67 news items tagged Amkor
Qualcomm gearing up to cement capacity support from Taiwan partners
Monday 22 February 2021Qualcomm has been gearing up to seek multiple supply sources for both silicon-based and III-V semiconductors amid increasingly tight capacity at the global IC value chain, and reportedly...
ASE obtains FC packaging orders for new Qualcomm 5G SoC
Thursday 3 December 2020ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...
ASE quietly enhancing CIS backend capability
Monday 16 November 2020ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...
ASE reportedly joins Sony supply chain for automotive CIS
Monday 16 November 2020ASE Technology reportedly has become Sony's second backend partner for processing automotive CMOS imaging sensors (CIS), marking its return to the CIS packaging segment following...
Top foundries to maintain tight partnerships with OSATs, says Amkor executive
Monday 9 November 2020Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...
ASE, Win Semi cut into supply chain for new Qualcomm chips
Friday 6 November 2020Taiwan's backend houses ASE and affiliated Siliconware Precision Industries (SPIL) reportedly have landed orders for Qualcomm's Snapdragon X60 modem chips while GaAs foundry Win Semiconductors...
OSAT providers to enjoy impressive SiP sales growth in 2020
Wednesday 9 September 2020Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...
TSMC may move mature CoWoS tech to US fab, say sources
Monday 18 May 2020As TSMC plans to build a 5nm wafer fab in the US, how the company will handle backend support for the fab is drawing concerns from Taiwan's backend supply chain, and a possible solution...
AiP substrate shipments for mmWave 5G handsets may not take off in 2020
Thursday 16 April 2020It remains premature for Taiwan's IC substrate makers to expect AiP (antenna in package) substrate shipments for mmWave 5G smartphones to contribute positively to their revenues in...
USI may enter backend supply chain of AirPods Pro series
Friday 21 February 2020Taiwan-based Universal Scientific Industrial (USI), a unit of ASE Technology, is likely to obtain system-in-package (SiP) orders for AirPods Pro Lite, which may also benefit Taiwanese...
ASE Technology to secure backend orders for Qualcomm 5nm 5G modem chips
Thursday 20 February 2020Qualcomm has newly unveiled the world's first 5nm 5G modem-RF system, the Snapdragon X60, to be paired with its latest, third-generation 5G mmWave antenna module, QTM 535, with Taiwan's...
Chinese backend firm JCET enters supply chain of Samsung, LG
Thursday 26 December 2019China-based backend house Jiangsu Changjiang Electronics Technology (JCET), through its production subsidiary JCET STATS ChipPAC Korea (JSCK), has reportedly cut into the supply chain...
ASE to see strong 1Q20 with robust 5G mobile SoCs backend orders
Wednesday 11 December 2019Robust orders for 5G smartphone application processors from the world's major Android phone vendors will allow backend house ASE Technology Holding to enjoy a particularly strong...
Qualcomm intros new 5G SoC lineup
Thursday 5 December 2019Qualcomm has introduced its new Snapdragon 865 and 765 seies SoC chips designed for 5G-capable Android smartphones slated for launch in 2020. TSMC and Samsung Foundry reportedly are...
ASE provides SiP for TWS device SoC
Thursday 3 October 2019Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS)...
Yangtze Memory to ship 64-layer NAND chips for SSD
Wednesday 2 October 2019Yangtze Memory Technology (YMTC) is aggressively improving its 64-layer 3D NAND flash memory production yield rate, gearing up to ship the chips for SSD applications in the first...
MediaTek 5G SoC on track; Qualcomm faces 7nm EUV yield issues at Samsung, sources say
Tuesday 20 August 2019Unsatisfactory yield rates at Samsung's 7nm EUV process may affect production for the upcoming Qualcomm Snapdragon 7250 mobile SoC, but MediaTek's development of 5G chips, with support...
Amkor reportedly grabs orders for MediaTek 7nm SoC
Monday 5 August 2019MediaTek has placed backend orders with Amkor Technology for its new 7nm SoC designed for low-band (sub-6GHz) 5G handsets, according to industry sources.
Shennan Circuits expanding IC substrate market presence
Monday 10 June 2019China's Shennan Circuit has managed to generate profits from its IC substrate business, and has expanded its IC substrate offerings to include those for handset-use application processors...
China not necessarily top job destination for Taiwan IC packaging talent
Friday 2 November 2018China backend service providers such as Tongfu Microelectronics, Tianshui Huatian Technology, Jiangsu Changjiang Electronics Technology have been actively raiding talent from Taiwan's...
TSMC to set up new fab for advanced packaging
Tuesday 25 September 2018Taiwan's Environmental Protection Administration (EPA) has started its environmental impact assessment on land designated for construction of a new plant by Taiwan Semiconductor Manufacturing...
Amkor opens new plant in Taiwan for high-end IC backend
Tuesday 11 September 2018Amkor Technology has unveiled its new plant in Taiwan to focus mainly on high-end IC backend services, such as wafer-level and flip-chip packaging, and high-end chip probing.
Backend firm Amkor to expand capacity in Taiwan
Friday 7 September 2018Amkor Technology will soon start operating a new factory at its manufacturing site in Longtan, northern Taiwan for wafer-level packaging (WLP) and wafer test services. The arrival...
TSMC develops SiP technology
Friday 22 June 2018Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has been enhancing its IC packaging capability by developing system-level packaging technology.
China IC backend output value to exceed US$30 billion in 2018, says Digitimes Research
Friday 1 June 2018The output value of China's IC packaging and testing industry will exceed US$30 billion for the first time in 2018, according to Digitimes Research.