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Tuesday 1 September 2026
Chinese OSAT earnings surge on AI packaging demand, but recurring profit tells a narrower story
Five listed Chinese outsourced semiconductor assembly and test providers reported first-half 2026 results in the last two weeks of August, showing net profit growth of up to 317%,...
Tuesday 1 September 2026
China specialty foundry XMC plans fourfold capacity growth around 3D integration, silicon photonics
Wuhan Xinxin Semiconductor Manufacturing Company (XMC) has laid out a 10-year expansion strategy centered on 3D integration, silicon photonics (SiPh), and specialty processes, targeting...
Tuesday 1 September 2026
SK Hynix explores Intel as second source for HBM base dies
SK Hynix is reportedly considering adding Intel Foundry as a second manufacturing source for high-bandwidth memory (HBM) base dies, a move that could reduce its reliance on TSMC as...
Monday 31 August 2026
Nvidia takes US$3.5 billion of MediaTek's record US$3.9 billion convertible bond
MediaTek has completed pricing on US$3.9 billion of overseas convertible bonds, more than NT$120 billion and what the company says is the largest overseas CB ever issued in Taiwan's...
Monday 31 August 2026
Gudeng sees double-digit advanced packaging growth from 2027
Demand for AI and high-performance computing (HPC) continues to drive semiconductor process development, with advanced nodes and advanced packaging entering a new cycle of capacity...
Monday 31 August 2026
Nvidia demand nearly doubles as supply meets only 70%
Nvidia reported second-quarter revenue for fiscal year 2027 of US$96.22 billion, a 106% year-over-year increase, driven by a 117% surge in data center revenue to US$89 billion. With...
Monday 31 August 2026
Marvell sees 2027 acceleration in scale-up optics
Marvell said on its fiscal second-quarter of 2027 earnings call that customers are actively planning to deploy scale-up optical solutions as early as 2027, with demand for near-package...
Monday 31 August 2026
TSMC tackles the AI I/O wall with two COUPE bandwidth paths and deeper heterogeneous integration
TSMC is sharpening its silicon photonics (SiPh) roadmap to address the widening gap between AI compute growth and chip-to-chip data movement, unveiling two bandwidth-scaling paths...
Monday 31 August 2026
Unimicron search puts spotlight on cross-border manufacturing for Taiwan's electronics sector
Unimicron, a major Taiwanese IC substrate maker, came under intense supply chain scrutiny last week after reports that prosecutors and investigators searched the company over a suspected...
Monday 31 August 2026
Update: SK Hynix breaks silence on Japan expansion rumors
To capture surging global demand for memory chips driven by artificial intelligence (AI), SK Hynix is actively exploring manufacturing and investment options in Japan.
Monday 31 August 2026
TSMC sees SiPh going mainstream in 2027
Silicon photonics (SiPh) will become mainstream in 2027, with market share topping 50%, as AI scale-out drives explosive growth in optical transceiver demand, said K.C. Hsu, TSMC's...
Monday 31 August 2026
Agentrys, agentic chip design startup backed by MediaTek, raises US$24.5M in funding
Chip design company Agentrys announced last week that it raised US$24.5 million in funding from backers including MediaTek. It is one among an emerging crop of startups using agentic...
Monday 31 August 2026
Gudeng chairman says trust underpins Taiwan supply chains amid Unimicron row
Gudeng Precision Industrial chairman Bill Chiu said on August 31, 2026, that trust is the core foundation of Taiwan's place in the global supply chain, as he commented on sensitive...
Monday 31 August 2026
Unimicron stock prices fall 10% daily limit, says origin probe covers PCBs, not substrates

Unimicron Technology shares plunged to Taiwan's 10% daily downside limit on August 31, the first trading session after prosecutors disclosed...

Monday 31 August 2026
Kingboard Laminates raises prices again as CCL shortages deepen
Kingboard Laminates, a leading Chinese copper-clad laminate (CCL) maker, has issued another price increase notice as shortages of core materials such as fiberglass cloth and copper...