Toward Technologies, Inc. concluded its participation in SEMICON Taiwan 2026, held from September 2 to 4 at Taipei Nangang Exhibition Center Hall 1. Under the theme "RELAY, REDEFINED.," the company showcased a broader switching technology portfolio at booth K3168 and demonstrated its transition from a traditional relay supplier to an advanced switching solution partner.
Toward presented high-speed and RF switching technologies, Opto-SiC MOSFET relays, reed relays, solid-state relays, high-speed inductors and modularized switching solutions. The exhibition highlighted the company's capabilities from individual components to integrated switching architectures for semiconductor testing, ATE, probe cards, load boards, RF test, AI/HPC, EV/BMS and high-voltage measurement applications.
As AI/HPC, high-speed computing, advanced semiconductor testing, EV/BMS and high-voltage electronics continue to develop, switching components must meet increasingly demanding requirements for frequency performance, signal integrity, low leakage, isolation, switching speed, channel density and system integration. Toward's product portfolio is designed to address these needs across high-frequency, high-voltage and power-related test systems.
Broadband Conical Inductor Supports High-Frequency Test Interfaces
A featured product was Toward's Broadband Conical Inductor, developed for RF and semiconductor test applications. The solution supports frequencies up to 60 GHz and targets RF/microwave, high-speed semiconductor testing and advanced test interfaces. It can be used in bias tees, DC bias injection networks, RF chokes and broadband test interfaces.
For probe cards, load boards, RF test fixtures and other high-frequency platforms, introducing DC bias while minimizing its effect on the RF signal path is an important design challenge. By combining the Broadband Conical Inductor with switching technology, Toward is extending its capabilities from a single relay component to RF signal paths, bias networks and system-level switching architectures.
Toward also displayed a Broadband Conical Inductor Module based on its AI-0260 series inductor and ALC series modules. The solution illustrates the company's ability to connect high-frequency component technology with high-speed I/O and test platform integration.
Opto-SiC MOSFET Relay Targets High-Voltage Testing
Toward's Opto-SiC MOSFET Relay is designed for EV, BMS, power semiconductor and high-voltage electronic systems. The product integrates a silicon carbide MOSFET with an optically coupled control architecture. It retains key solid-state relay advantages, including no mechanical contacts, long operating life and high-speed switching, while extending load-voltage capability to the kV range.
The relay targets high-voltage testing, measurement-path switching and automated test applications. It supports Toward's strategy of developing switching technologies for electrification and power semiconductor test systems, in addition to conventional relay applications.
Multi-Technology Platform Supports Customer Development
Toward also presented reed relays, RF MEMS, solid-state relays, high-speed inductor solutions and modularized switching solutions. Different technologies offer different advantages, including low contact resistance, high reliability, compact design, low leakage, high-frequency switching performance and high-voltage capability. This multi-technology platform allows customers to select a switching architecture according to their application requirements rather than being limited to one relay type.
As semiconductor test and ATE architectures become more complex, customers need more than a relay datasheet. Toward provides capabilities in relay design, RF and high-speed technology, silicon carbide, packaging, manufacturing, testing and module integration. Its support can extend from application requirements and component selection to sample verification, switching module development and production introduction.
This component-to-subsystem approach helps Toward address signal routing, RF path design, bias networks, isolation, channel density and mechanical integration. The company aims to help customers develop switching solutions that match the electrical, thermal, mechanical and testing conditions of each target system.
International Collaboration and Future Growth
Toward Chairman Hsu said the 2026 event was the company's most successful SEMICON Taiwan participation in more than a decade. He noted that many of the products displayed were developed for future applications and that the company's technology investments are intended to support growth over the next 10 to 20 years.
Business partners from Italy, Germany, the United Kingdom, Japan and Singapore also visited Toward's booth. Their participation reflected the company's expanding international network. Toward plans to deepen cooperation with customers and technology partners while strengthening its high-speed, RF, high-voltage, power and modularized switching capabilities.
Looking ahead, Toward will continue developing solutions for semiconductor test, AI/HPC, EV/BMS, aerospace and defense, industrial automation and medical devices. Through the message "RELAY, REDEFINED.," the company aims to redefine the role of relays in next-generation electronics and semiconductor test systems and to support practical technology deployment with customers and industry partners. For more information, visit Toward Technologies.
Toward Technologies executives at SEMICON Taiwan 2026 in Taipei. Credit: Toward Technologies
