251 news items tagged Chipbond
Tape COF substrate demand picking up
Friday 19 February 2021Taiwan-based Chipbond Technology and JMC Electronics have both seen orders for tape COF substrates pick up substantially, reflecting limited capacity supply for such substrates and...
Backend houses to thrive on strong demand for 5G, Wi-Fi 6 chips in 2021
Wednesday 17 February 2021Taiwan's IC backend supply chain players are poised to embrace another robust year in 2021 driven by strong demand for 5G and Wi-Fi 6 applications, after logging full capacity utilization...
Chipbond, ChipMOS to enjoy strong 1H21
Tuesday 9 February 2021Display driver IC backend specialists Chipbond Technology and ChipMOS Technologies are both poised to enjoy a strong first half of 2021, driven by continued strong demand for small-size...
DDI backend houses to further raise quotes later in 1Q21
Tuesday 2 February 2021Display driver IC (DDI) backend specialists including Chipbond Technology and ChipMOS Technologies plan to enforce a second wave of price hikes in late February or early March to...
Lead times extend for wirebonding packaging equipment
Tuesday 19 January 2021Delivery lead times for wirebonding packaging equipment have extended to over six months, according to industry sources in Taiwan.
Equipment makers eyeing strong demand from Taiwan OSAT firms
Tuesday 12 January 2021As Taiwan's OSAT output value is estimated to hit another record high in 2021, domestic equipment and materials suppliers are poised to embrace robust demand from the sector, according...
IC foundries, designers strengthening tie-up with backend houses
Monday 11 January 2021With demand for diverse chips solutions continuing to grow robustly, Taiwan's foundry houses, IC designers and even EMS providers are all strengthening tie-up with backend houses...
OSE seeking logic chips backend orders after allying with Chipbond
Thursday 7 January 2021Orient Semiconductor Electronics (OSE), which has struck a long-term strategic alliance with Chipbond Technology, is expected to soon land new logic chips packaging orders from Taiwan's...
Delivery lead time for cantilever probe cards extends
Wednesday 30 December 2020IC test interface suppliers have seen delivery lead times for cantilever probe cards extended to 2-3 months from 3-4 weeks, due to strong demand for display driver ICs for handsets...
Taiwan OSAT firms see clear order visibility through mid-2021
Tuesday 22 December 2020Taiwan-based OSAT services providers have seen clear order visibility through mid-2021, thanks to robust demand for 5G and Wi-Fi chips, power management ICs (PMIC), and display driver...
Taiwan OSAT firms to see output value break US$20 billion in 2021, says Digitimes Research
Monday 21 December 2020The combined output value of Taiwan's OSAT firms is estimated to grow by over 15% to US$18.5 billion in 2020 and to US$20 billion in 2021, according to Digitimes Research.
Backend firms see strong demand for DDI, NAND controller chips
Wednesday 16 December 2020Taiwan-based backend houses have seen strong demand for display driver ICs and NAND flash controller chips, with clear order visibility through the second quarter of 2021, according...
Taiwan backend houses see orders boom
Monday 7 December 2020Taiwan backend houses will continue to embrace orders shifted by chipmakers from Chinese peers, as "risk control" has become a major concern among global chipmakers now that the US...
Chipbond to expand backend capacity for RF, PA devices, driver ICs
Friday 4 December 2020Taiwan's backend house Chipbond Technology has disclosed plans to build additional testing capacity to satisfy robust demand for display driver ICs, RF and PA components.
Novatek driver ICs cut into iPad supply chain, say sources
Monday 30 November 2020Novatek Microelectronics reportedly has signed a deal with Apple that will allow the Taiwan-based IC maker to begin shipping its LCD driver ICs for iPad devices in the second half...
ASE Technology to raise backend service quotes by 5-10% in 1Q21
Monday 23 November 2020Taiwan's top OSAT firm ASE Technology will hike backend service quotes by 5-10% starting first-quarter 2021 to reflect increased cost and tight capacity supply for some products,...
Driver IC backend firms see clear order visibility through 1H21
Tuesday 10 November 2020Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies have enjoyed a ramp-up in orders for handset-use TDDI chips, with clear order visibility...
Chipbond posts record October revenue
Monday 9 November 2020Taiwan-based Chipbond Technology, a backend house specializing in display driver ICs, saw its October revenue hit a record high for the third consecutive month.
Taiwan driver IC backend houses gaining from Samsung exit from LCD
Tuesday 27 October 2020Taiwan's driver IC backend firms have seen small-volume rush orders as a result of Samsung Electronics' gradual exit from the LCD panel market, according to industry sources said.
Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu
Monday 26 October 2020The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to reflect the tight...
Chipbond, OSE form alliance for flash, 5G RF modules packaging
Tuesday 20 October 2020Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic...
Tape COF substrate demand falling, likely to rebound in 1Q21
Friday 16 October 2020Tape COF substrate demand has been falling thanks partly to insufficient foundry support for LCD driver ICs, and may not pick up until the first quarter of 2021, prompting some makers...
ASE to post slight revenue growth in 4Q20, says report
Thursday 15 October 2020Backend house ASE Technology is expected to see its consolidated revenue consisting of sales generated by its core IC ATM (assembly, test and material) business and EMS subsidiary...
COF, COG packaging materials shipments ramping up
Tuesday 13 October 2020Taiwan's IC materials distributors including Niching Industrial have seen a significant surge in shipments of COF and COG packaging materials and thermal solutions since the third...
Driver IC backend service firms to raise some quotes starting October
Tuesday 29 September 2020Taiwan's top-two IC backend service firms for display driver ICs (DDI) - ChipMOS Technologies and Chipbond Technology - will raise their chip probing (CP) quotes for mid-tier to high-end...