On August 15, Applied Materials held an earnings call, noting that Intel's planned reduction in capital expenditures is expected to have minimal impact on the company. Applied Materials...
Powertech Technology (PTI) is currently developing fan-out panel-level packaging (FOPLP) and seeking collaboration with fabless chip vendors, according to the Taiwan-based memory...
In March, China Resources announced the stunning news of acquiring SMIC's shares of JCET Group, a packaging and testing firm invested by China's National IC Industry Investment Fund...
China's state-owned capital has been fast expanding its investment in the country's semiconductor industry, taking control of major firms, according to industry sources.
Semiconductor packaging and testing company Siliconware Precision Industry Ltd. (SPIL) announced recently that it will invest MLR 6 billion (US$1.276 billion) to build a packaging...
