CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Wednesday 12 August 2026
Japan's US$430B 2040 chip plan hinges on Rapidus 2nm

Japan has drawn up a plan for more than JPY370 trillion (approx. US$2.33 trillion) in combined public and private investment across 17 strategic...

Wednesday 12 August 2026
OCP APAC 2026: Microsoft leans on Taiwan supply chain for 'silicon-to-systems' AI buildout

Microsoft sources roughly 70% of the hardware content in its cloud infrastructure from Taiwan and the wider Asia-Pacific region, executives...

Wednesday 12 August 2026
MediaTek, Realtek, Himax, Elan eye optical communications boom in 2027
The use of optical communications in cloud AI data-center interconnect architectures is rising sharply, and Taiwan IC design firms including MediaTek, Realtek Semiconductor, Himax...
Wednesday 12 August 2026
Cash deposits reshape memory supply deals
The global memory industry has embraced a new business model over the past two quarters. Memory manufacturers are not only signing multi-year supply agreements with customers, but...
Wednesday 12 August 2026
OCP APAC 2026: Nvidia, Broadcom diverge on how to scale AI networks beyond the rack
Nvidia and Broadcom outlined different paths for scaling AI networks at the OCP APAC Summit in Taipei on Aug. 11, as clusters expand from rack-scale systems to entire data centers...
Wednesday 12 August 2026
DB HiTek profit jumps 43% as TSMC, Samsung scale back 8-inch capacity
DB HiTek posted a 43% jump in second-quarter operating profit as tighter 8-inch foundry supply and stronger power semiconductor demand kept its fabs running near full capacity, with...
Wednesday 12 August 2026
Haechitech enters eSSD sensors as it prepares Kosdaq listing

South Korean sensor IC designer Haechitech is moving beyond smartphone compass chips into enterprise solid-state drive temperature sensors,...

Wednesday 12 August 2026
Nichidenbo sees MLCC supply tightness as AI pushes lead times to 36 weeks

Passive component distributor Nichidenbo said supply of MLCCs and other products remains tight as AI servers and ASIC applications...

Wednesday 12 August 2026
OCP APAC 2026: TSMC says AI advanced packaging enters system-level battle

AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device...

Wednesday 12 August 2026
SPIL breaks ground on NT$100B Douliu plant, targeting operations in 2028

Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding (ASEH), broke ground on a new plant in Douliu, Yunlin...

Wednesday 12 August 2026
South Korea deepens semiconductor ceramics collaboration amid chip industry expansion

South Korea is moving to reinforce its semiconductor materials and components ecosystem as chipmakers accelerate capacity expansion...

Wednesday 12 August 2026
Fudan's single-electron memory breakthrough opens new path for 2D chip scaling
China's effort to advance memory technology has gained a new research avenue, with a Fudan University team developing a room-temperature single-electron non-volatile memory device...
Wednesday 12 August 2026
Lumentum targets US$2B quarterly run rate as optical capacity expansion accelerates

Lumentum Holdings said it is pulling forward capacity investments across lasers, transceivers, and optical circuit switches (OCS) after...

Wednesday 12 August 2026
OCP APAC 2026: ASE unveils AI packaging trilogy

Demand for AI infrastructure is forcing chipmakers and data-center operators to rethink how systems are built, with implications for...

Wednesday 12 August 2026
Samsung HBM4 yield nears 80% in push to rival SK Hynix

Samsung Electronics' production yield for its sixth-generation high-bandwidth memory, HBM4, has reportedly approached 80%, marking a...