27 news items tagged 90nm
Huawei reportedly looking to build 45nm chip fabrication lines without US tech
Wednesday 19 August 2020China's Huawei reportedly is looking to build its own 45nm chip fabrication lines without US technology this year, which industry sources believe is "mission impossible."
GF, SkyWater sign MOU for technology development
Monday 22 June 2020Globalfoundries, a longtime supplier of microelectronics to the US Department of Defense (DoD), and SkyWater Technology have signed a memorandum of understanding (MOU) to manufacture...
UMC enters supply chain for Sony CIS
Thursday 12 December 2019United Microelectronics (UMC), through its takeover of Mie Fujitsu Semiconductor (MIFS), has entered the supply chain for Sony's CMOS image sensors, according to industry sources.
Samsung enhances 8-inch foundry offerings
Wednesday 21 March 2018Samsung Electronics has announced more value added 8-inch (200mm) technology solutions for its foundry customers. On top of its existing embedded flash memory (eFlash), power, display...
Shanghai Huahong to build 12-inch fab in Wuxi
Wednesday 2 August 2017Shanghai Huahong Group on August 2 struck a deal with the national China Integrated Circuit Industry Investment Fund and the city government of Wuxi to set up a new 12-inch wafer...
Powerchip opens JV fab in China
Wednesday 28 June 2017Powerchip Technology has completed the construction of its 12-inch fab in Hefei, China and started to run the fab, according to the Taiwan-based foundry chipmaker. The fab...
Taiwan 12-inch foundries offer discounts to attract orders
Friday 13 November 2015Taiwan-based IC foundries are encouraging their LCD driver IC and fingerprint sensor clients to accelerate their transition to 12-inch wafers by narrowing the cost gap between 12-inch...
Hua Hong, eMemory partner to develop MCUs for IoT
Tuesday 24 March 2015Hua Hong Semiconductor and eMemory Technology have jointly announced they will further strengthen their strategic partnership and work together in the field of microcontrollers (MCU),...
Capacity utilization rates of 90/55nm processes at foundries begin to slide
Wednesday 25 June 2014The capacity utilization rates of 90/55nm processes at some foundry houses in Taiwan and China reportedly have begun to slip, raising concerns of double-booking by some IC design...
TSMC unveils 100MHz access speed embedded flash IP
Friday 17 August 2012TSMC has unveiled what it claims is the foundry segment's first 100MHz flash memory single-cycle access speed 90nm embedded flash IP targeting a wide range of automotive, communications...
Powerchip mass producing driver ICs at 90nm
Tuesday 6 December 2011Powerchip Technology has announced mass production of the foundry segment's 90nm high-voltage process technology for small- to medium-size driver ICs used in mobile device applications,...
Winbond intros new serial flash for space-critical applications
Monday 21 November 2011Winbond Electronics has announced a family of new SpiFlash serial flash memory with what the company claims has the industry's smallest packages per density. The small...
Foundries offer discount for IC designers
Tuesday 27 September 2011Pure-play wafer foundries in Taiwan and China reportedly have offered special discounts to their fabless IC clients, due to particularly low utilization rates that are likely to persist...
SMIC reportedly cuts 65nm, 90nm prices
Tuesday 28 June 2011Semiconductor Manufacturing International Corporation (SMIC) has informed IC design clients of a 10-15% reduction on 65nm and 90nm processing prices for the third quarter of 2011,...
CSR, TSMC extend collaboration to 90nm embedded flash process
Friday 11 February 2011CSR and Taiwan Semiconductor Manufacturing Company (TSMC) have jointly announced they are collaborating on the adoption of TSMC's 90nm embedded flash process technology, IP and RF...
China market: SMIC lands more IDM orders
Thursday 13 January 2011Foundry chipmaker Semiconductor Manufacturing International Corporation (SMIC) has grabbed more chip orders targeted mainly at China from international IDM companies, according to...
Winbond to cut capex for 2011 and 2012
Friday 17 December 2010Winbond Electronics has budgeted NT$2.94 billion (US$98 million) and NT$936 million, respectively, in capex for 2011 and 2012, according to the company. The figures show significant...
Winbond ramping 90nm production for serial NOR flash
Wednesday 14 April 2010Winbond Electronics has shipped its one-billionth serial flash chip, according to the company, adding that it is now stepping up efforts to ramp production of the memory using 90nm...
Memory IC designers see growing sales from 90nm and 70nm products
Wednesday 6 January 2010Etron Technology and Zentel Electronics have seen sales generated from 90nm and 70nm products increase substantially, and both are looking to roll out new SDRAM using 65nm process...
TSMC signs cooperation pact with Tsinghua University
Thursday 24 December 2009Taiwan Semiconductor Manufacturing Company (TSMC) has signed an industry-academy cooperation agreement with Tsinghua University, China's leading science and engineering educational...
SMIC remains unprofitable in 3Q09
Thursday 29 October 2009Semiconductor Manufacturing International (SMIC) saw revenues drop on year in third-quarter 2009, with the quarter's net loss widening from a loss of US$33.38 million in third-quarter...
MediaTek to shift to 45nm in 1Q10
Friday 25 September 2009MediaTek plans to leap to 45nm processing for 3G chips in the first quarter of 2010 despite that volume production of 65nm WCDMA chips is scheduled to begin in the fourth quarter...
Faraday SATA 3G PHY, controller achieves compliance in UMC 90nm process technology
Tuesday 22 September 2009Faraday Technology has announced that its SATA 3G solution has passed SATA-IO compliance testing on United Microelectronics Corporation's (UMC's) 90nm process.
TSMC shipments more than double in 2Q09; ups capex for 2009
Thursday 30 July 2009Taiwan Semiconductor Manufacturing Company (TSMC) posted consolidated revenues of NT$74.21 billion for the second quarter, up 87.9% from NT$39.5 billion in the first. On an annual...
Faraday launches low-leakage memory with up to 90% leakage-reduction
Wednesday 15 July 2009Faraday Technology has announced the availability of low leakage memory at UMC 90nm process, which provides up to 90% leakage reduction with no area penalty. Faraday's low leakage...

Winbond TS16949-certified, AEC-Q100-qualified serial flash memory
Photo: Company, Friday 2 March 2012