MediaTek CEO Rick Tsai delivered a keynote speech at Computex 2025, revealing that MediaTek's first 2nm chip will officially be taped out in September 2025, signifying that the company's flagship product line will soon enter the 2nm generation. He also shared the latest developments on each of the four pillars mentioned in his 2024 keynote.
Nvidia CEO Jensen Huang joined Tsai on stage at the end of the keynote speech. In addition to talking about their new projects, Tsai gifted Huang fruit from Taipei's Tonghua Night Market to show the friendship and close partnership between the two.
Growth of the four pillars
Regarding developments related to the four pillars discussed in 2024, on the high-performance computing (HPC) side, Tsai pointed out that over the past year, MediaTek not only launched its flagship 5G agentic AI Dimensity 9400 series but also co-designed with Nvidia the GB10 superchip equipped in the Nvidia DGX Spark.
In terms of leading technologies required for AI accelerators, MediaTek has advanced 224G SerDes IP, advanced processes, and design capabilities for various CoWoS 2.5D and 3D advanced packaging, allowing it to provide excellent ASIC solutions.
As for wireless network technology, MediaTek has been leading the industry in the past year, completing the world's first successful trial of 5G-Advanced NR Non-Terrestrial Network (NTN) over low Earth orbit (LEO) satellites. It also has M90 5G-Advanced and 5G reduced capability (RedCap) modem solutions.
MediaTek maintains close working relationships with Nvidia, Taiwan Semiconductor Manufacturing Company (TSMC), Android, Arm, Synopsys, and Cadence Design Systems, among others.
Continued investment in the latest technologies
Looking ahead, MediaTek will continue investing in the latest technologies, gradually developing new computing and high-speed interconnect products using the 3nm and 2nm advanced processes and the A16 process. For SerDes technology, the company will move toward 448G, simultaneously exploring development opportunities related to optical communications. The goal for advanced packaging and memory is to provide 3.5D packaging and customized memory services.
Close partners: Nvidia and MediaTek
Although MediaTek is one of Nvidia's closest partners in the IC design industry, Tsai and Huang both acknowledged that they were initially unsure whether having each company provide part of the technology to form a system-on-chip (SoC) was feasible. However, MediaTek's flagship C-X1 automotive platform and Nvidia's GB10 superchip have delivered impressive results, proving that this collaborative model is viable, with both engineering teams very satisfied with the collaboration process. In the future, the companies will continue to deepen their partnership and explore more possibilities for new businesses.
It was also noted that MediaTek is among the first partners in the Nvidia NVLink Fusion ecosystem, which provides an added boost to its ASIC business.
However, the much-anticipated AI PC collaborative chip did not make an appearance during the speech. Following the keynotes from both Nvidia and MediaTek, when it will be announced remains unanswered.
Article edited by Jingyue Hsiao
