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Friday 18 September 2026
CXMT eyes NAND amid global shortage, taking aim at YMTC

ChangXin Memory Technologies (CXMT) is preparing to expand beyond DRAM into NAND flash, a move that would push China's leading DRAM...

Friday 18 September 2026
Doosan commits KRW968 billion to CCL expansion as demand strains capacity
Doosan is investing KRW968.4 billion (approx. US$701 million) to expand high-end copper-clad laminate (CCL) production in South Korea and China, its largest-ever investment in the...
Friday 18 September 2026
China's memory push gains ground across LPDDR6, advanced NAND, with HBM still the test

AI is reshaping the global memory industry, tightening supply while creating an opening for China's domestic suppliers. With Samsung...

Friday 18 September 2026
Chip equipment makers face waits of up to 40 months for critical parts
The semiconductor industry's capacity crunch is moving deeper into the equipment supply chain, with shortages of specialized components stretching delivery times as chipmakers accelerate...
Friday 18 September 2026
Samsung deepens Euclyd ties as startup reportedly reaches test-chip stage

Samsung Electronics is deepening its relationship with Dutch chip startup Euclyd after the company reportedly reached the test-chip...

Friday 18 September 2026
CPO raises PCB downgrade concerns but switches stick with M8 CCL

As the industry shifts toward greater use of optical interconnects and less reliance on copper, market speculation has emerged that...

Friday 18 September 2026
Mobile SoC battle for 2026 centers on NPUs

More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such...

Friday 18 September 2026
Micron: AI memory crunch rewrites the market with long-term deals and custom designs
As the AI boom spreads from data centers to edge devices and robotics, Micron Technology executives are warning that memory has become a core bottleneck determining the upper limits...
Friday 18 September 2026
GlobalFoundries, Marvell expand SiGe capacity deal for AI optical connectivity

GlobalFoundries (GF) and Marvell Technology have expanded a multi-year agreement to increase production capacity for silicon germanium...

Friday 18 September 2026
Rumored Japan-US chip plant talks test whether two former chipmaking giants can rebuild at home

If the project under discussion goes ahead, it would be the first time Japan's US$550 billion tariff-linked investment pledge is directed...

Friday 18 September 2026
Resonac grows 300mm SiC crystal, marking a substrate milestone
Resonac has grown and processed a 300mm silicon carbide (SiC) single crystal. This development could shape the future of power electronics used worldwide in electric vehicles, renewable...
Friday 18 September 2026
Global chipmakers answer India's pitch with equipment, materials, and R&D — not fabs
The multinationals that filled Semicon India 2026 committed to almost every layer of the semiconductor value chain except the one India most wants: nobody announced a new fab. Applied...
Friday 18 September 2026
Tata Electronics put 16 MoUs on the record at Semicon India, join hands with Nexperia
Tata Electronics has attached a headline number to its supplier-recruitment drive at Semicon India 2026 — 16 memoranda of understanding — but only five have been documented...
Friday 18 September 2026
Modi says India's chip mission has reached commercial production as Semicon 2.0 lifts the purse to US$13.5 billion
India's government used the opening of Semicon India 2026 to reframe what it is asking the industry to believe: not that fabs will be built, but that they are already shipping. Prime...
Friday 18 September 2026
Samsung taps Japan for 3.xD chiplet push as packaging race heats up
Samsung Electronics is deepening its semiconductor ties with Japan as it develops large-area chiplet packaging technologies for high-performance computing and AI processors, tapping...