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NEWS TAGGED OCP
Monday 11 August 2025
UCIe 3.0 doubles bandwidth, expands chiplet ecosystem — Intel's Das Sharma on AI and compatibility
The Universal Chiplet Interconnect Express (UCIe) standard has taken a decisive step forward with the release of version 3.0, delivering up to 64 GT/s throughput and doubling bandwidth...
Friday 8 August 2025
Non-AI workloads dominate data centers despite ChatGPT popularity
Research from SemiAnalysis reveals that non-AI workloads still dominate data center operations in the Asia-Pacific region, while AI-related workloads are expected to grow significantly...
Thursday 7 August 2025
Giga Storage expands into AI cooling and industrial park development
Giga Storage announced a partnership with electric bus manufacturer Tron-e on August 5, 2025, to co-develop the Xinpu Tron-e Smart Industrial Park. This initiative marks Giga Storage's...
Thursday 7 August 2025
Nvidia launches 800V HVDC architecture, passive component leaders enter the power supply chain
The power revolution in AI data centers has attracted global passive component leader Murata to actively participate. At the 2025 OCP APAC Summit held in Taiwan, Murata unveiled a...
Thursday 7 August 2025
UALink, Broadcom spar over Ethernet's role in AI
Despite Nvidia's absence at the 2025 OCP APAC Summit, rival factions within the anti-NVLink camp clashed over competing interconnect strategies for next-generation AI infrastructure...
Thursday 7 August 2025
ASE challenges TSMC’s photonics play with CPO packaging push
At the inaugural Open Compute Project (OCP) APAC Summit in Taipei, ASE Group Executive Vice President Tingu Yin Chang said surging AI computing demand has become the primary catalyst...
Wednesday 6 August 2025
Chiplet ecosystem gains momentum with Intel, TSMC, MediaTek backing

Leading semiconductor companies called for stronger adoption of open chiplet standards at the OCP APAC Summit 2025 in Taipei, highlighting...

Wednesday 6 August 2025
OCP APAC 2025: ASE doubles down on co-packaged optics as AI reshapes semiconductor design
As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning Co-Packaged Optics (CPO) and advanced packaging at the center...
Wednesday 6 August 2025
APN transforms transmission architecture, bringing new energy-saving solutions to Taiwan
With the rapid rise of generative AI (GenAI) and immersive applications, traditional network technologies are struggling to meet the surging data transmission demands. At the Open...
Wednesday 6 August 2025
Broadcom scales AI cloud with Jericho4 and bets on open interoperability
Broadcom has introduced its next-gen Ethernet switch chip, Jericho4, at the 2025 OCP APAC Summit, marking a key move toward scaling AI data center connectivity across regions. The...
Tuesday 5 August 2025
Broadcom unveils Jericho4 at OCP Taipei, pushes Ethernet as backbone of next-gen AI infrastructure
Broadcom has unveiled Jericho4, its latest AI fabric router chip designed to connect geographically dispersed data centers, reinforcing the company's belief that Ethernet—not...
Tuesday 5 August 2025
OCP APAC Summit 2025: Google sees Taiwan as key hub in global AI strategy
Taiwan plays a uniquely strategic role in Google's global operations and its expanding artificial intelligence infrastructure, according to Chris Verne, a longtime Google executive...
Tuesday 5 August 2025
Asia's moment in the AI age: APAC rises as infrastructure powerhouse at OCP, Taiwan forges global tech ties
As AI infrastructure continues to reshape global supply chains, the Open Compute Project (OCP) APAC Summit held in Taipei on August 5, 2025, highlighted the Asia-Pacific region's...
Tuesday 5 August 2025
Cultivating OCP, embracing open source
As cloud computing and data center industries accelerate the adoption of open architecture and open firmware, the traditional firmware ecosystem is undergoing deep restructuring.
Tuesday 5 August 2025
Interview: Astera Labs: AI infrastructure enters 2.0 with open AI interconnect options
AI data center chipmaker Astera Labs will showcase its next-gen interconnect technologies at this week's Open Compute Project (OCP) APAC event. In an exclusive interview with DIGITIMES,...