TSMC may triple CoWoS material purchases for Nvidia new HPC chips

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia 0

Credit: AFP

Nvidia is set to launch new HPC GPU platforms for datacenter, AI and gaming applications in 2022, and its manufacturing partner TSMC reportedly is expected to triple order placements with suppliers of packaging substrates and thermal materials needed...

The article requires paid subscription. Subscribe Now