460 news items tagged SoC
WinWay breaks ground for new plant in southern Taiwan
Friday 15 January 2021WinWay Technology, a dedicated supplier of IC test interface solutions, has recently broken ground for a new plant in Kaohsiung, southern Taiwan.
MediaTek enhances ASIC and IP design capability
Thursday 14 January 2021MediaTek continues to enhance its ASIC and IP design capability through several acquisitions announced recently, while recruiting talent from the IP and IC design industry sectors,...
M31 Technology developing IP for TSMC 3nm process
Monday 4 January 2021Silicon IP provider M31 Technology is engaged in the development for TSMC's upcoming 4nm and 3nm process technologies, and will introduce related IPs for mobile SoC designs in 2021,...
Airoha to acquire IC Plus
Wednesday 30 December 2020Airoha Technology, a MediaTek subsidiary, will acquire all shares of fellow company IC Plus at NT$22 (US$0.78) per share, according to company filings with the Taiwan Stock Exchange...
Realme launches MediaTek-powered 5G phones in Taiwan
Wednesday 23 December 2020Realme has launched two new 5G-enabled smartphones in the Taiwan market, as the Chinese handset vendor seeks to further ramp up its share in the local market. Both models will be...
Taiwan IC ecosystem unscathed by Huawei ban
Wednesday 23 December 2020The impact of Huawei's woes on its Taiwan-based chip suppliers has been smaller than expected, according to industry sources.
MediaTek announces equity investment in Asix
Friday 18 December 2020MediaTek through subsidiary Airoha Technology will invest up to NT$495 million (US$17.6 million) through private placement to acquire an about 20% stake in fellow Taiwan-based IC...
Unimicron may resume fire-disrupted shipments of FCCSP substrates in 1Q21
Thursday 17 December 2020Unimicron Technology expects to resume shipments of BT-based FCCSP substrates for processing handset SoCs in first-quarter 2021 at the earliest, with the shipments to be delivered...
High performance and low power consumption give Winbond's 1Gb LPDDR3 DRAM the edge in Tsing Micro's new AI image-processing SoC
Wednesday 16 December 2020Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced that a high-performance, low-power Winbond 1Gb LPDDR3 DRAM product has achieved...
ProteanTecs to host live webinar on SoC quality and time-to-revenue
Friday 4 December 2020ProteanTecs, a global leader of Deep Data solutions for electronics' health and performance monitoring, announced today an upcoming live webinar titled "Increasing SoC Quality and...
ASE obtains FC packaging orders for new Qualcomm 5G SoC
Thursday 3 December 2020ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...
Concerns rising over tight BT substrate supply for handset SoCs
Friday 20 November 2020Handset application processor vendors have expressed concerns about the supply of BT substrates that may fall due to the suspension of production at Unimicron Technology's fire-hit...
MediaTek optimistic about 2021
Thursday 19 November 2020MediaTek is confident its complete mobile SoC lineup will buoy its performance in 2021, according to company chairman Rick Tsai.
Global brand name customer adopts iCatch Technology intelligent automotive imaging SoC for fleet management application
Wednesday 18 November 2020As high as 90% of the traffic accidents are related to driver's status, such as fatigue or distraction. Studies have shown that by monitoring driver's behavior and status, the traffic...
GUC D2D total solution opening the new era of flagship SoC
Tuesday 17 November 2020Global Unichip Corp. (GUC), the advanced ASIC leader, disclosed today that it has successfully demonstrated the silicon-proven GLink (GUC multi-die interLink) interface using TSMC...
MediaTek to acquire assets related to PWM IC from Intel
Tuesday 17 November 2020MediaTek has announced on behalf of subsidiary Richtek Technology plans to acquire assets related to the power management solutions product line sold under the Enpirion brand owned...
ASE quietly enhancing CIS backend capability
Monday 16 November 2020ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...
Unimicron reportedly sole ABF substrate supplier for Apple M1
Thursday 12 November 2020Taiwan's Unimicron Technology reportedly is the sole supplier of ABF substrates for Apple-designed M1 chipsets powering its just-unveiled new MacBook series.
MediaTek announces new Chromebook chips
Wednesday 11 November 2020MediaTek has unveiled its MT8192 and MT8195 chipsets for the next generation of Chromebooks, with the 7nm MT8192 for mainstream devices and the 6nm MT8195 for premium models.
MediaTek to snap up record high revenues for 2020
Wednesday 11 November 2020MediaTek is on track to garner record high revenues of over US$10 billion in 2020, driven by order dynamics for its comprehensive lineups of chips for 5G, Wi-Fi, PC, smart home and...
Qualcomm, MediaTek bracing for strong 5G SoC demand in 2021
Tuesday 10 November 2020Qualcomm and MediaTek are poised to embrace strong shipment growths for 5G SoC solutions in 2021 as sales of 5G phones are expected to grow exponentially in the coming year, particularly...
4G SoCs, handset PAs in short supply at distributors
Tuesday 3 November 2020The supply of 4G SoCs and PA components for both 4G and 5G models are falling short of demand, but may ease by the end of 2020, according to IC distribution sources.
MediaTek expects up to 8% revenue drop in 4Q20
Monday 2 November 2020MediaTek expects to post revenues of between NT$89.5 billion (US$3.13 billion) and NT$97.3 billion in the fourth quarter of 2020, representing flat growth or an up to 8% decrease...
MediaTek announces chipmaking equipment purchases
Monday 2 November 2020Mobile SoC specialist MediaTek has announced over NT$1 billion (US$35 million) worth of fab tools that the fabless chipmaker will spend for its chip production.
TSMC may move 6th-gen CoWoS to production in 2023
Monday 26 October 2020TSMC continues to advance in CoWoS-S packaging adopting silicon interposer, with the prospect of entering volume production in 2023 for the sixth-generation of the technology that...