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TSMC's CoPoS spurs industry shift as AI chip packaging hits glass ceiling

Flora Wang, Taipei; Sherri Wang, DIGITIMES Asia 0

Credit: DIGITIMES

The global supply of CoWoS, or Chip-on-Wafer-on-Substrate, is tightening as demand for high-performance computing chips in AI applications continues to surge. These chips are simultaneously growing larger, creating pressure for more efficient packaging...

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