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NEWS TAGGED CHIPBOND
Friday 6 May 2022
Taiwan DDI backend firms remain optimistic about 2Q22
Taiwan-based display driver IC (DDI) backend specialists ChipMOS Technologies and Chipbond Technology remain upbeat about their business prospects in the second quarter of 2022, despite...
Tuesday 19 April 2022
OSATs say production remains normal in Suzhou amid semi-lockdown
Taiwan-based OSATs including ASE Technology have said their local manufacturing operations in Suzhou remain normal despite the city entering a COVID-induced semi-lockdown, but they...
Wednesday 6 April 2022
OSATs to face uphill battle to bolster capacity utilization in 2H22
Taiwan's OSATs will find it a major task for them to prevent their capacity utilization rates from falling in the second half of 2022 though they are poised to experience steady business...
Friday 1 April 2022
ChipMOS, Chipbond to boost OLED DDI testing capacity by 15%
Taiwan-based display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies plan to procure additional high-end testing equipment, mainly from Japan's...
Friday 18 March 2022
Backend demand for TV SoCs, large-size DDIs may rebound in 2H22
TV SoC and large-size display driver IC (DDI) packaging demand will have a chance to rebound in the second half of 2022, as the FIFA World Cup 2022 slated for November 21-December...
Thursday 20 January 2022
Chipbond, ChipMOS to raise backend quotes by 10-20% in 1Q22
Display driver IC (DDI) backend houses Chipbond Technology and ChipMOS Technologies both plan to raise their quotes by 10-20% later in the first quarter of 2022, according to industry...
Tuesday 11 January 2022
OLED DDI demand to boom for handset, automotive applications in 2022
OLED display drive IC (DDI) demand for handset and automotive applications is set to grow sharply in 2022 allowing DDI backend specialists ChipMos Technologies and Chipbond Technology...
Friday 24 December 2021
Taiwan backend houses step up deployments for 3rd-gen semiconductors
GEM Services and Lingsen Precision Industries, which specialize in power component and module backend services, and RF component and module packagers Tong Hsing Electronic Industries...
Tuesday 14 December 2021
Taiwan supply chain braces for booming 3rd-gen semiconductor applications
Applications of third-generation semiconductors including SiC and GaN diodes, MOSFETs and related modules are set to take off in 2022, and Taiwan's semiconductor supply chain players...
Tuesday 14 December 2021
IC designers zero in on peripheral chips for WBG semiconductor modules
Taiwanese IC design houses have gradually expanded their deployments in the segment of wide-bandgap (WBG) semiconductors, but will place R&D focus on peripheral driver ICs rather...
Thursday 9 December 2021
Chipbond, ChipMOS step up capacity expansion for testing OLED DDI chips
Taiwan-based display driver IC backend specialists Chipbond Technology and ChipMOS Technologies have both stepped up their purchases of high-end testing equipment to satisfy growing...
Tuesday 7 December 2021
Taiwan semiconductor players brace for GaN RF demand boom
With GaN-on-SiC RF components set to gain ground in 5G, satellite communications and national defense applications, Taiwan-based III-V semiconductor players including foundries Win...
Thursday 2 December 2021
DDI backend firms see demand for large-size panels pick up
Display driver IC (DDI) backend specialists including ChipMOS Technologies and Chipbond Technology have seen demand for large-size panels pick up since the fourth quarter of 2021,...
Tuesday 9 November 2021
ChipMOS sees high-end DDI testing capacity fully utilized
ChipMOS Technologies continues to see its high-end display driver IC (DDI) testing lines remain fully utilized, but expects to post flat growth in revenues from the DDI segment in...
Thursday 28 October 2021
Chipbond enjoys handsome profit
Display driver IC backend specialist Chipbond Technology saw its net profits reach NT$1.79 billion (US$64.2 million) in the third quarter of 2021, hitting the second-highest quarterly...