The CHIPS and Science Act has unlocked tens of billions in federal subsidies to reshore semiconductor manufacturing in the US. Yet, major projects by leading chipmakers are being...
Taiwan's ASE Technology Holdings and US-based Amkor Technology maintain their positions atop the global outsourced semiconductor assembly and test (OSAT) market, though both face...
CT Semiconductor has begun the second phase of its chip packaging and testing plant in Vietnam, targeting 100 million chips annually by 2027. As the country's first fully locally...
Amkor Technology reported falling net sales for the first quarter, driven by weakness in its communications and automotive sectors. The company said its expansion plans in Arizona...
Amkor Technology, a prominent American semiconductor packaging and testing company, is expanding its footprint in South Korea. According to South Korean media reports, Amkor is investing...
Amkor Technology reported lower-than-expected sales for the fourth quarter of 2024 and projects weaker first-quarter 2025 results, with analysts attributing the downturn to softening...
US-based IC backend house Amkor Technology is advancing its US$1.6 billion factory in Bac Ninh, Vietnam. However, it expects much fewer employees to be required for the facility inaugurated...
Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators,...
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...
TSMC's Fab 21 in Arizona has not yet fully commenced its first phase of mass production, but it is already producing Apple's A16 chip. Additionally, AMD may become the second major...
Amkor, a major US semiconductor packaging and testing company, received a US$400 million subsidy under the CHIPS Act to build a new plant in late July and will collaborate with TSMC...
TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently announced a memorandum of understanding (MOU) with Amkor...
TSMC and Amkor Technology, the world's second-largest semiconductor packaging and testing firm, announced on October 4 the signing of a memorandum of understanding (MOU) to deliver...
