Bits + chips
IC substrate suppliers eyeing strong SiP demand for AirPods
Jay Liu, Taipei; Willis Ke, DIGITIMES

The market for system-in-package (SiP) substrates is already tight and will become tighter as Apple is looking to adopt SiP technology in more of its AirPods series, according to sources at Taiwan-based IC substrate suppliers.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Login to continue
  • Save my User ID and Password

    Save my User ID and Password

    Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

    Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

  • NEW users please register first.
Realtime news
Supply chain
Disconnected ICT Supply Chains: New Power Plays Unfolding
Research insights
  1. ICs play bigger role in Taiwan exports
  2. TIP helps Indonesian telecom carriers test Open RAN
  3. Arm-based server solutions to expand presence in edge computing market
Global LCD panel shipment forecast, 2021 and beyond
This website adheres to all nine of NewsGuard's standards of credibility and transparency.
© 2021 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.