Taiwan Semiconductor Manufacturing Company (TSMC) has signed an industry-academy cooperation agreement with Tsinghua University, China's leading science and engineering educational institution, according to the foundry chipmaker.
TSMC said it will provide advanced wafer manufacturing services (90nm and 65nm), which will enable Tsinghua to enrich course curriculum and nurture China's talent for IC design development.
With support from TSMC, China's Tsinghua will be able to fulfill its research projects that include analog, mixed-signal and digital designs for system-on-chip (SoC) solutions used in handheld devices and automotive applications, according to Zhihua Wang, professor at the Institute of Microelectronics at Tsinghua.
Article translated by Jessie Shen
