Huawei is reportedly working through its domestic supply chain to begin mass production of semiconductor glass substrates in 2027, with plans to adopt the technology in its own AI chips. Industry sources said that if the strategy proceeds successfully, leadership in global semiconductor glass-substrate technology could gradually shift towards China.
Mapping out the roadmap
According to South Korea's ETNews, citing industry sources, Huawei has drawn up a roadmap to begin mass production of semiconductor glass substrates in 2027. Partner manufacturers are expected to produce the substrates according to Huawei's technical requirements and supply them for advanced semiconductor products, including Huawei AI accelerators.
Huawei's reported partners include Chinese display makers BOE and Visionox, outsourced semiconductor assembly and test provider Sky Semiconductor, and PCB manufacturer AKM Meadville. Huawei and its partners are also said to be discussing glass-substrate cooperation with South Korean semiconductor materials, components and equipment suppliers.
Huawei is also said to be accelerating cooperation with major glass-substrate manufacturers and packaging companies to support adoption of the technology. Most companies in Huawei's supply chain are targeting mass production in 2027 and are upgrading their technology and production preparations accordingly.
Beating Korea to the punch
The industry had previously expected commercial products based on glass-substrate platforms to emerge around 2030. If Huawei remains on schedule, China could introduce related products as early as 2028.
By comparison, most South Korean semiconductor glass-substrate companies do not plan to begin mass production until after 2028, putting Huawei's timetable at least one year ahead.
A latecomer's differentiation play
Analysts said Huawei's effort to commercialise glass substrates is primarily intended to accelerate its expansion in the AI chip market.
The market is currently dominated by US companies including Nvidia. Given tensions between China and the US, Huawei faces difficulty entering the US market and is therefore targeting China and other niche markets. Analysts cited Huawei's plan to supply Ascend-series AI accelerator chips to South Korea and other global markets in the fourth quarter of 2026 as an example of this strategy.
Huawei remains a relative latecomer in AI chips and therefore needs a differentiated strategy to catch up with market leaders. Glass substrates are increasingly seen as a key element of that effort.
Betting on price and scale
Huawei aims to become an early adopter of glass substrates in AI chips, offering customers an alternative to competing products. It is also expected to emphasise price competitiveness and lower total cost of ownership for AI infrastructure.
Huawei's AI platforms using glass substrates could become highly competitive if Chinese suppliers lower prices with support such as government subsidies, industry sources said. A combination of next-generation technology and pricing advantages could eventually alter the competitive landscape of the AI chip market.
Article translated by Levi Li and edited by Jerry Chen
