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Intel announces backside power solution breakthrough
BBK reportedly restructures brands under Oppo in India to de-risk from regulatory scrutiny
NEWS TAGGED CHIPBOND
Thursday 1 June 2023
Chipbond puts growing focus on non-DDI products
Display driver IC (DDI) backend specialist Chipbond Technology has shifted its attention to non-DDI chips and devices such as RF components and power amplifiers, which will account...
Monday 10 April 2023
Taiwan-based OSATs see upstream orders increase in 2Q23
Taiwan-based driver IC OSATs such as ChipMOS Technologies and Chipbond Technology are seeing the monthly operating growth rate of chip and backend companies exceed 20%, according...
Tuesday 27 December 2022
Taiwan OSATs poised to slightly cut quotes for 2023
Taiwan's OSATs are expected to slightly cut packaging or testing quotes for 2023 to bolster their capacity utilization rates, with price ranges up for negotiation with clients to...
Thursday 3 November 2022
DDI backend firms see warehouses filled with 'wafer bank'
Display driver IC (DDI) backend specialists are finding their warehouses filled with "wafer bank" inventories from fabless chipmaker customers that are keeping their inventory at...
Tuesday 23 August 2022
Tape COF substrate makers conservative about 2H22 prospects
Taiwan's tape COF substrate suppliers JMC Electronics and Chipbond Technology are highly conservative about their business prospects for the second half of 2022 due mainly to sluggish...
Tuesday 12 July 2022
Backend firms see slowdown in orders for OLED DDI
Taiwan-based backend firms have seen capacity utilization rates for OLED display driver IC (DDI) testing slip recently, according to industry sources, noting that inventory adjustments...
Wednesday 22 June 2022
Second-tier OSATs see uncertainty in order visibility for 2H22
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Tuesday 14 June 2022
Tape COF substrates in sluggish demand for large-size DDIs
Sluggish sales of large-size panels and continuous uncertainties in TV terminal demand have continued to erode shipments of large-size display driver ICs (DDI), resulting in revenue...
Thursday 2 June 2022
Cutting DDI production orders not an easy deal: Q&A with Chipbond Technology chair Fei-Jain Wu
Taiwan-based Chipbond Technology, now holding the world's largest backend capacity for panel display driver ICs (DDI), continues to deepen cooperation with local OSAT Orient Semiconductor...
Friday 6 May 2022
Taiwan DDI backend firms remain optimistic about 2Q22
Taiwan-based display driver IC (DDI) backend specialists ChipMOS Technologies and Chipbond Technology remain upbeat about their business prospects in the second quarter of 2022, despite...
Tuesday 19 April 2022
OSATs say production remains normal in Suzhou amid semi-lockdown
Taiwan-based OSATs including ASE Technology have said their local manufacturing operations in Suzhou remain normal despite the city entering a COVID-induced semi-lockdown, but they...
Wednesday 6 April 2022
OSATs to face uphill battle to bolster capacity utilization in 2H22
Taiwan's OSATs will find it a major task for them to prevent their capacity utilization rates from falling in the second half of 2022 though they are poised to experience steady business...
Friday 1 April 2022
ChipMOS, Chipbond to boost OLED DDI testing capacity by 15%
Taiwan-based display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies plan to procure additional high-end testing equipment, mainly from Japan's...
Friday 18 March 2022
Backend demand for TV SoCs, large-size DDIs may rebound in 2H22
TV SoC and large-size display driver IC (DDI) packaging demand will have a chance to rebound in the second half of 2022, as the FIFA World Cup 2022 slated for November 21-December...
Thursday 20 January 2022
Chipbond, ChipMOS to raise backend quotes by 10-20% in 1Q22
Display driver IC (DDI) backend houses Chipbond Technology and ChipMOS Technologies both plan to raise their quotes by 10-20% later in the first quarter of 2022, according to industry...
Jun 2, 09:06
STMicroelectronics introduces automotive inertial module with certified ASIL B software library for a broad range of automotive applications
Friday 2 June 2023
First AI-enhanced smart accelerometers from STMicroelectronics raise performance and efficiency for always-aware applications
Thursday 1 June 2023
STMicroelectronics makes lithium batteries perform better and last longer with high-accuracy BMS controller
Thursday 1 June 2023
Computex 2023 opens with the world's best igniting the AI craze
Qualcomm sees 2024 a big year for its PC processor biz
Nvidia open to partnership with Intel, says CEO
China PMIC makers bearing the brunt as TI cuts price for market shares
Global foundry revenue to drop 9% in 2023, says DIGITIMES Research
Modi's US$24 billion manufacturing push is stuck on the assembly line
India's Vedanta to make 28-65nm semiconductor chips for local demand
Taiwan OSATs quietly ramp up support for Chinese customers
Who's in control of SMIC technology advances?
TSMC 7nm process capacity utilization falling rapidly
More ban on semiconductor equipment to China accelerating tech decoupling
China vendors see smartphone shipments down on year in 4Q22 and 1Q23, says DIGITIMES Research
DIGITIMES Research expects shipments of 2.5–3 million units for upcoming MacBook Air in 2023
China battery makers to enjoy boom in upcoming years thanks to energy-storage demand, says DIGITIMES Research
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