Intel has chosen a location near Wrocaw, Poland, for a new semiconductor assembly and testing facility, according to the company. This facility will help the company satisfy a crucial assembly and testing capacity demand by 2027.
Intel anticipates an investment of up to US$4.6 billion in the expandable facility. When the facility is completed, it will house approximately 2,000 Intel employees. In addition to eventual employment by suppliers, it is anticipated that the construction of the facility will generate several thousand more jobs. Design and planning of the facility will commence immediately, with construction commencing pending approval from the European Commission.
Intel stated that its planned investment in Poland, combined with its existing wafer fabrication facility in Leixlip, Ireland, and its planned wafer fabrication facility in Magdeburg, Germany, will help create a first-of-its-kind end-to-end leading-edge semiconductor manufacturing value chain in Europe. In addition, it will serve as a catalyst for additional ecosystem investments and innovation in Poland and throughout the European Union.
"Poland is already home to Intel operations and is well positioned to work with Intel sites in Germany and Ireland," said Intel CEO Pat Gelsinger. "We're grateful for the support from Poland as we work to grow the local semiconductor ecosystem and contribute to the EU's goal of creating a more resilient and sustainable semiconductor supply chain."
According to Intel, the new facility will receive individual chips and assemble them into final products in addition to completed wafers. Wafers and chips from Intel, Intel Foundry Services, and other foundries will be accepted.