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Thursday 14 March 2024
Samsung is reportedly 'upgrading' its HBM development team
Samsung Electronics is reportedly pushing to establish an HBM development unit to increase Samsung's competitiveness in High-Bandwidth Memory (HBM). In other words, the recently formed...
Tuesday 20 February 2024
Samsung reportedly forms research team for SSD solutions in India
As NAND Flash demand is expected to recover in 2024, Samsung Electronics has reportedly established a dedicated R&D team for SSD in India to expand its presence and maintain leadership...
Monday 5 February 2024
Infineon and Honda ink MOU to form ADAS, power semiconductor dream team
German semiconductor manufacturer Infineon has announced plans to collaborate with Japanese automaker Honda.
Thursday 1 February 2024
Samsung's 3D DRAM R&D team sets foot in Silicon Valley
Samsung Electronics has set up a new memory research and development (R&D) organization to advance 3D DRAM technologies and secure competitiveness through technology differenti...
Wednesday 24 January 2024
Porotech and PSMC team up to produce 200mm GaN-on-Si microLEDs
Poro Technologies (Porotech) and Powerchip Semiconductor Manufacturing (PSMC) have formed a partnership to develop and manufacture 200mm GaN-on-Silicon MicroLEDs for display applic...
Tuesday 16 January 2024
Chinese research team successfully runs LLM using RTX 4090 instead of server-grade chips
Can high-end consumer-grade Nvidia graphics cards, such as the RTX 4090, handle Large Language Models (LLM) AI computing tasks? PowerInfer, an open-source framework developed by Shanghai...
Wednesday 10 January 2024
Corning, Tianma, GAC team up for automotive displays
US-based glass substrate maker Corning has partnered with Chinese panel manufacturer Tianma Microelectronics (Tianma) and the design division of automaker GAC to create flexible automotive...
Friday 5 January 2024
Samsung, and Hyundai team up for connected cars
Samsung Electronics has announced a partnership with Hyundai Motor Group, including Kia, to expand its SmartThings platform to enable connected vehicles, including electric vehicles...
Friday 29 December 2023
ASUS reveals innovative AI-powered LU800 Handheld Ultrasound, prize-winning smart healthcare team solution sets new benchmark for mobile health
Extending healthcare services from hospitals to homes and rural regions by providing patients with more accessible mobile healthcare is gradually becoming a key policy of governments...
Wednesday 20 December 2023
Winbond, PTI team up for 2.5/3D packaging
Winbond Electronics, a Taiwan-based memory chipmaker, has signed a letter of intent to collaborate with OSAT Powertech Technology (PTI) to jointly develop 2.5D and 3D advanced packaging,...
Friday 24 November 2023
Taiwanese startups team up to launch global indoor precision positioning management services
Oriongo Co., Ltd., a leading Taiwanese positioning algorithm provider, together with IoT pioneer Fashion Intelligence Co., Ltd. and Taiwan's one and only indoor map platform developer...
Tuesday 21 November 2023
TI may disband Chinese MCU R&D team
Recent industry speculations indicate that Texas Instruments (TI) may dissolve its MCU research and development team in China.
Monday 13 November 2023
Cloud gaming firm joins forces with Taiwan Llama Team to explore large language models (LLM)
Ubitus, a cloud gaming company, has joined forces with the Department of Computer Science and Information Engineering(CSIE) of the National Taiwan University (NTU) to incorporate...
Wednesday 1 November 2023
Naver, Intel team up to replace Nvidia GPUs with CPUs for AI inference
Naver, a well-known South Korean AI company, has reportedly teamed up with Intel to develop solutions that can replace Nvidia's AI accelerators, which are essential components for...
Monday 30 October 2023
Himax, Nexchip team up for automotive display
Himax Technologies has signed a memorandum of understanding (MoU) for collaboration with Nexchip Semiconductor, a Chinese semiconductor foundry, to supply ICs for the automotive display...
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