Thursday 30 November 2023
IC backend houses see promising chiplet demand
Despite short-term headwinds, IC backend companies are generally positive about long-term demand for chiplet devices.
Thursday 16 November 2023
Semiconductor materials distributor Topco expands global market footprint
Semiconductor materials distributor Topco Scientific has followed in the footsteps of its foundry partners by establishing operations overseas, according to Jeffery Pan, chairman...
Wednesday 15 November 2023
IC packaging material distributors see demand pick up
Chang Wah Technology (CWTC), Niching Industrial, Topco Scientific, and Wahlee Industrial, among others, have observed an increase in demand for IC packaging materials and are generally...
Tuesday 31 October 2023
JCET sees growth accelerate in 3Q23
China's JCET Group, a provider of IC backend manufacturing and technology services, reported revenue climbed 30.8% sequentially to CNY8.26 billion (US$1.13 billion).
Wednesday 25 October 2023
Faraday expects 4-6% revenue drop in 4Q23
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.
Tuesday 26 September 2023
Niching sees clear order visibility for heat sinks
Niching Industrial, a distributor of IC packaging materials, sees clear order visibility for heat sinks thanks to brisk demand for midrange and high-end logic IC packaging.
Tuesday 19 September 2023
Packaging material distributors see stable demand for automotive, advanced packaging
Semiconductor material distributors, such as Niching Industrial, Chang Wah Technology (CWTC), Topco Scientific, and Wahlee Industrial, continue to observe relatively stable demand...
Friday 15 September 2023
IC leadframe suppliers brace for profit decrease in 2023
IC packaging leadframe suppliers are bracing for on-year profit decreases in 2023, as demand for automotive chips cannot offset the impact of diminishing consumer chip demand, according...
Tuesday 12 September 2023
Samsung, SK Hynix to catch up with TSMC in IC packaging with government help
According to Korean media Money S, the South Korean government and major semiconductor firms have signed a "Semiconductor Advanced Packaging Technology Cooperation Development...
Monday 11 September 2023
3D chiplets to steer the next advanced packaging trend
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Friday 8 September 2023
IC packaging material suppliers to capitalize on CoWoS surge
Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources.
Thursday 31 August 2023
Topco Scientific expands product offerings to CoWoS and 3D IC
Topco Scientific (TSC), a leading semiconductor material distributor, is expanding its advanced packaging material supply operations. In addition to silicon wafers and photoresist,...
Thursday 27 July 2023
IC lead frame demand for China-developed auto chips to pick up in 2024, says CWTC
Taiwan-based IC lead frame maker Chang Wah Technology (CWTC) expects to gain momentum for its automotive product segment in 2024, driven by major achievements in car chip developments...
Monday 10 July 2023
Harvatek expects LED packaging demand to stay weak in 2H23, but business to remain profitable for 2023
LED packaging house Harvatek is unlikely to see its revenue grow as strong as expected in the second half as its US-based clients were conservative about demand during the peak season,...
Thursday 29 June 2023
Niching sees clear demand visibility through end-2023
Niching Industrial, which distributes IC packaging materials, has seen a steady recovery in demand for display driver ICs (DDI) and a significant rise in demand for vapor chambers...
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