Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS)...

Yangtze Memory Technology (YMTC) is aggressively improving its 64-layer 3D NAND flash memory production yield rate, gearing up to ship the chips for SSD applications in the first...

Unsatisfactory yield rates at Samsung's 7nm EUV process may affect production for the upcoming Qualcomm Snapdragon 7250 mobile SoC, but MediaTek's development of 5G chips, with support...

MediaTek has placed backend orders with Amkor Technology for its new 7nm SoC designed for low-band (sub-6GHz) 5G handsets, according to industry sources.

China's Shennan Circuit has managed to generate profits from its IC substrate business, and has expanded its IC substrate offerings to include those for handset-use application processors...

China backend service providers such as Tongfu Microelectronics, Tianshui Huatian Technology, Jiangsu Changjiang Electronics Technology have been actively raiding talent from Taiwan's...

Taiwan's Environmental Protection Administration (EPA) has started its environmental impact assessment on land designated for construction of a new plant by Taiwan Semiconductor Manufacturing...

Amkor Technology has unveiled its new plant in Taiwan to focus mainly on high-end IC backend services, such as wafer-level and flip-chip packaging, and high-end chip probing.

Amkor Technology will soon start operating a new factory at its manufacturing site in Longtan, northern Taiwan for wafer-level packaging (WLP) and wafer test services. The arrival...

Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has been enhancing its IC packaging capability by developing system-level packaging technology.

The output value of China's IC packaging and testing industry will exceed US$30 billion for the first time in 2018, according to Digitimes Research.

Major China-based OSAT companies including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Tianshui Huatian Technology are all gearing up to compete...

The 22nd annual SEMICON Taiwan trade show has kicked off in Taipei, running from September 13-15, with this year's theme focusing on IoT, AI, smart manufacturing, smart transportation...

Amkor Technology and Nanium, a Portugal-based IC backend house specializing in wafer-level fan-out (WLFO) packaging solutions, have entered into a definitive agreement for Amkor to...

A proposed merger between Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) is still being reviewed by anti-trust authorities in China and the US...

Qualcomm has announced the opening of Qualcomm Communication Technologies (Shanghai), a semiconductor test facility in the Waigaoqiao (WGQ) free-trade zone in Shanghai, and its first...

China-based IC backend service company Nantong Fujitsu Microelectronics reportedly will acquire US-based Amkor Technology, according to a Chinese-language Economic Daily News...

Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology has announced it is ramping up a new MEMS and sensor packaging line...

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have agreed to merge through the formation of a parent holding company, which would allow both...

Advanced Semiconductor Engineering (ASE), already a provider of SiP (system-in-package) modules for the first-generation Apple Watch, has reportedly grabbed the majority of SiP module...

Packaging and testing company Amkor Technology has announced net profits of US$28 million, or US$0.12 per share, on revenues of US$734 million for the third quarter ended September...

The IC packaging and testing sector will continue its trend toward consolidation, and Amkor Technology is positive about such development, according to Mike Liang, president of Amkor...

Plans by Advanced Semiconductor Engineering (ASE) to buy up to 25% of Siliconware Precision Industries (SPIL) for an amount likely exceeding NT$30 billion (US$919 million) may be...

Demand for 3D IC parts may not begin to take off until three years due to concerns of high production costs, according to Mike Liang, president of Amkor Technology Taiwan.

Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor, with the remaining 20% will be taken...