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Chipmakers working with partners to step up deployments in 5G RF devices

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Friday 17 September 2021 0

Credit: DIGITIMES

Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according to industry sources.

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