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Monday 21 September 2026
Ampoc AI PCB orders surge as it expands into CPO

Printed circuit board (PCB) wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on...

Monday 21 September 2026
ACM Research's Shanghai unit leans on overseas installs, panel-level plating for its next leg of growth

ACM Research Shanghai is staking its growth case on two developments: planned tool installations at customers outside mainland China...

Monday 21 September 2026
India roundup: Semicon India 2026 puts commercial production and supplier investment in focus
India's semiconductor push is moving from policy to production, with new government funding, supplier investments, rising deal activity and expanding equipment, materials, testing...
Monday 21 September 2026
Analysis: The race to superintelligence meets a demand for restraint — and the industry is split
The extraordinary technological progress humanity has witnessed since AI first emerged has propelled a fundamental shift in industrial development. With experts hailing AI as the next...
Sunday 20 September 2026
Charts: Two-thirds of Taiwan's chip equipment growth comes from testing AI chips

Taiwan's listed semiconductor equipment, components, and solutions suppliers are growing at nearly twice the pace of the chipmakers...

Sunday 20 September 2026
Chinese memory supply is disruptive to pricing, Acer's Jason Chen says, as shortages ease
PC component shortages are easing, Acer chairman and CEO Jason Chen said, with memory tight only at the high end of DDR5 and CPUs no longer in short supply. Suppliers across the bill...
Saturday 19 September 2026
Memory recovery, price hikes lift Niching IC substrate outlook, order visibility through 2H27

Semiconductor packaging and testing materials distributor Niching Industrial hosted an investor conference on September 17. chief financial...

Saturday 19 September 2026
Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged...

Saturday 19 September 2026
Charts: Taiwan's memory makers are outgrowing TSMC by a factor of eight

Taiwan's chipmakers are having their best year in a decade, and the headline number belongs to TSMC. The more interesting one does n...

Saturday 19 September 2026
CXL adds memory capacity, but HBM retains its bandwidth edge

Growing memory requirements are increasing interest in Compute Express Link (CXL) as a way to add capacity beyond locally attached memory...

Saturday 19 September 2026
Ventec invests NT$1.5 billion in Kunshan expansion for AI, HDI orders

Copper-clad laminate (CCL) manufacturer Ventec International Group has approved an expansion budget of NT$1.5 billion (approx. US$47.11...

Friday 18 September 2026
Solidigm weighs first US NAND fab, explores upstate New York

Solidigm, the US NAND flash subsidiary of SK Hynix, is considering building its first NAND manufacturing plant in the US, with upstate...

Friday 18 September 2026
Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management
China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have highlighted ultra-wide bandgap (UWBG) semiconductor materials,...
Friday 18 September 2026
Winbond cements server NOR lead with Infineon deal
Winbond Electronics is expanding its NOR Flash footprint and has agreed to pay US$1.12 billion in cash to acquire Infineon's NOR Flash and F-RAM businesses, a move that will lift it...
Friday 18 September 2026
Corning to raise display glass substrate prices 15% from 4Q26
Corning, the US glass substrate supplier, will raise prices for its yen-denominated display glass substrate products by 15% or more worldwide starting in the fourth quarter of 2026,...