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Wednesday 2 September 2026
AI packaging demand surges, ASE EVP identifies two manufacturing bottlenecks
On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by SEMI, TSMC, and ASE, held the 3DIC Global Summit on...
Wednesday 2 September 2026
China memory-module makers report surging profits, strained cash flow
Seven listed Chinese memory-module and memory-distribution companies have filed first-half 2026 results, and the headline numbers are the largest the tier has ever reported. The more...
Wednesday 2 September 2026
Chinese MRAM chipmaker ICY Tech rethinks HBM for rack-scale AI inference
China-based ICY Tech has introduced its uHBM and uLPU AI inference architectures, extending persistent MRAM computing from validation silicon into a product roadmap spanning compute-memory...
Wednesday 2 September 2026
Nvidia pushes into HBM base dies as NVHBM battle heats up
The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
Wednesday 2 September 2026
Global quantum industry accelerates as Taiwan eyes Asia hub
As quantum commercialization gathers pace worldwide, Taiwan is linking up with multiple countries to push for an Asia hub for quantum technology, industrial applications, international...
Wednesday 2 September 2026
Gudeng pursues 'Taiwan Plus One' overseas strategy, says cost is not sole consideration
Gudeng Precision Industrial chairman Bill Chiu said on August 31 that the company has begun building out its global manufacturing footprint. Its Japan plant is expected to complete...
Wednesday 2 September 2026
Plug and Play plans US$100 million Taiwan fund, hopes one of its next five unicorns is Taiwanese
Saeed Amidi has been in Taiwan for about 20 hours, and he has been asking everyone the same question.
Tuesday 1 September 2026
SK Hynix touts up to 5.15x inference gains with custom HBM

SK Hynix is pushing computation deeper into high-bandwidth memory (HBM), saying a custom HBM architecture that places compute functions...

Tuesday 1 September 2026
Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain
Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...
Tuesday 1 September 2026
Taiwan chip equipment maker Skytech opens advanced process lab with TSMC backing
Skytech and TSMC have opened an Advanced Process Laboratory focused on next-generation semiconductor manufacturing, highlighting TSMC's continued efforts to support Taiwan's domestic...
Tuesday 1 September 2026
Japan's chip materials makers reportedly deepen Taiwan ties as AI reshapes supply chains
Japanese semiconductor materials suppliers Ajinomoto and Daikin Industries are expanding their presence in Taiwan as the AI boom fuels demand for advanced chip materials and encourages...
Tuesday 1 September 2026
Imec CEO: AI era pushes broader ties between chip, model and CSP players
Imec CEO Patrick Vandenameele said during a media briefing at SEMICON Taiwan 2026 that the Belgian research center is broadening its collaboration base in the AI era, extending beyond...
Tuesday 1 September 2026
ASE CEO describes AI resource squeeze as a short-term problem
AI's early-stage growth is creating a short-term squeeze on land, talent, capital, and power in Taiwan, but there is no such thing as a world that cannot do without Taiwan, ASE Technology...
Tuesday 1 September 2026
Micron opens Tainan plant after 6.5 months amid labor dispute
Micron's plant at the Southern Taiwan Science Park, which it purchased from AUO for NT$7.4 billion (US$233.8 million) in August 2024, is now officially in operation, marking a key...
Tuesday 1 September 2026
Marvell CTO: power and density bottlenecks are driving CPO adoption in AI data centers
Speaking at the Silicon Photonics Global Summit ahead of Semicon Taiwan 2026, Marvell Technology CTO Radha Nagarajan highlighted that the core focus for upgrading connectivity in the...