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NEWS TAGGED AMKOR
Tuesday 7 July 2026
TSMC's AI bottleneck spills demand across the semiconductor supply chain

Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity...

Monday 6 July 2026
LG Chem begins first mass supply of semiconductor strippers to Amkor

LG Chem has begun supplying semiconductor strippers to Amkor Technology, a major US-based packaging and testing provider, in its first...

Monday 6 July 2026
South Korea's chip hub push, led by Samsung, SK, draws KRW896 trillion — and a market selloff

SK Group, Samsung Electronics, and Amkor will invest a combined KRW896 trillion (US$585.2 billion) to build South Korea's second major...

Wednesday 1 July 2026
South Korea's southwest chip hub grows from memory fabs into full semiconductor and AI ecosystem
South Korea's government laid out a detailed plan on June 30 for building its southwest region into a major new semiconductor production base, with SK, Samsung Electronics and Amkor...
Thursday 25 June 2026
TSMC-Amkor alliance jolts packaging map as ASE races to expand
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...
Thursday 11 June 2026
Amkor Korea weighs KRW1 trillion Gwangju expansion amid reported TSMC order growth

Amkor Technology Korea is considering investing about KRW1 trillion (approx. US$650 million) to expand its chip packaging and testing...

Friday 22 May 2026
Amkor expands Arizona semiconductor packaging campus with additional 67 acres

Amkor Technology today reaffirmed its commitment to strengthening advanced semiconductor packaging and test capabilities in the US through...

Thursday 30 April 2026
Amkor advances data center CPU mass production amid manageable supply and cost risks
Amkor, the world's second-largest OSAT provider, recently held its earnings call where CEO Kevin Engel highlighted strong demand for AI and high-performance computing (HPC) chips driving...
Tuesday 28 April 2026
Amkor records strong 1Q26, advanced packaging expected to triple YoY
Amkor Technology is off to a record start in 2026. First-quarter revenue hit US$1.68 billion, up 27% from the prior year, driven by record performance in AI data center applications...
Tuesday 28 April 2026
US chip packaging capacity to hit 10% by 2032
The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing...
Tuesday 28 April 2026
Strong demand and advanced packaging execution drive Amkor's upbeat quarter
Amkor Technology reported a strong start to 2026, with management attributing the performance to robust demand across multiple end markets and continued execution in advanced packa...
Thursday 23 April 2026
TSMC to open Arizona packaging facility by 2029, signals caution on high-NA EUV
TSMC is accelerating its advanced packaging expansion in the US while maintaining a conservative stance on next-generation lithography, as the company balances cost pressures, AI-driven...
Thursday 9 April 2026
Geopolitics and AI is redrawing the global chip packaging landscape
The AI computing boom is reshaping where semiconductors get packaged. Geopolitical pressure and supply chain diversification are pushing capacity well beyond its traditional strongholds...
Friday 6 March 2026
Amkor eyes triple revenue growth in 2.5D and HDFO packaging for 2026
Semiconductor OSAT leader Amkor has announced plans to boost its capital expenditure budget for 2026 to US$2.5-3 billion, prioritizing expansion of advanced packaging capacities such...