Semco accelerates glass substrate production, eyeing high demand in HPC and automotive applications

Jessica Tsai, Taipei; Willis Ke, DIGITIMES Asia 0

Credit: AFP

Samsung Electro-Mechanics (Semco) is reportedly expediting the development of its semiconductor packaging-use Glass Core Substrate (GCS) business by advancing the construction of a glass substrate trial production line by one quarter, aiming to stay...

The article requires paid subscription. Subscribe Now