Hanwha Semitech to supply FO-PLP equipment for SpaceX-linked chip production

Lillian Chen

, Taipei

Elaine Chen

, DIGITIMES Asia

May 13, 2026, 10:53 0

Credit: Hanwha Semitech

South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second half of 2026, with the systems expected to be used in the mass production...

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