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NEWS TAGGED CHIPS + COMPONENTS
Thursday 21 May 2026
FII challenges Broadcom and Nvidia as CPO race shifts to system integration
As AI computing demand continues to grow exponentially, pressure to upgrade data center network architectures is intensifying. Co-packaged optics (CPO) is moving from concept to real-world...
Thursday 21 May 2026
China memory supplier Biwin's AI photonics funding raises questions
China's AI infrastructure race is entering a new phase, with industry focus shifting from raw computing power toward data transmission efficiency.
Thursday 21 May 2026
AI server demand tightens passive component supply, lifting Taiwanese suppliers' share
Demand for artificial intelligence servers and related power systems is pushing lead times higher for high-end multilayer ceramic capacitors, elongated electrolytic capacitors, and...
Thursday 21 May 2026
TSMC's COUPE push puts Samsung's silicon photonics ambitions under pressure
Samsung Electronics has launched silicon photonics foundry services and entered pilot production, signaling during its latest earnings call that optical communication modules will...
Thursday 21 May 2026
Nvidia revenue surges 85% as data center sales jump 92%
May 20, Nvidia reported first-quarter fiscal 2027 revenue of US$81.6 billion, up 85% year-over-year and 20% sequentially. GAAP diluted EPS reached US$2.39, up 214% year-over-year,...
Thursday 21 May 2026
Samsung averts strike with last-minute labor deal, but deeper divisions remain
With less than an hour remaining before a planned strike was set to begin, Samsung Electronics and its labor union reached a tentative agreement late on May 20, narrowly avoiding what...
Wednesday 20 May 2026
ASML to deliver first High-NA chips within months despite cost concerns
ASML expects its first advanced semiconductors made using next-generation High-Numerical Aperture (High-NA) extreme ultraviolet (EUV) lithography equipment to ship within months.
Wednesday 20 May 2026
Alibaba's T-Head doubles down on AI infrastructure with Zhenwu M890
Alibaba Cloud has unveiled the Zhenwu M890, a new proprietary AI training and inference chip developed by its semiconductor subsidiary T-Head Semiconductor, as the Chinese cloud group...
Wednesday 20 May 2026
Amazon's AI chip push gains ground as Nvidia remains central to AWS

Amazon's yearslong push to build a credible alternative to Nvidia's AI chips is beginning to gain traction, as software improvements,...

Wednesday 20 May 2026
China's top NAND flash chipmaker YMTC begins IPO tutoring with Chinese banks
China's leading memory chipmakers are accelerating their push into public capital markets, with YMTC Group formally entering IPO guidance on May 19, shortly after domestic DRAM leader...
Wednesday 20 May 2026
GlobalFoundries invests in Playground Global Fund IV to advance semiconductor technology innovation
GlobalFoundries announced on May 19 that it is making a limited partner investment in Playground Global's Fund IV through GlobalFoundries Accelerate, the company's venture capital...
Wednesday 20 May 2026
Xiaomi halts ultra-thin smartphone production as memory costs squeeze prices
Xiaomi warns memory costs could push flagship phone prices past CNY10,000 (approx. US$1,468) in 2026, a development that would affect global consumers as higher-capacity models become...
Wednesday 20 May 2026
Former Samsung semiconductor head warns that memory prices and demand could fall sharply after 2028
The global semiconductor industry has been focused on a memory supercycle, with some forecasts suggesting the upturn could last until 2030. However, Kye-hyun Kyung, former head of...
Wednesday 20 May 2026
Google and Blackstone could lift ASIC demand with TPU leasing joint venture
Recent media reports say Google is set to team up with Blackstone to form a new cloud computing leasing company, with Blackstone as the main shareholder. The new venture aims to build...
Wednesday 20 May 2026
South Korea's defense chips 99% import-dependent as photonic supply chain crisis looms
Photonic semiconductors have become indispensable to modern defense — prized for their ultra-high-speed data processing, high capacity, low power consumption, and exceptional...