Bits + chips
TSMC to expand CoWoS capacity to fill increasing AI chip packaging orders
Josephine Lien, Taipei; Willis Ke, DIGITIMES

Taiwan Semiconductor Manufacturing Company (TSMC) is planning to carry out the first-ever expansion of its CoWoS (Chip on Wafer on Substrate) packaging and testing capacity to fill increasing orders from Nvidia and Google for AI chips, indicating that...

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