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NEWS TAGGED CHIPBOND
Thursday 1 June 2023
Chipbond puts growing focus on non-DDI products
Display driver IC (DDI) backend specialist Chipbond Technology has shifted its attention to non-DDI chips and devices such as RF components and power amplifiers, which will account...
Monday 10 April 2023
Taiwan-based OSATs see upstream orders increase in 2Q23
Taiwan-based driver IC OSATs such as ChipMOS Technologies and Chipbond Technology are seeing the monthly operating growth rate of chip and backend companies exceed 20%, according...
Tuesday 27 December 2022
Taiwan OSATs poised to slightly cut quotes for 2023
Taiwan's OSATs are expected to slightly cut packaging or testing quotes for 2023 to bolster their capacity utilization rates, with price ranges up for negotiation with clients to...
Thursday 3 November 2022
DDI backend firms see warehouses filled with 'wafer bank'
Display driver IC (DDI) backend specialists are finding their warehouses filled with "wafer bank" inventories from fabless chipmaker customers that are keeping their inventory at...
Tuesday 23 August 2022
Tape COF substrate makers conservative about 2H22 prospects
Taiwan's tape COF substrate suppliers JMC Electronics and Chipbond Technology are highly conservative about their business prospects for the second half of 2022 due mainly to sluggish...
Tuesday 12 July 2022
Backend firms see slowdown in orders for OLED DDI
Taiwan-based backend firms have seen capacity utilization rates for OLED display driver IC (DDI) testing slip recently, according to industry sources, noting that inventory adjustments...
Wednesday 22 June 2022
Second-tier OSATs see uncertainty in order visibility for 2H22
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Tuesday 14 June 2022
Tape COF substrates in sluggish demand for large-size DDIs
Sluggish sales of large-size panels and continuous uncertainties in TV terminal demand have continued to erode shipments of large-size display driver ICs (DDI), resulting in revenue...
Thursday 2 June 2022
Cutting DDI production orders not an easy deal: Q&A with Chipbond Technology chair Fei-Jain Wu
Taiwan-based Chipbond Technology, now holding the world's largest backend capacity for panel display driver ICs (DDI), continues to deepen cooperation with local OSAT Orient Semiconductor...
Friday 6 May 2022
Taiwan DDI backend firms remain optimistic about 2Q22
Taiwan-based display driver IC (DDI) backend specialists ChipMOS Technologies and Chipbond Technology remain upbeat about their business prospects in the second quarter of 2022, despite...
Tuesday 19 April 2022
OSATs say production remains normal in Suzhou amid semi-lockdown
Taiwan-based OSATs including ASE Technology have said their local manufacturing operations in Suzhou remain normal despite the city entering a COVID-induced semi-lockdown, but they...
Wednesday 6 April 2022
OSATs to face uphill battle to bolster capacity utilization in 2H22
Taiwan's OSATs will find it a major task for them to prevent their capacity utilization rates from falling in the second half of 2022 though they are poised to experience steady business...
Friday 1 April 2022
ChipMOS, Chipbond to boost OLED DDI testing capacity by 15%
Taiwan-based display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies plan to procure additional high-end testing equipment, mainly from Japan's...
Friday 18 March 2022
Backend demand for TV SoCs, large-size DDIs may rebound in 2H22
TV SoC and large-size display driver IC (DDI) packaging demand will have a chance to rebound in the second half of 2022, as the FIFA World Cup 2022 slated for November 21-December...
Thursday 20 January 2022
Chipbond, ChipMOS to raise backend quotes by 10-20% in 1Q22
Display driver IC (DDI) backend houses Chipbond Technology and ChipMOS Technologies both plan to raise their quotes by 10-20% later in the first quarter of 2022, according to industry...