These are the most-read DIGITIMES Asia stories from May 26 to June 1. Top highlights include Huawei's 5nm HarmonyOS PC as a milestone in China's chip self-sufficiency, Wolfspeed's looming bankruptcy threatening Renesas' US$2 billion SiC deal, China's EUV-free 5nm efforts, mounting export control risks, Samsung Electronics' delayed entry into Nvidia's HBM3E supply chain, and Malaysia's US$270 billion pivot to IC design and advanced packaging.
Huawei's 5nm HarmonyOS PC signals China's end-run around EUV blockade
Huawei has launched its first HarmonyOS PC powered by the 5nm Kirin X90, built using SMIC's N+2 node and JCET's 4nm packaging—a milestone in China's push for chip self-sufficiency. Though its 90–120 MTr/mm² transistor density trails TSMC's 5nm (~150 MTr/mm²), the chip showcases a viable EUV-free DUV-based approach.
Xiaomi's new 3nm XRring O1 SoC, made by TSMC and paired with a MediaTek modem, highlights a parallel front in China's chip race, as both Xiaomi and Huawei drive forward domestic semiconductor design under growing export restrictions.
Wolfspeed's collapse threatens SiC market: US$2B Renesas deal in jeopardy
Wolfspeed is reportedly nearing bankruptcy, raising alarms for clients like Japan's Renesas, which prepaid US$2 billion in a 10-year SiC wafer deal signed in 2023. A slowdown in EV demand and rising Chinese competition have weakened Wolfspeed's finances, prompting a May SEC filing citing "substantial doubt" over its viability.
Renesas, set to begin production with Wolfspeed wafers in 2025, now faces possible losses and supply chain instability. The situation also pressures Japanese peers like Rohm and Fuji Electric as China expands its SiC capabilities.
China's export chokehold rattles global buildouts, sparks sourcing rethink
China's stricter export controls on materials like gallium, graphite, and precision tools are disrupting factory setups abroad, especially in Southeast Asia. Since mid-2024, licensing rules have slowed shipments of Chinese-made machinery, used in up to 50% of some lines, driving a shift toward localized sourcing despite added cost and certification hurdles.
China's 5nm workaround: DUV tricks push limits as EUV blockade bites
Huawei and Lenovo have reignited debate over China's chip capabilities with AI devices powered by 5nm-class chips—Huawei's Kirin X90 and Lenovo's SS1101—both built without EUV tools. Huawei spotlighted the launch on CCTV, while Lenovo kept a low profile amid foreign IP sensitivities.
Using SMIC's N+1/N+2 nodes, both chips rely on DUV-based multi-patterning to approximate 5nm. But with lower yields, higher costs, and transistor densities trailing TSMC's 5nm, China's EUV-free workaround remains technically viable but economically limited.
Huawei builds China's Merck: Zhuhai Cornerstone to secure chipmaking materials
Founded in 2022, Huawei-backed Zhuhai Cornerstone aims to localize key chipmaking materials, like photoresists and CMP slurries, positioning itself against global players such as Merck and DuPont. Despite its addition to the US Entity List in late 2024, the firm retains support from Huawei and SASAC, with over 60% of its R&D team holding PhDs.
Malaysia bets on advanced chip design to power US$270B semiconductor ambition
Malaysia is shifting from chip assembly to IC design and packaging, targeting US$270 billion in exports by 2030. A key ARM partnership will train 10,000 engineers via its CSS platform. The Selangor IC Design Park hosts firms like Cortical Labs and Weeroc, while local players such as Skychip, StarFive, and Adorsys are gaining ground amid talent and scaling challenges.
Samsung edges toward Nvidia HBM3E approval, but SK Hynix remains dominant
Samsung may pass Nvidia's 12-layer HBM3E certification by late 2025, but SK Hynix, the first to mass-produce 8- and 12-layer HBM3E, remains the primary supplier for Nvidia's GB300/GB200 chips. Samsung has cleared single-die tests and is in full-package validation, but its role may stay limited. Micron, meanwhile, says it exceeded HBM3E shipment targets and aims to match its HBM and DRAM market share by late 2025.
Article edited by Jack Wu
