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Wednesday 2 September 2026
Taiwan doesn't just want a quantum lab — it wants a quantum fab
Taiwan built the last computing era by manufacturing other people's designs. Ching-Ray Chang wants it to try the same trick with quantum computing, and he is arguing the window is...
Wednesday 2 September 2026
TCL CSOT bets on InP laser chips as supply tightens
Indium phosphide (InP) is emerging as one of the tightest supply constraints in AI data-center optical interconnects. Lumentum CEO Michael Hurlston has said publicly that the supply-demand...
Wednesday 2 September 2026
MCU chipmaker Sonix sees supply crunch lasting through 2026, memory shortage hits imaging shipments
Sonix Technology expects consumer IC and MCU sales to keep growing in the second half of 2026, but memory shortages could slow imaging-product shipments. AI-driven demand is also squeezing...
Wednesday 2 September 2026
AI demand push expands wafer industry's growth outlook
AI is reshaping demand well beyond chips, and GlobalWafers chair Doris Hsu said this shift is lifting the strategic importance of silicon wafers across the semiconductor supply chain...
Wednesday 2 September 2026
Taiwan materials makers see new opening in chip packaging shift
Taiwan's semiconductor materials suppliers are seeking gains from square packaging and co-packaged optics as advanced manufacturing evolves. The changes could help local firms move...
Wednesday 2 September 2026
TSMC says Europe chip strategy is shifting from plans to demand creation
The European semiconductor push is moving beyond factory construction toward demand, design support, and talent building, according to TSMC. For global readers, the shift matters because...
Wednesday 2 September 2026
Semicon Taiwan 2026 signals a broader race for AI-era semiconductor leadership
Semicon Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...
Wednesday 2 September 2026
UMC targets 12-inch TFLN to break 400G SiPh bottleneck
As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations. United Microelectronics Corporation (UMC), Taiwan's second-largest...
Wednesday 2 September 2026
Apple's M6 and M5 Ultra break rule tying process to chip strength
Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer...
Wednesday 2 September 2026
How Taiwan is closing its semiconductor materials gap — three shifts to watch
Industry players say Taiwan's push to localize semiconductor materials did not begin in 2026. The real turning point came in 2019, when the Japan-South Korea semiconductor trade dispute...
Wednesday 2 September 2026
Deep Dive: CXMT challenges Pentagon as Trump-Xi meeting nears
ChangXin Memory Technologies (CXMT) has escalated its defense against the US government, shifting from supply-chain and technological competition into a full-scale courtroom battle...
Wednesday 2 September 2026
Innolux targets advanced packaging with debut of Chip Last tech
Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...
Wednesday 2 September 2026
Panasonic reportedly raises CCL and PP prices again as IC substrate costs jump 30%
Japan's Panasonic has raised PCB material prices for the second time in 2026, broadening the increases to copper-clad laminate (CCL), pre-preg (PP) and other products, including IC...
Wednesday 2 September 2026
AI packaging demand surges, ASE EVP identifies two manufacturing bottlenecks
On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by SEMI, TSMC, and ASE, held the 3DIC Global Summit on...
Wednesday 2 September 2026
China memory-module makers report surging profits, strained cash flow
Seven listed Chinese memory-module and memory-distribution companies have filed first-half 2026 results, and the headline numbers are the largest the tier has ever reported. The more...