Chassis maker Catcher Technology stated that as the calendar moves into the year-end shopping season of 2025, promotional campaigns and a rebound in end-market demand are expected...
The South Korean government has signed a memorandum of understanding (MoU) with Arm Holdings, the UK-based silicon IP provider, to establish an educational institution tentatively...
Tata Group and Intel announced on December 8 that they have signed a memorandum of understanding to explore cooperation across semiconductor manufacturing, packaging and AI-focused...
US President Donald Trump said his administration will allow Nvidia to ship H200 AI accelerators to approved customers in China under conditions tied to national-security reviews...
Zhen Ding Technology said next-generation AI server platforms entering mass production will drive a major revenue lift in 2026 and set up a doubling growth phase in 2027. The company...
Baidu has responded to reports that its in-house chip business, Kunlunxin, is planning a separate listing on the Hong Kong Stock Exchange by stating it is currently evaluating the...
In a global GPU market dominated by US-based Nvidia, Chinese startup Moore Threads is rapidly emerging as a formidable local challenger. The driving force behind this bold counterattack...
Samsung Electronics is accelerating development of silicon photonics (SiPh) technology in an effort to solve bottlenecks in advanced AI processors and narrow the competitive gap with...
Huawei founder Ren Zhengfei recently gave a public talk at the Huawei Lianqiuhu R&D Center in Shanghai. He shared insights on AI, quantum computing, computing power, and chips...
SK Hynix announced a comprehensive organizational restructuring to expand its global research network and reinforce its leadership in the high-bandwidth memory sector. The strategic...
Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...
Samsung Electronics is reportedly gaining momentum across its foundry and memory operations as higher yields on its 4nm process and a broad recovery in DRAM demand position the company...
Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip...
SK Hynix has reportedly postponed the mass production timeline for its sixth-generation high bandwidth memory (HBM4) from the end of the second quarter of 2026 to the third quarter...
