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NEWS TAGGED 20NM
Thursday 31 December 2020
Winbond expects new plant to come online in 2022
Winbond Electronics is constructing a new 12-inch wafer fab in Kaohsiung, southern Taiwan, which is scheduled to come online in the first half of 2022, according to the specialty...
Wednesday 18 November 2020
Wafer capacity by feature size shows strongest growth at sub-10nm
IC capacity for leading-edge (sub-10nm) processes is expected to grow and become the largest portion of monthly installed capacity across the industry beginning in 2024, according...
Monday 15 June 2020
Notebook demand remains robust, says Winbond chairman
Chip orders for notebooks are expected to stay robust until the end of the third quarter, according to Arthur Chiao, chairman for specialty DRAM and flash memory maker Winbond Elec...
Monday 10 February 2020
Winbond swings to loss in 4Q19
Winbond Electronics, a maker of specialty DRAM and flash memory, swung to its first quarterly loss in 27 quarters.
Monday 9 December 2019
Winbond slowing down new fab construction
Specialty DRAM and flash memory chipmaker Winbond Electronics is slowing down constructing and equipping its new 12-inch wafer plant in Kaohsiung, southern Taiwan, according to company...
Monday 28 October 2019
Winbond posts profit growth in 3Q19
Specialty DRAM and flash memory maker Winbond Electronics has announced net profit increased 27.9% sequentially to NT$591 million (US$19.3 million) in the third quarter of 2019. EPS...
Thursday 26 September 2019
TSMC leading-edge fab investments set stage for sale surge in 2H19
Taiwan Semiconductor Manufacturing Company's heavy investments in advanced wafer-fab technology are set to pay off significantly for the world's largest silicon foundry as it continues...
Friday 23 August 2019
Xilinx intros FPGA featuring 9 million system logic cells
Xilinx has announced the expansion of its 16nm Virtex UltraScale+ family to now include what the company claims is the world's largest FPGA, the Virtex UltraScale+ VU19P, with 35...
Tuesday 23 July 2019
Winbond on track to open new memory fab by 2021
Specialty DRAM and flash memory chipmaker Winbond Electronics on July 22 held a beam-raising ceremony for its new 12-inch wafer plant in Kaohsiung, southern Taiwan. The new facility...
Monday 17 June 2019
Winbond to open new fab in southern Taiwan by 2021
Winbond Electronics expects to start operating a new 12-inch wafer plant in Kaohsiung, southern Taiwan by 2021, when the DRAM and flash memory chipmaker has its in-house developed...
Tuesday 11 June 2019
China memory maker CXMT to roll out 8Gb LPDDR4 DRAM by end-2019
China-based DRAM maker ChangXin Memory Technologies (CXMT) is stepping up DRAM production deployments as it will kick off commercial runs of its production lines by the end of 2019...
Monday 15 October 2018
Advanced-node technology driving TSMC revenue per wafer, says IC Insights
The average revenue generated from processed wafers among the four biggest pure-play foundries - TSMC, Globalfoundries, UMC and SMIC - is expected to be US$1,138 in 2018 when expressed...
Wednesday 5 September 2018
Intel PSG expected to see rising demand for FPGA products
Intel's Programmable Solutions Group (PSG), a business sector focusing primarily on FPGA accelerator development, is expected to seeing rising sales with more adoption from datacenter...
Wednesday 18 July 2018
Nanya gross margin hits record 55% in 2Q18
DRAM chipmaker Nanya Technology saw its gross margin climb to a record-high 55% in the second quarter of 2018, when consolidated revenues also hit their highest quarterly level in...
Tuesday 12 June 2018
Winbond to break ground for new fab in southern Taiwan
DRAM and flash memory maker Winbond Electronics will start constructing a new fab in Kaohsiung, southern Taiwan in September followed by equipment move-in slated for 2020.