News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Monday 31 August 2026

MetaX posts first-half profit while China's AI GPU rivals split

MetaX posted its first half-year profit since listing, with rising GPU shipments and the mass production of its C600 accelerator strengthening its commercial position while China's...

Monday 31 August 2026

CXMT's global DRAM push runs into US curbs

ChangXin Memory Technologies (CXMT) is suing the Pentagon to overturn its designation as a Chinese military company as the Chinese DRAM...

Monday 31 August 2026

Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging

On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...

Monday 31 August 2026

South Korea risks 'HBM 2.0' trap in emerging CPO market

Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...

Monday 31 August 2026

CXMT starts LPDDR6 mass production for Xiaomi 18 Fold, claiming global first

China's CXMT has begun mass production of its LPDDR6 memory and will supply the first batch to Xiaomi's upcoming 18 Fold flagship, marking what the company says is the first commercial...

Monday 31 August 2026

China silicon wafers enter AI-led upcycle: prices rise, 12-inch capacity expands

Hangzhou Lion Microelectronics plans to invest about CNY3 billion (approx. US$446 million) in a new 12-inch silicon wafer project in Jiaxing,...

Monday 31 August 2026

China's silicon wafer makers report profit gains of varying quality

Seven Chinese silicon wafer producers reported first-half 2026 results in the second half of August, indicating an uneven sector recovery. Several semiconductor-grade wafer makers...

Monday 31 August 2026

Taisic Materials produces Taiwan's first 12-inch SiC boule with homegrown crystal growth furnace

Taisic Materials, a subsidiary of Kenmec Mechanical Engineering, has successfully produced Taiwan's first 12-inch silicon carbide (SiC) boule using a crystal growth furnace independently...

Monday 31 August 2026

Weekly news roundup: US pressures Korea chip investment, MediaTek wins Google TPU, Apple debuts 2nm M6

Semiconductor investment, AI chips, advanced packaging and data center infrastructure dominated the week, with South Korea facing US pressure, India scaling chip manufacturing, and...

Monday 31 August 2026

France draws Taiwanese investment projects worth EUR7.5 billion

Taiwanese investment projects announced or under implementation in France are worth about EUR7.5 billion (approx. US$8.7 billion), according to the French Office in Taipei, led by...

Monday 31 August 2026

India roundup: India broadens semiconductor and AI ambitions across manufacturing, design, materials and data centers

India's semiconductor ambitions are expanding from packaging and testing to chip design, materials, mobile devices and data centers. New investments by CG Power, Infineon, Foxconn,...

Monday 31 August 2026

Podcast highlights: Xiaomi's 3nm chip cap, HBM in Malaysia, and Nvidia's margin tradeoff

Can Xiaomi's in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple's September...

Sunday 30 August 2026

Innodisk says AI demand is lifting margins while memory supply remains tight

Innodisk said its AI-focused product mix is driving stronger revenue and profitability, a sign that global demand for memory and infrastructure hardware remains robust. The company...

Saturday 29 August 2026

Samsung bets on JWMT: can glass substrates flip the script for South Korea in advanced packaging?

As artificial intelligence (AI) chips continue to scale up in physical size, semiconductor competition is rapidly extending beyond front-end node scaling into advanced packaging. The...

Saturday 29 August 2026

Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM

The AI infrastructure race has spent the past few years fixated on high-bandwidth memory as one of the most indispensable building blocks of accelerated compute. Yet as model sizes,...

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Sep 2, 08:22

World Diamond Technology accelerates mass production of 300 mm diamond wafers

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