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NEWS TAGGED CHIPS + COMPONENTS
Tuesday 30 June 2026
TSMC 2nm, CoWoS, and CoPoS broadly lift Taiwan's equipment, materials, and packaging suppliers

As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating...

Tuesday 30 June 2026
Lenovo warns elevated memory prices could become the new norm beyond 2030

Memory price inflation has emerged as one of the biggest challenges facing the consumer electronics industry, with Apple, Microsoft,...

Tuesday 30 June 2026
Samsung Electro-Mechanics targets AI server growth with MLCC talks, substrate push

Samsung Electro-Mechanics is in final-stage talks to supply multilayer ceramic capacitors (MLCCs) to a major US cloud provider for...

Tuesday 30 June 2026
Interview: Why DuPont spinoff Qnity is betting its Taiwan growth on packaging, not process nodes

As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals...

Tuesday 30 June 2026
Corning's East Coast edge: IP, manufacturing depth, and AI-era return of optical fiber
Protecting patents around the world is a core value for any R&D-driven company. It is also a commitment to partnering with customers. In 2025, glass giant Corning filed nearly...
Tuesday 30 June 2026
Samsung commits KRW2,655 trillion to future industries, anchoring new Gwangju fab
Samsung said on June 29 it will invest a combined KRW2,655 trillion (approx. US$1.72 trillion as of June 30, 2026) across its domestic operations, splitting the figure between continued...
Tuesday 30 June 2026
Memory suppliers lock down buyers as contract prices continue surging in 2H26

Memory pricing pressure continues to intensify. Contract prices have already recorded substantial gains for two consecutive quarters...

Tuesday 30 June 2026
Apple faces iPhone 18 Pro price pressure as memory crunch tests AI upgrade strategy

Apple's next iPhone Pro lineup could be heading toward one of its sharpest pricing tests in years, as surging memory costs threaten...

Tuesday 30 June 2026
Commentary: AI memory boom rewrites chip pricing power, leaving Apple searching for leverage with CXMT

For more than a decade, Apple built one of the industry's most profitable business models by using its purchasing power to drive down...

Tuesday 30 June 2026
IC design firms brace for uncertain peak season as prices rise
The 2026 peak season for IC design firms remains unclear, with global readers likely to feel the effects through pricier smartphones, PCs, and other devices. Supply-chain costs are...
Tuesday 30 June 2026
AI hands foundries pricing power: TSMC leads, but the boom spreads industry-wide

AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs,...

Tuesday 30 June 2026
Samsung revives 1.4nm foundry push as 2029 timeline takes shape

Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The...

Tuesday 30 June 2026
SK Hynix accelerates Yongin fab timeline by 12 years as HBM strains memory capacity
SK Hynix said on June 29 it will spend KRW1,100 trillion (approx. US$710 ​billion) across three sites in South Korea over the coming decades, accelerating its Yongin cluster...
Tuesday 30 June 2026
China's third-largest pure-play foundry's HK filing shows growth, but also rising risks

Nexchip Semiconductor has filed for a Hong Kong listing to fund expansion, following rapid revenue growth and a stronger market position...

Tuesday 30 June 2026
South Korea looks to Taiwan as model for semiconductor decentralization
South Korea is overhauling its semiconductor manufacturing footprint to secure an edge in the AI era, drawing direct inspiration from a fierce competitor: Taiwan.