Chipbond Technology is ramping up testing capacity for advanced LCD driver ICs in response to rising demand for high-end smartphones and other mobile devices with higher resolution displays, according to Fei-Jain Wu, chairman of the Taiwan-based driver IC packaging and testing firm.
Wu reiterated Chipbond's plans to install additional equipment for advanced IC testing in the second quarter. The number of Chipbond's high-end IC testing machines will grow to 310 units at the end of the quarter from the previous 255, Wu said.
Meanwhile, its China-based production subsidiary Chipmore Technology will expand capacity for gold bumping and chip-on-film (COF) packaging services by more than 30% by the end of 2013, Wu indicated.
Chipmore generated revenues of about NT$2.32 billion (US$77.7 million) in 2012, with net profits increasing 27.5% on year to NT$566 million. Chipmore's monthly capacity currently stands at 35-40 million units for COF packaging, and 30,000-40,000 wafers for bumping.
Chipbond previously revised upward the company's capex budget for 2013 to NT$1.5 billion from the originally-set NT$1 billion.
Article translated by Jessie Shen
