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    Shanghai HiSilicon expands DDI push across all display sizes
    49min ago
    Applied Materials CEO outlines a trio of innovation priorities for AI chip race
    49min ago
    China’s domestic AI chips target 3D packaging, optical interconnects and software ecosystems
    49min ago
    AI accelerator growth shifts toward value, not volume
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    Analysis: China’s EV exports shift from volume to value as rebates shrink
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    NEWS TAGGED CHIPS + COMPONENTS
    Monday 12 October 2026
    AI racks approach megawatt power levels as SiC, GaN, silicon divide power delivery roles
    The rapid expansion of AI infrastructure is driving demand for higher power and voltage levels, pushing power semiconductor development toward greater efficiency, higher power density,...
    Monday 12 October 2026
    ELAN Microelectrics's 3Q26 PC momentum stalls on shortages, inventory overhang
    Touch IC leader Elan Microelectronics recently announced its September 2026 consolidated revenue of NT$602 million (approx. US$18.9 million), down 18.74% month-over-month and 46.9%...
    Monday 12 October 2026
    Rapidus targets customers underserved by TSMC, but can it convince them to take the risk?
    Backed by US$15 billion in Japanese government funding, Rapidus announced an alliance with 17 semiconductor design-related companies, including US-based Synopsys and India's Infosys,...
    Monday 12 October 2026
    SK Hynix's US$299 billion chip plan faces military base hurdle
    SK Hynix's proposed KRW400 trillion (approx. US$299 billion) semiconductor expansion in southwestern South Korea faces a major obstacle as the company races to increase memory production...
    Monday 12 October 2026
    Samsung, SK Hynix accept ASML's 10% price hike in parts, report says
    Samsung Electronics and SK Hynix have accepted a 10% increase in ASML's replacement-part prices for lithography systems in South Korea, with the higher rates taking effect for deliveries...
    Monday 12 October 2026
    Nvidia, Reflection AI, the strategic pivot to open-weight ecosystems
    The Financial Times recently reported that Nvidia is in early-stage talks to acquire or significantly deepen its investment in the US$25 billion open-weight AI startup Reflection...
    Monday 12 October 2026
    TSMC, ASML eye 12-inch photomasks to unlock High-NA EUV's full-field potential
    Advanced semiconductor manufacturing is progressing toward 2nm and angstrom-era nodes (Å; where 1 nm equals 10 Å), bringing high-numerical-aperture extreme ultraviolet...
    Monday 12 October 2026
    Sigurd, Winstek align optical testing push as AI demand shifts toward connectivity
    Optical communications is becoming a key global bottleneck as AI workloads expand, and Sigurd is positioning itself to benefit. The IC test and packaging company said demand is rising...
    Monday 12 October 2026
    Former iPhone display plant in Japan reportedly to enter AI chip supply chain
    A former iPhone display factory in Mobara, Japan, is set for a new role in the semiconductor supply chain, with Shinko Electric Industries planning to convert the site into a production...
    Monday 12 October 2026
    CXMT targets 2026 debut of 4F² DDR5 RDIMM in bid to challenge server DRAM rivals

    China's ChangXin Memory Technologies (CXMT) plans to introduce DDR5 registered DIMMs (RDIMMs) based on its new 4F² DRAM architecture by the...

    Monday 12 October 2026
    MediaTek flagship AP share to surpass Samsung as TSMC boosts Dimensity
    As the global smartphone system-on-chip (SoC) market contracts, competition in the high-end application processor (AP) segment is intensifying. MediaTek is accelerating its push into...
    Monday 12 October 2026
    Weekly news roundup: Musk's Terafab faces reality check; Samsung HBM4E clears quality validation
    This week's (October 5 to October 11, 2026) coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces...
    Monday 12 October 2026
    Booked before launch, Tata's Dholera fab faces test of turning commitments into wafer volume
    Tata Electronics has six customers at different stages of engagement with its Dholera semiconductor fab, including three with what a person familiar with the project described as binding...
    Monday 12 October 2026
    Memory wall reshapes chip performance as large-capacity SRAM becomes a focal point in autonomous driving SoC design
    DIGITIMES observed that as AI computing has hit a bottleneck from the memory wall, data storage and data movement have become extensions of the computing task, also reshaping the role...
    Monday 12 October 2026
    India roundup: AI data center buildout accelerates as semiconductor push continues to broaden

    India's technology buildout is deepening across semiconductors and AI infrastructure, with chip IP, packaging and equipment initiatives advancing...

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