Intel Labs has unveiled a cryogenic control chip, code-named "Horse Ridge," for speeding up development of full-stack quantum computing systems.

MediaTek reportedly plans to unveil its second 5G SoC in the latter half of December, one month after it released the first model of its 5G SoC family product, the Dimensity 1000,...

The main battlefield in the 5G mobile chip market is expected to shift from flagship models to mostly midrange ones in the first half of 2020, as around 70% of over 200 million 5G...

Qualcomm has introduced its new Snapdragon 865 and 765 seies SoC chips designed for 5G-capable Android smartphones slated for launch in 2020. TSMC and Samsung Foundry reportedly are...

MediaTek has released Dimensity 1000 featuring four Arm Cortex-A77 cores operating up to 2.6GHz with four power-efficient Arm Cortex-A55 cores operating at up to 2.0GHz, accelerating...

Demand for 5G smartphones is expected to pick up fast next year, with mobile SoC prices for these handsets to stay at high levels at least in the first half of 2020. Tight capacity...

Chip demand for true wireless stereo (TWS) earbuds and earphones is set to remain robust in 2020, according to industry sources in Taiwan.

As shipments of midrange 5G smartphones are expected to expand significantly in 2020, the resultant strong demand for chipsets will be a major revenue growth driver for Taiwan's backend...

MediaTek held a press conference on November 26 to introduce the new generation of its 5G SoC chips, with guests including TSMC VP Lora Ho, a number of high-ranking executives from...

System-in-package (SiP) will gain significant growth momentum in 2020 as it will be badly needed to process wireless connectivity devices including RF front-end modules, antenna modules...

MediaTek will introduce the new generation of its 5G SoCs later this week when the mobile chip specialist discloses its shipment goal next year, according to sources familiar with...

FOPLP (fan-out panel level package) will be a new option that is not meant to support pushes to 7nm, 5nm or even more advanced nodes but rather to provide a packaging solution that...

Demand for anylayer HDI boards from Chinese handset vendors has been increasing sharply as such boards are badly needed for carrying 7nm APs, now mainstream core SoCs for their smartphones,...

Third-quarter-2019 smartphone AP shipments to China-based vendors came to 210 million units, down 1.8% on quarter and 9.4% on year.

IC design service providers Global Unichip and Alchip are both expected to report over 20% sequential increases in fourth-quarter revenues, thanks to robust orders for developing...

Unit prices for SoC chips used in true wireless stereo (TWS) earbuds have fallen below US$1.50 recently, down from US$2.50-3 in the first quarter of 2019, amid growing presence of...

MediaTek's 8K digital TV system-on-chip (SoC) manufactured with 12nm technology, the MediaTek S900, has entered volume manufacturing with TSMC, according to the companies.

LCD driver IC design specialist Novatek Microelectronics expects to post revenues of between NT$15.8 billion (US$519.3 million) and NT$16.3 billion for the fourth quarter of 2019,...

MediaTek is expected to ship over 50 million 5G SoC chips in 2020, during which it will roll out three to four 5G SoC series supporting both sub-6GHz and mmWave, according to industry...

Global shipments of TWS (true wireless stereo) earphones are expected to surge sharply to 150-200 million sets in 2020 from around 100 million sets estimated for 2019, providing strong...

Shipments of smartphone application processors (APs) to China are forecast to decline 4.6% on year in the fourth quarter of 2019, following a decline of 9.4% in the third quarter...

Taiwan-based fabless chipmakers and backend houses are all gearing up to tap robust demand for 5G-related applications from China, where local major telecom carriers have started...

China's mobile solution provider HiSilicon Technologies is expected to see its shipments of application processors continue to grow in 2019 with its chips powering nearly 70% of handsets...

Winbond Electronics has subscribed to new shares issued by Nuvoton Technology, and raised its stake in the logic IC specialist to 61.6%, according to a company filing with the Taiwan...

Huawei's HiSilicon has unseated Apple as the largest customer of TSMC in terms of advanced process node capacity share, according to industry sources.