Qualcomm has been gearing up to seek multiple supply sources for both silicon-based and III-V semiconductors amid increasingly tight capacity at the global IC value chain, and reportedly...

ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...

ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...

ASE Technology reportedly has become Sony's second backend partner for processing automotive CMOS imaging sensors (CIS), marking its return to the CIS packaging segment following...

Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...

Taiwan's backend houses ASE and affiliated Siliconware Precision Industries (SPIL) reportedly have landed orders for Qualcomm's Snapdragon X60 modem chips while GaAs foundry Win Semiconductors...

Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...

As TSMC plans to build a 5nm wafer fab in the US, how the company will handle backend support for the fab is drawing concerns from Taiwan's backend supply chain, and a possible solution...

It remains premature for Taiwan's IC substrate makers to expect AiP (antenna in package) substrate shipments for mmWave 5G smartphones to contribute positively to their revenues in...

Taiwan-based Universal Scientific Industrial (USI), a unit of ASE Technology, is likely to obtain system-in-package (SiP) orders for AirPods Pro Lite, which may also benefit Taiwanese...

Qualcomm has newly unveiled the world's first 5nm 5G modem-RF system, the Snapdragon X60, to be paired with its latest, third-generation 5G mmWave antenna module, QTM 535, with Taiwan's...

China-based backend house Jiangsu Changjiang Electronics Technology (JCET), through its production subsidiary JCET STATS ChipPAC Korea (JSCK), has reportedly cut into the supply chain...

Robust orders for 5G smartphone application processors from the world's major Android phone vendors will allow backend house ASE Technology Holding to enjoy a particularly strong...

Qualcomm has introduced its new Snapdragon 865 and 765 seies SoC chips designed for 5G-capable Android smartphones slated for launch in 2020. TSMC and Samsung Foundry reportedly are...

Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS)...

Yangtze Memory Technology (YMTC) is aggressively improving its 64-layer 3D NAND flash memory production yield rate, gearing up to ship the chips for SSD applications in the first...

Unsatisfactory yield rates at Samsung's 7nm EUV process may affect production for the upcoming Qualcomm Snapdragon 7250 mobile SoC, but MediaTek's development of 5G chips, with support...

MediaTek has placed backend orders with Amkor Technology for its new 7nm SoC designed for low-band (sub-6GHz) 5G handsets, according to industry sources.

China's Shennan Circuit has managed to generate profits from its IC substrate business, and has expanded its IC substrate offerings to include those for handset-use application processors...

China backend service providers such as Tongfu Microelectronics, Tianshui Huatian Technology, Jiangsu Changjiang Electronics Technology have been actively raiding talent from Taiwan's...

Taiwan's Environmental Protection Administration (EPA) has started its environmental impact assessment on land designated for construction of a new plant by Taiwan Semiconductor Manufacturing...

Amkor Technology has unveiled its new plant in Taiwan to focus mainly on high-end IC backend services, such as wafer-level and flip-chip packaging, and high-end chip probing.

Amkor Technology will soon start operating a new factory at its manufacturing site in Longtan, northern Taiwan for wafer-level packaging (WLP) and wafer test services. The arrival...

Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has been enhancing its IC packaging capability by developing system-level packaging technology.

The output value of China's IC packaging and testing industry will exceed US$30 billion for the first time in 2018, according to Digitimes Research.