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Friday 18 September 2026
GaN is winning the AI power argument, not yet the cost battle

Gallium nitride (GaN) is emerging as a key power semiconductor for AI data centers, where rising rack power and the shift toward higher-voltage...

Friday 18 September 2026
Micron's Taiwan investment passes US$47 billion as it rallies fab construction suppliers

Micron held a conference for Taiwanese suppliers on September 17 under the theme of building at speed and growing at scale. The event...

Friday 18 September 2026
Apple and MediaTek's latest SoCs address overkill performance by reserving space for agentic AI
Apple unveiled its iPhone 18 Pro series featuring its inaugural 2nm smartphone silicon, the A20 Pro, which was followed by MediaTek's announcement of its own 2nm Dimensity 9600 Pro...
Friday 18 September 2026
AI's next infrastructure squeeze is storage: Seagate sees demand accelerating
Seagate's 2026 Data Infrastructure Readiness Report finds that enterprise AI strategies are moving beyond early-stage adoption toward broader deployment, increasing the importance...
Friday 18 September 2026
Taoyuan to sign high-end IC substrate MOU with Unimicron, Kinsus as Aerotropolis zone takes shape

In response to rapid AI market growth, the Taoyuan City Government announced plans to establish a 40-hectare high-end integrated circuit...

Friday 18 September 2026
Winbond's Infineon buyout puts GigaDevice under pressure

Winbond Electronics' US$1.12 billion acquisition of Infineon's NOR Flash and ferroelectric RAM (F-RAM) businesses has drawn close attention...

Thursday 17 September 2026
AMD pivots to China developer ecosystems as Nvidia retreats

As Nvidia gradually retreats from China's high-end AI accelerator market amid strict US export controls, Advanced Micro Devices (AMD)...

Thursday 17 September 2026
SK Hynix looks beyond HBM as inference workloads diversify
SK Hynix is expanding its memory strategy beyond the conventional GPU-HBM pairing as inference workloads split between latency-sensitive services and capacity-heavy, long-context a...
Thursday 17 September 2026
Trumpf eyes glass as AI demand drives packaging innovation
At the China International Optoelectronic Expo (CIOE), representatives from German laser and plasma generator maker Trumpf offered a glimpse into the company's push to extend its laser...
Thursday 17 September 2026
Samsung bets on zHBM as 2.5D memory nears its limits
Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising...
Thursday 17 September 2026
CXMT cashes in on the DRAM shortage — and takes aim at HBM
ChangXin Memory Technologies (CXMT) is emerging from the memory shortage with sharply higher profits and greater pricing power, giving China's largest DRAM maker more resources to...
Thursday 17 September 2026
TSMC reconsiders 12-inch equipment donation as Taiwan overhauls scope of research partnership
TSMC's planned donation of 12-inch equipment is facing changes as the government adjusts the scope of a semiconductor collaboration project, while Taiwan's National Science and Technology...
Thursday 17 September 2026
Memory LTAs lock up 50-70% of capacity
The memory industry remains in short supply, and major chipmakers are raising the share of capacity committed to long-term supply agreements (LTAs) while extending their duration from...
Thursday 17 September 2026
The Trump-Jensen speakerphone diplomacy: how Nvidia turned political pressure into a seat at the table
The relationship between Nvidia CEO Jensen Huang and US President Donald Trump has evolved from policy friction to a strategic alignment. The rapid shift in their dynamic reflects...
Thursday 17 September 2026
Ardentec, Sigurd race into silicon photonics TIA testing as US client books capacity
The global optical communications module market continues to grow, and Taiwan's test and packaging companies are moving to capture demand in silicon photonics (SiPh) transimpedance...