Taiwan's IC designers are mulling raising quotes for TV SoCs and driver ICs amid increasingly tight supply as Korean vendors gradually quit production of LCD panels and TVs as well...

Display driver IC backend specialist Chipbond Technology is constructing a new plant designed mainly for processing RF and PA components for use in 5G devices, which will significantly...

Demand for next-generation fingerprint, touch, display driver integrated (FTDDI) chip solutions is set to boom in 2021 thanks to their growing adoption in mid-range and entry-level...

Taiwan-based Chang Wah Electromaterials, a distributor of packaging materials and equipment, has announced plans to invest in COF packaging specialist Chipbond Technology seeking...

Taiwan's IC backend service suppliers are benefitting from Apple's recent release of its second-generation 4.7-inch iPhone SE, ramping up their capacity utilization rates and revenues...

Taiwan-based driver IC backend specialists have landed short lead-time orders for business notebooks and tablets that will be used mostly to support remote working and studying needs,...

The supply of 8-inch wafer fabrication services remains tight, due to robust demand for fingerprint-on-display (FoD) solutions, CMOS image sensors and power management ICs, according...

Taiwan-based handset display driver IC backend specialists have seen customer orders slow down, with poor order visibility for the next several months, but they expect demand to rebound...

Taiwan-based compound semiconductor components makers are gearing up to fulfill shipments of PA (power amplifier), RF (radio frequency) and VCSEl devices for a new iPhone model, tentatively...

Taiwan-based display driver IC designers and backend specialists are looking to ready additional capacities by mid-2020 to meet growing demand for OLED driver ICs, according to industry...

As shipments of midrange 5G smartphones are expected to expand significantly in 2020, the resultant strong demand for chipsets will be a major revenue growth driver for Taiwan's backend...

Backend demand for OLED driver ICs is set to take off in 2020, with COP (chip on plastic) and COF (chip on film) likely to co-exist as main packaging processes, according to industry...

Taiwan's COF (chip on film) supply chain is poised to embrace a prosperous year in 2020, as new COF solutions are expected to be massively applied to integrate optical in-display...

Taiwan's IC designers are set to ramp up shipments of diverse optical in-display fingerprint sensors for smartphone application starting in the first quarter of 2020, and backend...

Taiwan-based backend houses including KYEC and Chipbond expect to see stable growth in demand for baseband chips and LCD driver ICs for Apple iPhone.

COF substrate makers and related packaging houses are expected to operate at full capacity through the end of 2019 on robust demand from smartphone vendors, and their revenues may...

Apple has sent out invitations for a new product event on September 10 signaling that Taiwan's IC backend service firms are set to land related orders for new iPhones as expected...

As super-slim in-display optical fingerprint sensor chips will see increasing penetration in 5G smartphones, Taiwan's IC backend service firms including ASE Technology Holding, ChipMos...

Chip-on-film (COF) substrate supplier JMC Electronics has enjoyed robust demand for semi-additive tape COF packaging services, boasting clear order visibility through the first half...

LCD driver IC backend specialist Chipbond Technology has reported net profit surged 76.2% from a year earlier to NT$1.98 billion (US$63.2 million) in the first half of 2019. EPS for...

Taiwan-based IC backend supply chain players are optimistic about their performance prospects for the second half of 2019 in line with TSMC's positive outlook about demand for high-end...

Taiwan-based backend houses and COF substrate suppliers will see orders from Huawei pick up in July or August, according to industry sources.

Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...

Taiwan's handset TDDI IC supply chain for Huawei, including designers, backend COF service providers and substrate suppliers, have turned guardedly optimistic about their business...

Chipbond Technology will put on hold its 5G PA (power amplifier) packaging capacity expansion originally set to be enforced in the second half of 2019, due mainly to the uncertainties...