Episil held an earnings call on October 7, saying silicon carbide (SiC) capacity utilization has rebounded quickly from 30% at a low point to nearly 90% now. If 6-inch order demand...

MAtek, a leading semiconductor testing company, reported September 2026 revenue of NT$569 million (approx. US$17.8 million), up 12.31% year-over-year. Revenue for the first nine months...

Novatek reported stronger September and third-quarter 2026 revenue, suggesting seasonal smartphone demand and growth in edge AI chips are supporting the global display and chip supply...

Changs Ascending said orders tied to semiconductor customers' new plant construction, equipment arrivals, and project acceptance schedules were gradually fulfilled and recognized as...

Huawei consumer business group chairman Richard Yu said surging memory component costs have added more than US$200 to the hardware cost of each Huawei smartphone, putting fresh pressure...

As explosive AI computing demand drives hardware architecture change, Taiwan Printed Circuit Association (TPCA) is set to open its annual flagship event, with the 21st International...

Samsung Electro-Mechanics (Semco) has reportedly completed initial reliability testing of its 100mm glass substrates and moved to package-level verification using customer chips, marking...

South Korea's JNTC plans to invest KRW347 billion (approx. US$259 million) in glass substrate manufacturing as it reports a sharp reduction in copper-filling time for thick glass cores,...

Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years,...

MediaTek reported its September and third-quarter 2026 revenue results, with September revenue of NT$55.40 billion (approx. US$1.74 billion), down 13.69% from the previous month and...

GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS ecosystem at its Malta,...

Samsung Electronics' next-generation 12-layer HBM4E product, a type of high-bandwidth memory (HBM), has reportedly cleared customer quality validation from Nvidia and major hyperscale...

AI chip manufacturing demands are accelerating development of advanced logic and packaging technologies, prompting Applied Materials and Intel to expand their collaboration on next-generation...

Memory module makers Innodisk and Apacer both reported year-over-year and month-over-month revenue growth for September 2026, supported by steady demand from industrial control, edge...