TSMC outsources part of CoWoS packaging production to OSATs

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Thursday 25 November 2021 0

TSMC is outsourcing more to IC packagers. Credit: DIGITIMES

TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor, particularly for low-volume customized products, according to...

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