Chipbond Technology will put on hold its 5G PA (power amplifier) packaging capacity expansion originally set to be enforced in the second half of 2019, due mainly to the uncertainties...

Suppliers engaged in the supply chain for chip-on-film (COF) packaging remain optimistic about demand coming from the smartphone sector, citing the rising popularity of bezel-less...

COF packaging demand for automotive OLED displays has emerged, which may further tighten market supply as capacity expansion will remain quite limited in the short term, according...

With the US trade sanctions likely to prove disastrous to Huawei, Taiwan semiconductor supply chain partners can hardly give clear-cut prospects for the third quarter of 2019 and...

Huawei has demanded more supplies from Taiwan-based chip-on-film (COF) substrate manufacturers including JMC Electronics and Chipbond Technology (formerly Simpal Electronics), and...

Driver-IC backend firm Chipbond Technology is set to land COF packaging orders from Apple for a LCD-based iPhone device to be launched in 2019, allowing it to continue enjoying brisk...

Backend houses have seen orders for handset-use TDDI (touch and display driver integration) chips ramp up significantly, prompting them to allocate part of their COF (chip on film)...

COF substrate makers plan to adjust upward quotes for the second quarter by 8-15% sequentially to reflect their tight supplies, according to market sources.

The planned launch of foldable smartphones by vendors other than Samsung Electronics such as Huawei and other Chinese brands, will benefit Taiwan's supply chain makers related to...

Chipbond Technology, a backend house specializing in display driver ICs, is expected to see its revenues buck seasonal patterns in the first quarter...

With more LCD panel suppliers capable of producing in commercial volume OLED displays for smartphones, Taiwan-based driver IC firms and related backend houses are gearing up to grow...

As China's leading smartphone and telecom equipment maker, Huawei is moving at full throttles to strengthen its capabilities for the upcoming 5G commercialization era by placing orders...

Chipbond Technology and JMC Electronics, both of whom are among the world's few suppliers of COF substrates, have reported revenue increases for 2018 of 16% and 45%, respectively.

The chip-on-film (COF) substrate market continues to be dominated by Korea- and Taiwan-based firms, and is considered to be niche with a high barrier of entry for startup companies,...

LCD driver IC backend specialist Chipbond Technology has reported net profits climbed to a record high of NT$2.71 billion (US$87.6 million) in the third quarter of 2018. EPS for the...

Chipbond Technology has entered the supply chain for Huawei's smartphones by providing chip-on-film (COF) packaging for OLED panel driver ICs, according to industry sources.

Driver IC backend specialists have inked supply deals with several of their fabless clients, and have promised sufficient capacity for COF (chip-on-film) packaging over the next three...

While China's semiconductor industry is aggressively moving to build partnerships with world-class players to strengthen its prowess amid the raging US-China trade war, Taiwan semiconductor...

Taiwan-based backend firm Chipbond Technology is expected to see revenues generated from orders for OLED panel driver ICs make a substantial contribution to company revenues in 2019...

Demand for TDDI (touch and display driver integration) chips is set to ramp up starting the third quarter, with Taiwan-based backend firms including Chipbond Technology and ChipMOS...

Chip on film (COF) packaging substrate supplier JMC Electronics and COF back-end service firms Chipbond Technology and ChipMOS Technologies are set to enjoy brisk sales in the second...

The most important evolution in the LCD driver IC packaging sector in 2018 is that the COF (chip on film) package process has become a crucial alternative to COG (chip on glass) for...

Chip-on-film (COF) packaging demand will start to grow substantially in the second half of 2018, driven by the arrival of new smartphones featuring an edge-to-edge display, according...

LCD driver IC backend specialist Chipbond Technology saw its net profits increase 13.1% to a three-year high of NT$2.25 billion (US$76.9 million) in 2017. EPS for the year reached...

The massive build-ups of OLED panel production capacity by China-based panel makers are expected to bring business opportunities for Taiwan-based makers, including driver IC designers,...