EUV equipment order cut from TSMC
US, Japanese, and Dutch semiconductor equipment export values to China dropped; more substantial strategies demanded by expert
Global top-5 notebook brands experience over 20% on-month shipment drop in October, says DIGITIMES Research
Global notebook shipments rise in 3Q23 but to slip in 4Q23, says DIGITIMES Research
Research Insight: order backlog, China demand to drive Infineon automotive segment in FY24
Sorry, the page you are trying to open is available only for our paid subscribers.
to read more
New users, please