Hyundai Mobis has announced plans to begin mass production of automotive semiconductors developed in collaboration with over 20 domestic companies and research institutes starting...
Intel's ambitious revival remains far from fully financed, even after securing investments from SoftBank, the US government, and Nvidia. Analysts estimate the chipmaker still needs...
The Taiwan Institute of Economic Research (TIER) released the manufacturing business climate indicator for August 2025 on October 1. The report noted that continued strong demand...
United Microelectronics Corporation (UMC) has formally demanded that its suppliers propose price cuts of more than 15% to take effect on January 1, 2026, an unusually aggressive move...
Taiwan-based passive components manufacturer Yageo Corporation has completed its public tender offer for power management IC (PMIC) design firm Anpec Electronics. On October 1, 2025,...
Seoul prosecutors have arrested and indicted three former employees of Samsung Electronics for allegedly leaking advanced nanoscale DRAM process technology to China's Changxin Memory...
Intel is set to kick off mass production of its 18A process at Fab 52 in Arizona by year-end, using PowerVia and RibbonFET technologies. The move positions Intel in a head-to-head...
With progress in visa negotiations between the South Korean and the US governments, LG Energy Solution (LGES) is poised to accelerate construction and operations at its US factory.
Western Digital (WD), the world's largest hard disk drive (HDD) manufacturer, announced plans to invest US$1 billion in Japan over the next five years to strengthen next-generation...
Qualcomm's adoption of Arm's v9 architecture represents a strategic shift that balances AI capabilities, legal considerations, and competitive pressures while diversifying its technological...
Cyient Semiconductors, spun off from the Cyient group earlier in 2025, has unveiled a three- to five-year roadmap emphasizing custom ASICs and intelligent power solutions for data...
Third-generation semiconductor silicon carbide (SiC) has recently shifted industry focus from the mainstream 6-inch and 8-inch wafers to the more futuristic 12-inch SiC substrates,...
Starting January 1, 2026, China will give domestic products a 20% price advantage in government procurement to support local AI chipmakers, promoting self-reliance, though advanced...
Meng Wanzhou, Huawei's vice chairperson and CFO, will assume the role of rotating chairperson from October 1, 2025, to March 31, 2026, according to Huawei's official website. She...
The Trump administration's investigation into semiconductor imports has unleashed deep uncertainty across the global tech industry—and the fallout may hit American companies...
