Samsung Electronics has successfully developed its sixth-generation DRAM, known as 1c DRAM, built using a 10nm class process. The product has received internal Production Readiness Approval (PRA), signaling it has met key quality and performance benchmarks and is now in the final phase before mass production. The milestone brings Samsung one step closer to its goal of mass-producing HBM4, or fourth-generation high-bandwidth memory, in the second half of 2025.
According to reports from South Korean media outlets Money Today and ET News, the PRA clearance represents an important technical and strategic achievement. PRA status confirms that a product has cleared internal qualification processes and is ready for large-scale manufacturing.
Since Jun Young-Hyun took over as head of Samsung's Device Solutions (DS) division in 2023, the company has focused heavily on boosting its DRAM competitiveness. Samsung has implemented sweeping design improvements and introduced new materials and fabrication techniques — including dry photoresists — aimed at improving production yields.
Samsung previously unveiled its fifth-generation 1b DRAM in December 2022 and began mass production in May 2023. The development of the 1c DRAM just two years later represents a rapid generational leap and signals Samsung's intent to maintain a leadership edge in memory innovation.
The company now plans to gradually phase out older-generation DRAM in favor of the newly developed 1c chips, ramping up its share in production volume. Samsung is also reportedly in talks with key suppliers of materials, components, and equipment to finalize investment agreements for the 1c DRAM production line.
Samsung's 1c DRAM will serve as the technological foundation for its next-generation HBM4, targeted for mass production in the latter half of 2025. This is a critical battleground for high-performance computing and AI applications, where HBM memory plays a central role.
Rival SK Hynix, however, is building its HBM4 on the previous-generation 1b DRAM and has already begun shipping samples to customers as of March 2025. The race to commercialize HBM4 by late 2025 is heating up, and industry analysts view Samsung's decision to base its HBM4 on the more advanced 1c DRAM as a strategic move to regain market momentum.
Following its recent success in supplying AMD with 12-layer HBM3E chips, Samsung is now in advanced talks with NVIDIA over future supply agreements. The company is also in discussions with multiple customers for custom HBM4 solutions. Analysts expect HBM4 to begin contributing meaningfully to Samsung's revenue starting in 2026.
Article edited by Jack Wu
