CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Friday 10 April 2026
AUO eyes CPO and LEO satellites as Innolux pushes FOPLP growth
AUO and Innolux are accelerating their expansion beyond traditional display panels, with Innolux's non-display revenue surpassing 51% in 2025, mainly driven by automotive applications...
Friday 10 April 2026
CXMT targets 12-layer HBM production by 2027, closing gap with Korea
China's largest memory maker CXMT is targeting mass production of 12-layer high-bandwidth memory (HBM) by 2027, positioning itself to challenge mainstream specifications long dominated...
Friday 10 April 2026
Praise Victor Industrial aims to break Fujibo's soft pad dominance with 2Q26 sample certification
As AI and high-performance computing (HPC) demand surges and the semiconductor supply chain undergoes accelerating restructuring, structural changes are emerging in the critical materials...
Friday 10 April 2026
Transcom Technology sees flat 2026 revenue after Taiwan budget delays, but India order may broaden international reach
Transcom Technology expects flat full-year revenue for 2026 amid stalled progress in Taiwan's defense budget, which is potentially delaying deliveries of Gong-3 and Gong-4 missile...
Thursday 9 April 2026
Haptic touchpads and AI vision chips propel Elan's early 2026 growth

Taiwan-based touch IC design leader Elan Microelectronics announced its March 2026 and first-quarter revenue figures, posting robust growth...

Thursday 9 April 2026
Memory shortage persists, ASPs surge up to fivefold, says module maker chief
Memory prices are rising sharply, with Transcend Information chairman Peter Shu warning that supply-demand pressure will intensify through 2026 despite weakening consumer demand.
Thursday 9 April 2026
Samsung, SK Hynix pivot to long-term memory deals; Kioxia signals dividend confidence

Samsung Electronics and SK Hynix are reportedly shifting to multi-year memory supply agreements, marking a structural change in how the...

Thursday 9 April 2026
Aspeed and ASMedia propelled to top IC design ranks
Although Taiwanese firms have largely missed the core AI chip development battlefield, a few with critical technological barriers have broken through—most notably Aspeed and...
Thursday 9 April 2026
Samsung P4 fab nears completion, expanding 1c DRAM capacity
Samsung has entered the final phase of equipment investment at its P4 fab in Pyeongtaek, issuing purchase orders (POs) for front-end tools for Phase 2 (Ph2) and Phase 4 (Ph4). According...
Thursday 9 April 2026
When will CPO actually see mass production?
The market continues to closely watch the deployment of co-packaged optics (CPO) technology in cloud AI, driven by the desire of the silicon photonics (SiPh) ecosystem to see a tangible...
Thursday 9 April 2026
Hon Precision sees surging demand for AI infrastructure components
Hon Precision's strong March and first quarter 2026 results signal accelerating global demand for AI infrastructure components, with potential ripple effects on data center procurement...
Thursday 9 April 2026
Why global chipmakers want to join TSMC's certified supply chain
TSMC's long-established supplier verification and management system is gradually becoming an industry standard, attracting major players worldwide. Samsung Electronics, Intel, Japan's...
Thursday 9 April 2026
GITEX AI Asia opens in Singapore as focus shifts to infrastructure, deployment

Artificial intelligence is entering a more infrastructure-driven phase, as companies at GITEX Asia 2026 highlighted growing constraints...

Thursday 9 April 2026
Samsung profit jumps on memory rally, chips drive over 90% of earnings
Samsung Electronics posted record first-quarter 2026 results, with more than 90% of earnings tied to its memory business, underscoring the scale of the AI-driven memory upcycle.
Thursday 9 April 2026
Samsung Foundry launches new 2nm temperature sensor IP to improve chip thermal and area efficiency
Samsung Electronics' foundry division has introduced a new temperature sensor intellectual property (IP) designed to address heat dissipation and area efficiency challenges in advanced...