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REALTIME NEWS
TSMC's N-2 restrictions hand Samsung US advanced chip opening
Semiconductors
2min ago
China marks milestone in autonomous driving with first three L3 highway plates
Electric Vehicles
8min ago
Taiwan's AI Basic Act passed, but poses further questions about AI regulations
ICT
9min ago
Softstar rebrands as Star Fusion Group in major pivot toward chips and power tech beyond gaming
Semiconductors
12min ago
ByteDance advances AI phone partnerships to secure legal identity system for AI agents
Communications
13min ago
TSMC Nanjing in no danger of operation disruption, says branch head
Semiconductors
17min ago
Microsoft CEO reportedly expresses dissatisfaction with Copilot's AI integration with Gmail and Outlook
ICT
24min ago
Taiwan remains key AI and semiconductor hub in new digital economy era
ICT
30min ago
Taiwan cable maker rides US$3.7 billion grid overhaul wave with orders booked through 2028
ICT
35min ago
NEWS TAGGED PACKAGING AND TESTING
Wednesday 12 November 2025
ChipMOS returns to profit as memory demand rebounds; chairman sees strong 2026 ahead
Taiwan-based semiconductor tester and packager ChipMOS Technologies swung back to profit in the third quarter of 2025, buoyed by a sharp rebound in memory demand. Chairman Shih-Jye...
BIZ FOCUS
Dec 19, 08:00
DBS and Ant International expand payment network to 150 million merchants across 100 countries
Friday 19 December 2025
Upbit's $30M Hack Sparks New Questions About Custodial vs. Non-Custodial Wallets
Friday 19 December 2025
The Impact of Blockchain Upgrades on Bitcoin Trading and Market Trends
Thursday 18 December 2025
SK hynix First to Complete Intel Data Center Certification for 256GB DDR5 RDIMM
MOST-READ
7 DAYS NEWS
Why Jensen Huang spent Thanksgiving weekend in Taiwan
TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises
Samsung, SK Hynix set profit-first DRAM regime
TSMC expands CoWoS capacity with Nvidia booking over half for 2026-27
Samsung and SK Hynix align 2026 DRAM strategies
AI chips run too hot: Engineers race to reinvent cooling
Moore Threads challenges Nvidia as S5000 targets Hopper-class LLM training
Samsung's 'Wide Fold' sets up a 4:3 foldable showdown with Apple in 2026
Quantum reshapes cybersecurity as AI and industrial sectors deploy PQC
CHIPX eyes Malaysia for 8-inch GaN-on-SiC wafer fab
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