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Thursday 29 October 2026
Advantech opens Tustin HQ to strengthen North American R&D
Industrial PC maker Advantech has opened its new North American headquarters in Tustin, California, expanding local R&D, manufacturing and system integration capabilities. The...
Thursday 29 October 2026
DIGITIMES Insight: Kinsus Tech identifies three challenges for larger AI chip packages
Surging demand for AI computing is driving advanced packaging toward larger form factors, according to Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, speaking...
Thursday 29 October 2026
Analysis: SpaceX–Tesla merger could reshape AI industry integration, capital allocation, US-China tech rivalry
Elon Musk recently confirmed the possibility of a merger between SpaceX and Tesla, signaling an ambition to redefine competition in the AI era beyond individual products and technological...
Thursday 29 October 2026
Kinsus explores AlN ceramics beyond glass for AI advanced packaging
Kinsus Interconnect Technology is exploring aluminum nitride (AlN) ceramics as a core material for substrates used in large-scale advanced packaging, seeking an alternative to glass...
Thursday 29 October 2026
Anthropic's IPO filing highlights China AI rivalry as model distillation, chip export controls emerge as key risks
US AI startup Anthropic has formally filed for an initial public offering (IPO) with the US Securities and Exchange Commission (SEC), identifying competitive pressure from Chinese...
Thursday 29 October 2026
Asus sees commercial PC prices rising nearly 10% in 2H26
Asus expects commercial PC prices in Taiwan to rise nearly 10% in the second half of 2026 after surging almost 30% in the first half, as higher memory and processor costs continue...
Wednesday 28 October 2026
SK Hynix says customers want more than twice the HBM it can supply
SK Hynix said customers are seeking more than twice the high-bandwidth memory (HBM) volume it can currently supply, as moves toward shorter memory stacks reflect supply shortages rather...
Wednesday 28 October 2026
UMC utilization tops 90% in 2H26 as AI demand drives expansion
United Microelectronics (UMC) saw operating momentum strengthen in the third quarter of 2026, as demand for artificial intelligence (AI), high-performance computing (HPC), communications,...
Wednesday 28 October 2026
Ex-TSMC CTO says Taiwan's research institutes get too much funding and train too little talent
Taiwan directs too much public research and development (R&D) funding to its national research institutes, according to Chenming Hu, a former chief technology officer of Taiwan...
Wednesday 28 October 2026
Oracle accelerates AI chip diversification with Cerebras, Google, and SambaNova deals
Oracle has signed partnerships with Cerebras and other chipmakers to host their chips in its cloud infrastructure. The Cerebras deal gives the chipmaker a new large customer to anchor...
Wednesday 28 October 2026
CHPT posts record 3Q26 results as nine-month profit jumps over 90%
Chunghwa Precision Test Tech (CHPT), a major semiconductor test interface supplier, posted record revenue and profit in the third quarter of 2026 as consolidated net profit reached...
Wednesday 28 October 2026
SK Hynix bets on EUV to extend 6F-squared DRAM as CXMT pushes 4F-squared
SK Hynix plans to extend the life of its existing 6F-squared DRAM cell architecture through extreme ultraviolet (EUV) lithography and process improvements, keeping 4F-squared and three-dimensional...
Wednesday 28 October 2026
India-based Spintronics AI weighs GaN chip fab in Madhya Pradesh
Hyderabad-based Spintronics AI Semiconductors said on October 27 that it is evaluating the feasibility of establishing a gallium nitride (GaN) semiconductor fabrication facility at...
Wednesday 28 October 2026
AMD to invest US$1 billion in Meta's stock sale as Helios racks enter testing
AMD is backing one of its largest AI customers with capital and chips. Alongside an update on its hardware work with Meta, the chipmaker said on October 27 that it will invest US$1...
Wednesday 28 October 2026
SK Hynix's Solidigm ties US$45B US NAND fab to Washington nod on China tool upgrade
Solidigm, the US-based subsidiary of SK Hynix, is in talks with the US Department of Commerce over a potential US$45 billion investment in a new NAND flash memory fabrication plant,...