Tsinghua Unigroup readies CNY370 billion for chip deployments in next 5 years, says chairman

Zhang Yuxin, Shenzhen; Willis Ke, DIGITIMES Asia 0

China's Tsinghua Unigroup has readied CNY370 billion (US$58.74 billion) to support its semiconductor deployments in the next five years, and plans to inject up to US$100 billion into chipset production in 10 years, according to Zhao Weiguo, chairman...

The article requires paid subscription. Subscribe Now