Covestro showcased a portfolio of engineering plastics and thermoplastic polyurethane materials at COMPUTEX 2026 aimed at supporting AI computing, embodied intelligence, and networking devices, executives said. The supplier presented applications spanning AI data centers, high-performance computing servers, semiconductor manufacturing, robotics, and consumer electronics to address rising performance and supply-chain demands.
The firm emphasized that the expanding global AI infrastructure market and hyperscale data center buildouts have driven demand for materials that combine flame-retardant properties, thermal management, and lightweight design. According to the Market Intelligence & Consulting Institute under Taiwan's Institute for Information Industry, Taiwan's semiconductor output value was expected to reach NT$7.1 trillion (US$226.2 billion) in 2026, up 24.4% year on year, supported by high-bandwidth memory, GPUs, and advanced packaging technologies.
For AI data centers and HPC servers, Covestro said polycarbonate formulations deliver flame-retardant properties, thermal performance, and reduced weight for power distribution, cooling systems, and IT hardware in high-density racks where power density has exceeded 100kW per rack in AI-optimized facilities. Upstream in semiconductor production, the company highlighted ultra-clean transparent polycarbonate for front-opening shipping boxes, citing low outgassing, high transparency, and anti-static options to protect wafers and improve dimensional stability and yield.
On embodied intelligence and robotics, Covestro presented rigid polycarbonate films for impact-resistant structural parts and high infrared transmittance for sensor housings, as well as flexible TPU films for tactile electronic skin and fingertip sleeves. The supplier described collaborations with robotics partners to apply high-performance materials in logistics robots, robot structural parts, joint protection systems and robot vacuum components, noting that sustainable TPU can enable lighter, easier-to-process parts such as brush covers and wheel sleeves.
In networking and satellite broadband equipment, Covestro said its polycarbonate solutions balance signal transmissivity with outdoor durability and thermal management, citing Makrolon TC for next-generation Wi-Fi routers to sustain signal transparency while controlling costs. The company also stressed that as these industries scale, buyers are prioritizing not only technical specifications but supply stability and local technical support capabilities.
Article edited by Jingyue Hsiao
