Bits + chips
SiP+FPCB may be adopted for iPhone battery modules
Jay Liu, Taipei; Willis Ke, DIGITIMES

SiP (system in package) combined with flexible PCB may be gaining ground in the supply chain of Apple devices, as the vendor reportedly will adopt the combination for its 5G handset battery modules, replacing existing rigid-flex PCB solution it has...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.