中文網
Taipei
Sat, Aug 20, 2022
07:48
partly cloudy
27°C
CONNECT WITH US

ASE, Unimicron to provide packaging, related substrates for new Apple M2 chip

Julian Ho, Taipei; Eifeh Strom, DIGITIMES Asia 0

Credit: Apple

Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors, along with Amkor Technology and Samsung Electro-Mechanics (Semco),...

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories
Global wafer foundry industry analysis and forecast, 2022
Global server shipment forecast and industry analysis, 2022