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Thursday 22 January 2026
SAS shifts SiC strategy with 12-inch wafers and AI glasses innovation
Facing intense price wars triggered by China's rapid expansion in the global silicon carbide (SiC) wafer industry, Sino-American Silicon Products (SAS) chairwoman Doris Hsu has decisively...
Thursday 22 January 2026
Nvidia overtakes Apple as TSMC's largest customer

Nvidia CEO Jensen Huang said rising demand for AI computing has pushed the company past Apple to become the largest customer of Taiwan...

Thursday 22 January 2026
Kioxia warns of tight NAND supply through 2027

Kioxia, the world's third-largest manufacturer of NAND flash memory, has largely exhausted its production capacity for the current year...

Thursday 22 January 2026
GlobalWafers' Texas plant holds six-phase expansion potential
GlobalWafers chairwoman Doris Hsu said in a January 21, 2026, media interview that with easing inflation pressures and some central bank policy adjustments, the global economy is experiencing...
Thursday 22 January 2026
GlobalWafers chair sees Taiwan's semiconductor edge, says AI is irreversible
On January 21, 2026, GlobalWafers chairwoman Doris Hsu spoke to the media about the recent US-Taiwan tariff agreement, which lowers Taiwan's reciprocal tariffs to 15% without stacking...
Thursday 22 January 2026
GlobalWafers eyes quarterly revenue growth in 2026; chair sees better market than last year
GlobalWafers chairman Doris Hsu told the media on January 21, 2026, that the company's global expansion plans are starting to pay off, with subsidiaries in Niigata and Utsunomiya,...
Thursday 22 January 2026
Chinese AI chipmakers face mixed reactions to Nvidia H200 block
The US has confirmed that under a new set of stringent regulations, Nvidia's H200 is permitted to be exported to the Chinese market, and Chinese customers have expressed strong demand...
Thursday 22 January 2026
Taiwan advances second-phase quantum strategy, betting on hybrid computing and global partnerships
Taiwan's government is moving its quantum technology development program into a second phase, centered on building a national-level heterogeneous hybrid computing platform that integrates...
Thursday 22 January 2026
PSMC to upgrade DRAM processes as demand strengthens

Following its announcement to sell the Tongluo fab to Micron Technology, Powerchip Semiconductor Manufacturing (PSMC) provided an update...

Thursday 22 January 2026
Cloud ASIC shipments set to surge in 2026; memory capacity remains key risk
2026 is shaping up as a breakout year for cloud application-specific integrated circuit (ASIC) shipments. Not only has Broadcom secured mass production projects with multiple major...
Thursday 22 January 2026
Google's TPU strategy said to give Inventec larger role in AI server manufacturing

Servers built around custom AI chips, known as application-specific integrated circuits (ASICs), have emerged as a focal point of the...

Thursday 22 January 2026
Taiwanese firms prepare for silicon photonics and CPO packaging opportunities as AI data center continues growth
As generative AI technologies scale up, the semiconductor industry is poised for a significant transition from copper-based interconnects to optical solutions to meet the stringent...
Thursday 22 January 2026
US-Taiwan tariff deal clears key uncertainty for chipmakers, says GlobalWafers chair
GlobalWafers chairwoman Doris Hsu spoke to the media on January 21, outlining the company's current US strategy and sharing her views on the recently finalized US-Taiwan tariff agr...
Thursday 22 January 2026
Nanya expects memory shortage through 1H27 amid surging demand
Strong memory demand propelled Nanya's profits to soar in the fourth quarter of 2025, with president Pei-Ing Lee highlighting sustained AI and general server needs driving a robust...
Thursday 22 January 2026
Rising China-Japan tensions put semi materials in the spotlight

As tensions between China and Japan escalate over export controls on rare earths and semiconductor materials, China is accelerating efforts...