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TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead

, Hsinchu

May 8, 2026, 15:49 0

TSMC’s next-generation CoPoS advanced packaging development is drawing growing industry attention. Credit: DIGITIMES

TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to widen its lead over rivals in the AI semiconductor race. Industry sources...

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