Below are the most-read DIGITIMES Asia stories from June 30 to July 6, 2025. This week's highlights include Samsung's strategic licensing of Intel patents to avoid global IP battles, Intel's executive shakeup, and Apple edges closer to launching a foldable iPhone. Meanwhile, China's domestic AI chipmakers face steep uphill battles, while Taiwan's semiconductor ecosystem formed a new alliance backing TSMC's international expansion.
Samsung acquires rights to Intel semiconductor patents in strategic bid to avoid global IP disputes
Samsung Electronics has obtained a comprehensive license to a collection of semiconductor patents initially developed by Intel. Industry experts view this as a strategic move to protect against potential legal disputes while also enhancing Samsung's global technological edge.
From subsidies to subtraction: Lip-bu Tan rewrites Intel's revival playbook
The semiconductor industry seldom witnesses such a sharp divergence in leadership styles as that between Intel's former and current CEOs. Pat Gelsinger, who recently exited after an unsuccessful attempt to rejuvenate Intel, is now advising Japan's Rapidus on how to compete with TSMC. In contrast, his successor, Lip-Bu Tan, has moved swiftly in his interim role, initiating major layoffs within just three months of taking the helm.
Intel's CSO reportedly to leave today
Safroadu Yeboah-Amankwah, Intel's Chief Strategy Officer, will leave the company by June 30, according to two sources familiar with the situation who spoke to Reuters on condition of anonymity. His exit is among the recent leadership shifts following Lip-Bu Tan's appointment as CEO in March. Intel has confirmed his departure and thanked him for his service.
Apple starts early prototyping of foldable iPhone, eyes 2026 launch
Apple has discreetly begun early development on its much-anticipated foldable iPhone, with supply chain sources revealing that the company entered the initial P1 (Prototype 1) phase in June. If progress continues as planned, the device could finish prototype testing by late 2025 and move into the Engineering Verification Test (EVT) phase, potentially paving the way for a launch in the latter half of 2026.
China's AI chip companies struggle for survival as four key players hold less than 1% market share
Nvidia CEO Jensen Huang has repeatedly cautioned that the Trump administration could impose stricter US export controls, which may unintentionally enable Chinese AI chipmakers like Huawei to take over the domestic market. AI chips are generally categorized into training and inference segments, with Nvidia traditionally holding a strong lead in the more complex AI training chip market in China.
Huawei's semiconductor matriarch charges forward with dual front: chips and talent
In the context of rising US-China tech tensions, Huawei is accelerating its drive for technological independence following its addition to the US Entity List in 2019. He Tingbo, president of HiSilicon and a key architect of Huawei's semiconductor strategy, is taking on an even more influential role. She has been named head of Huawei's Senior Talent Compensation Division, giving her greater oversight of executive remuneration and talent cultivation—critical components of the company's long-term innovation strategy.
TSMC's global fab push sparks Taiwan to form 18-firm chip alliance
As the global semiconductor industry moves toward localized manufacturing, Taiwan's chipmaking sector is adopting a coordinated alliance approach to strengthen its footprint in the US, Europe, and Japan. With TSMC increasing its investments in fabrication facilities across these regions, a growing number of small and mid-sized Taiwanese equipment and materials suppliers are enhancing their collaboration to remain competitive and maintain global significance.
Article edited by Jack Wu
