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Altera, TSMC develop UBM-free WLCSP packaging

Press release; Jessie Shen, DIGITIMES Asia Tuesday 7 April 2015 0

Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the companies.

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