Intel CEO Lip-Bu Tan is reshaping the chipmaker's engineering culture and foundry strategy, confirming that 14A remains on track while revealing that early development has begun on...
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology...
On May 20, 2026, DIGITIMES held its Tech Forum, where senior analyst Jim Hsiao delivered a presentation, "AI server market outlook and trends amid the explosion of agent applications."...
Nvidia has positioned its specialized LPX accelerator as a niche product designed specifically for low-latency, high-speed token generation rather than broad-market enterprise workloads...
At the recent Plug and Play Silicon Valley May Summit, the semiconductor and supply chain sessions highlighted a critical shift toward hardware-level security, energy efficiency for...
Advanced Micro Devices (AMD) CEO Lisa Su stated that the company plans to invest more than US$10 billion in Taiwan's industrial ecosystem to accelerate the development of artificial...
US President Donald Trump, after recently concluding a visit to China, again publicly accused Taiwan of having "stolen our chip industry." This was not the first time he had made such...
Nvidia's H200 was a major focus after the Trump-Xi meeting, but hopes for sales into China have faded after US President Donald Trump's latest remarks. Trump said Chinese President...
AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for...
Nvidia has unveiled a strategic expansion of its silicon portfolio, detailing a four-pronged commercial approach for its new Vera central processing unit. The chipmaker expects the...
Nvidia has detailed a significant structural shift in its data center revenue reporting, introducing a new market segmentation that separates traditional hyperscale cloud providers...
GigaDevice said tight supply and rising prices across DRAM, NOR Flash, and SLC NAND Flash continued to fuel strong first-quarter 2026 earnings growth, supported by recovering demand...
India's first semiconductor mission brought fabs, OSAT units, and chip projects into the policy pipeline. Its second phase is being shaped around a harder question: whether India can...
AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used...
Demand for power components is surging as AI servers adopt high-voltage direct current power delivery and advanced cooling technologies. This shift could increase component density...
