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Intel’s EMIB gains traction as CoWoS alternative, reviving IC substrate investment

Flora Wang, Taipei Mar 6, 2026, 15:24 0

Credit: Intel

The global AI surge has sharply increased demand for advanced chips, leaving TSMC's CoWoS capacity in tight supply. Intel's advanced packaging strategy is set to reach a critical turning point in second half 2026, boosting confidence across its long-struggling...

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