News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Thursday 9 October 2025

Applied Materials advances AI chip performance with hybrid bonding and e-beam metrology

To enhance the performance of advanced logic and memory chips required for AI computing, global semiconductor equipment leader Applied Materials has unveiled new semiconductor manufacturing...

Thursday 9 October 2025

TSMC's 3Q25 revenue surpasses high forecast as AI drives advanced process demand

TSMC reported consolidated revenue of NT$330.98 billion (US$10.8 billion) in September 2025, a slight 1.4% decrease from August but a 31.4% increase year-over-year, marking a record...

Thursday 9 October 2025

Semicon West relocation doubles attendance as US chip investment surges

The annual SEMICON West relocated for the first time to Phoenix in 2025, the new hub of US chip manufacturing. Compared to previous years, the event saw a 45% increase in exhibitors,...

Thursday 9 October 2025

Commentary: China's TGV ambitions face an uphill battle

China's development of through glass via (TGV) technology, crucial for advanced semiconductor packaging in AI and high-performance computing chips, encounters significant hurdles,...

Thursday 9 October 2025

China tightens rare earth export controls with new ban on overseas assistance

China's Ministry of Commerce issued two major new rare earth regulations on October 9, 2025, including a landmark rule that imposes export controls on rare earth technologies and...

Thursday 9 October 2025

Phoenix Silicon International expands wafer production capacity with new FAB3B facility

Phoenix Silicon International (PSI) has officially launched the expansion of its Zhonggang FAB3A/B manufacturing complex, announcing plans for the new FAB3B plant to begin production...

Thursday 9 October 2025

Beijing tightens tech controls, linking rare earths to AI and national security

In a major escalation of its tech resource policy, China's Ministry of Commerce announced new export restrictions on rare earth materials,...

Thursday 9 October 2025

Taiwanese firms set to revamp HR deployment as US, Thailand tighten expat rules

The restructuring of global supply chains under the Donald Trump 2.0 era is forcing companies to rethink human resource strategies. At TSMC's wafer fabrication facilities in Arizona,...

Thursday 9 October 2025

Glass substrate TGV: China's edge to capture AI HPC packaging

China's glass substrate through glass via (TGV) industry has made significant progress, with companies pushing innovations from materials to mass production. Despite challenges in...

Thursday 9 October 2025

Memory module makers halt consumer DRAM price quoting during China's National Day holiday

The ongoing DRAM shortage is intensifying as memory module manufacturers suspend consumer DRAM price quotes during China's National Day holiday, signaling a sharp rise in spot market...

Thursday 9 October 2025

Taiwan pushes ahead with InnoTech Expo 2025 amid US chip tariff threat

The Taiwan InnoTech Expo (TIE) 2025 will take place as scheduled on October 16–18 at the Taipei World Trade Center Hall 1, signaling confidence in Taiwan's innovation momentum...

Thursday 9 October 2025

Lessons Taiwan should learn from China's involution

In recent years, China's traditional industries and those with lower technical barriers have faced intensifying competition, with bad money driving out good. This trend threatens...

Thursday 9 October 2025

Parallel development key to meet surging AI packaging demand, says TSMC Advanced Packaging Division VP

SEMICON West 2025 was held for the first time in Phoenix, Arizona, with a significant increase in the number of CEO Summits and various forums compared to previous years, with one...

Thursday 9 October 2025

Nvidia's Taiwan headquarters plan hits land hurdles, but government pledges support

Taiwan's Ministry of Economic Affairs (MOEA) has reaffirmed its full support for Nvidia's plan to establish its first overseas headquarters...

Thursday 9 October 2025

Cisco launches new router and chip to link AI data centers across long distances

Cisco Systems introduced a new high-capacity routing system and networking chip designed to connect data centers handling artificial intelligence (AI) workloads over vast distances,...

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