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NEWS TAGGED IC PACKAGING
Friday 5 August 2022
ASE Technology steps up deployment in automotive electronics
Taiwan-based OSAT ASE Technology and its EMS subsidiary Universal Scientific Industrial (USI) are eyeing a bigger presence in the automotive electronics field this year, according...
Wednesday 3 August 2022
Niching to post record 2022 profit
Niching Industrial, which distributes IC packaging materials, is expected to see its profits hit a record high in 2022 despite falling demand for display driver ICs, according to...
Wednesday 3 August 2022
OSATs cutting prices for conventional ICs
China-based outsourced semiconductor assembly and testing (OSAT) vendors and second-tier Taiwan-based backend houses are cutting their prices for conventional ICs to vie for more...
Tuesday 2 August 2022
OSATs see little drive from Chips Act for building US operations
Taiwan's OSATs may not move to set up plants in the US though the US Congress has approved the Chips and Science Act 2022, and instead will carry out capacity expansions at their...
Thursday 28 July 2022
PTI expects flat performance in 3Q22
Powertech Technology (PTI) will be striving to keep its third-quarter revenue about on par with the second-quarter level amid volatile market conditions, according to the memory and...
Friday 22 July 2022
Taiwan backend firms gearing up for next-gen HPC processors
Taiwan-based backend houses including flip chip (FC) packaging, high-end testing, and IC test interface specialists are gearing up production for upcoming high-performance computing...
Wednesday 20 July 2022
CWTC sees QFP leadframe order visibility extended
Chang Wah Technology (CWTC) has seen the visibility of QFP (quad flat package) leadframe orders extended, buoyed by strong demand for automotive, industrial and network communication...
Friday 15 July 2022
Advanced packaging demand remains brisk
Taiwan-based OSATs including ASE Technology and Powertech Technology (PTI) continue to see their midrange and high-end IC packaging manufacturing capacity utilization rates stay at...
Thursday 14 July 2022
Niching expects DDI demand to bottom out in 3Q22
Niching Industrial, a supplier for display driver IC packaging materials, expects related DDI demand to bottom out in the third quarter and likely start picking up in the fourth.
Friday 8 July 2022
Leadframe supply for automotive IC packaging remains tight
Leadframe suppliers including Chang Wah Technology (CWTC), Jih Lin Technology and Shuen Der Industry (SDI) continue to see their supply for automotive IC packaging fall short of demand,...
Tuesday 5 July 2022
Backend firms see brisk order visibility for automotive chips
Backend packaging and testing houses continue to see stable growth in orders for automotive chips despite weakness in orders for consumer electronics chips, according to industry...
Monday 4 July 2022
Consumer IC packaging demand unlikely to rebound till 1Q23
Packaging demand for consumer electronics ICs including commodity MCUs, MOSFETs, lower-end logic ICs and power management ICs (PMICs) has contracted significantly amid lackluster...
Monday 27 June 2022
Chipmakers focus on heat dissipation in manufacturing process upgrades
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
Monday 27 June 2022
TSMC completes cleanroom construction at R&D center in Japan
An opening ceremony has been held recently at TSMC's 3DIC R&D center in Japan to mark the completion of cleanroom construction at the facility, according to the Taiwan-based fo...