Memory manufacturers are swiftly following SanDisk's announcement of a 10% price increase for NAND products, signaling a broader industry move toward higher pricing amid expected...
On September 11, Chinese media reported that Huawei's semiconductor unit HiSilicon has entered a new leadership phase. Eric Xu resigned as chairman, with Jeffrey Gao assuming the...
Foxconn chairman Young Liu reportedly has recently visited the US and met with executives including Alphabet and Google CEO Sundar Pichai, according to industry sources. Meanwhile,...
Hermes-Epitek's semiconductor wafer testing solutions subsidiary, HTSI, will be listed on the over-the-counter (OTC) market on September 17, 2025. President Steven Wang stated that...
At the recent Hot Chips 2025 conference, Nvidia detailed its latest GB10 system-on-chip (SoC) architecture, representing a miniaturized application of the Blackwell GPU architecture...
Since taking over as CEO in March 2025, Lip-Bu Tan has rolled out sweeping organizational reforms at Intel, from business restructuring to large-scale layoffs. The overhaul has fueled...
Navitas Semiconductor is expanding its portfolio beyond consumer chargers to include advanced power solutions for solar inverters, motor drives, and AI data centers, Senior Field...
India's push to establish itself as a semiconductor hub is beginning to yield results in the back-end packaging segment, with Suchi Semicon moving from presentation slides to actual...
At SEMICON Taiwan, Dr. Chris A. Mack, chief technology officer of Fractilia, said that stochastic variation—randomness in how features are printed on silicon—has become...
At the packed China International Optoelectronic Exposition (CIOE) held at the Shenzhen World Exhibition & Convention Center, Taiwan's OtO Photonics stood out for its specialized...
Talent has long been the defining currency in the global semiconductor race. For decades, Chinese-born engineers with deep overseas experience drove China's rapid catch-up, fueling...
SK Hynix, a key supplier of HBM to Nvidia and other global clients, is reportedly scaling back its aggressive investment plans in thermo-compression bonders (TCB), equipment crucial...
To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September...
TSMC continues to advance its investment plan for the Pingtung Science Park, officially opening the site for vendors to begin construction. Arthur Chuang, vice president of Facility...
Micron Technology is reportedly deepening its ties with the Trump administration to secure a stronger foothold in the global semiconductor market. According to South Korean media,...
