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Home Tech Chips + Components

Suppliers gearing up for SiP demand boom

Monica Chen, Taipei; Willis Ke, DIGITIMES Wednesday 9 September 2020 0

TSMC, ASE Technology, IC substrate makers including Unimicron Technology as well as international materials and equipment suppliers are all gearing up for the SiP (system-in-package) boom fueled by Apple's growing adoption of the technology in its devices,...

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