Samsung Electronics is betting on new 3D memory architectures and tighter processor-memory integration as AI workloads put growing pressure...

Co-packaged optics (CPO) remains a key focus in the AI era. Beyond advanced packaging and testing, compound semiconductors, and other...

SK Hynix is considering options for its semiconductor packaging and testing facility in Chongqing, China, including bringing in an...

Sony Group and Taiwan Semiconductor Manufacturing Company (TSMC) plan to invest around JPY1 trillion (approx. US$6.3 billion) in a joint...

Taiwan Semiconductor Manufacturing Company (TSMC) reported record monthly revenue of NT$467.58 billion (approx. US$14.5 billion) for July...

SuperAlloy Industrial said after its August 7 board meeting that second-quarter 2026 results showed steady improvement in core profitability,...

Samsung Electronics has reportedly pushed the production yield of its sixth-generation high-bandwidth memory (HBM4) close to 80%, marking...

Chinese AI GPU developer Moore Threads is preparing a Hong Kong listing after first-half revenue jumped 147.42% year on year to CNY1.74...

Apple has tested DRAM from China's ChangXin Memory Technologies in iPhone and MacBook products as AI-driven memory shortages and rising...

SK Hynix is facing an expanding US patent dispute with MonolithIC 3D. A second US International Trade Commission (USITC) investigation...