Friday 8 September 2023
IC packaging material suppliers to capitalize on CoWoS surge
Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources.
Thursday 7 September 2023
TSMC expanding CoWoS packaging capacity
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
Thursday 24 August 2023
Chinese OSATs cut prices further
Chinese OSATs with support from government subsidies have reduced their prices further in an effort to secure more orders, whereas first-tier semiconductor backend services providers...
Monday 14 August 2023
Re-exploring Samsung's advanced packaging strategy through the Amkor acquisition rumors
The AI trend is now a worldwide phenomenon, with Nvidia CEO Jensen Huang even declaring that "Nvidia is betting everything on AI." In 2023, the AI server supply chain became one of...
Thursday 10 August 2023
Amkor ramping up advanced packaging production capacity
Amkor Technology is ramping up its capacity for advanced packaging production, with monthly output for 2.5D packaging expected to reach 5,000 wafers in the first half of 2024, up...
Friday 4 August 2023
South Korea initiates major R&D project to boost chips packaging competitiveness
Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed...
Monday 31 July 2023
TSMC reportedly invited to set up CoWoS packaging capacity in US, Japan
In light of the severe shortage of CoWoS (chip-on-wafer-on-substrate) packaging capacity for AI GPUs now in hot demand, the US and Japan reportedly are aggressively re-inviting TSMC...
Friday 14 July 2023
Backend fab toolmakers see short lead-time orders from TSMC
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
Tuesday 27 June 2023
Nvidia rumored to secretly aid Amkor to support AI advanced packaging
Nvidia CEO Jensen Huang's exclamation of the arrival of "AI's iPhone moment" sparked an explosive demand for AI HPC (high-performance computing) chips. For 2.5D advanced packaging...
Tuesday 25 April 2023
ASEH, Amkor expanding production outside of China and Taiwan
ASE Technology (ASEH) and Amkor Technology, the world's top two OSATs, have both expanded production outside of China and Taiwan, according to industry sources.
Tuesday 14 March 2023
ASEH, Amkor reportedly eyeing orders for 5G modem from Apple
Apple will reportedly have its own 5G modem chip, with OSATs such as the ASE Technology Holding (ASEH) and Amkor Technology competing for orders, according to market sources.
Monday 6 March 2023
Major OSATs gearing up for automotive mmWave radar solutions
Automotive mmWave radars are widely believed to become important supporting components for future vehicles. Major OSATs including China's JCET, Taiwan's ASE Technology, and US-based...
Monday 20 February 2023
Amkor, GF team up for at-scale IC backend services in Europe
Amkor Technology and GlobalFoundries (GF) have formed a strategic partnership that will enable a comprehensive EU/US supply chain from semiconductor wafer production at GF to OSAT...
Tuesday 14 February 2023
OSATs strive to reduce operating costs as orders slow
As fab utilization rates fall due to slowing customer orders, OSATs have implemented cost-cutting measures such as encouraging employees to take leave, according to industry source...
Monday 13 February 2023
Amkor reportedly to close Shanghai plant for 1 week to cut costs
A slowdown in customer orders has forced all staff at OSAT Amkor Technology's production site in Shanghai, estimated at about 5,000 people, to take vacation for about a week, according...
2023 Supply Chain Summit
Global server shipment forecast and industry analysis, 2022
China smartphone AP shipments rise sequentially in 2Q23 and 3Q23, says DIGITIMES Research
Global high-end AI server shipments to soar in 2023, says DIGITIMES Research
In light of Huawei's 5G smartphone launch, US could pose even stricter sanctions, said DIGITIMES Research