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NEWS TAGGED PACKAGING AND TESTING
Monday 19 February 2024
Backend house Lingsen sells Chinese subsidiary
Taiwan-based Lingsen Precision Industries, which specializes in power management IC, sensor, and memory module backend services, recently announced the sale of its subsidiary Ningbo...
Wednesday 31 January 2024
Backend house PTI gearing up for HBM chip production
Powertech Technology (PTI) will see its high-bandwidth memory (HBM) development project start contributing sales between the fourth quarter of 2024 and the first quarter of 2025,...
Friday 19 January 2024
Backend houses bullish about advanced packaging demand
Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.
Thursday 18 January 2024
IC backend houses expect demand to revive in 2H24
IC backend houses anticipate a resurgence in demand during the latter part of 2024 after a disappointing 2023.
Tuesday 16 January 2024
Semiconductors opportunities in emerging markets
India is bound to be a strategic partner for the United States in terms of demographics, domestic market, software talents, and national strategy.
Tuesday 16 January 2024
Backend firm Micro Silicon upbeat on demand for AI device apps
Micro Silicon Electronics, a power IC backend specialist, is optimistic regarding the long-term demand for AI device applications.
Wednesday 3 January 2024
IC backend firms put focus on AI chips, CPO
Semiconductor demand is improving gradually, with IC packaging and testing houses expressing optimism about market prospects for 2024 and focusing on AI chips and Co-Packaged Optics...
Friday 29 December 2023
Everlight expects compound semiconductor packaging and testing, automotive businesses to grow in 2024
Everlight Electronics expects its compound semiconductor packaging and testing business to enjoy robust growth in 2024, according to the LED packaging house. It expects related orders...
Thursday 28 December 2023
IC packaging material distributors expect brisk orders in 2024
As a result of the high demand for advanced packaging materials in 2024, IC packaging material distributors such as Chang Wah Technology (CWTC), Niching Industrial, Topco Scientific,...
Friday 22 December 2023
More Chinese device assemblers, IC design firms enter backend
Many Chinese device assemblers and IC design houses are investing in the backend sector or building their own packaging and testing lines, indicating a trend toward vertical integration,...
Thursday 21 December 2023
ASEH on track to grow in 2024, driven by advanced packaging
OSAT ASE Technology Holdings (ASEH) is on track to increase sales in 2024 as a result of strong demand for advanced packaging and a recovery in demand from consumer device applications,...
Tuesday 19 December 2023
Strong high-end packaging demand to buoy Winstek in 2024
Taiwan-based IC backend firms, including Winstek Semiconductor (formerly STATS ChipPAC Taiwan), are positioning themselves to take advantage of robust demand for high-end packaging...
Friday 8 December 2023
Chip market to gain momentum in 2H24
Inventory restocking is anticipated to increase capacity utilization within the semiconductor supply chain starting in the latter half of 2024, according to market observers.
Wednesday 6 December 2023
Niching expects vapor chamber sales to climb over 50% in 2024
Niching Industrial, which sells IC packaging materials, anticipates vapor chamber sales will grow over 50% year on year in 2024. Increasing sales of vapor chambers is part of the...
Thursday 30 November 2023
IC backend houses see promising chiplet demand
Despite short-term headwinds, IC backend companies are generally positive about long-term demand for chiplet devices.
Veeam Software
Summary of Tech Supply Chain News!
China's smartphone shipments threaten 20% slide in 1Q24 says DIGITIMES Research
AP shipments to Chinese smartphone brands unpleasant in 4Q23, but to stay flat in 1Q24, says DIGITIMES Research
Software is key to AI PC's success, says DIGITIMES Research