Xilinx and TSMC have jointly announced that they are teaming up to create FPGAs built using 16nm FinFET process technology.
Under the partnership, the pair will work together to co-optimize TSMC's FinFET process with Xilinx's UltraScale architecture. The program will deliver 16FinFET test chips later in 2013 and first products in 2014.
The two companies added they are also engaged in leveraging TSMC's CoWoS 3D IC manufacturing flow for the highest levels of 3D IC systems integration and system-level performance. Products from this collaboration will be announced at a later date.
TSMC recently announced that it is accelerating the production schedule of its 16FinFET process to 2013. "The Xilinx/TSMC collaboration will take full advantage of this accelerated schedule and the aggressive performance and power savings of TSMC's 16FinFET technology," the companies said in a statement.
Earlier in 2013, Altera and Intel announced that the pair had entered into an agreement for the future manufacture of Altera FPGAs on Intel's 14nm tri-gate transistor technology.
