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    Alibaba Cloud launches Zhenwu M890 supernode for commercial use
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    NEWS TAGGED CHIPS + COMPONENTS
    Friday 14 August 2026
    Applied Materials sets 2028 capacity target as it commits new manufacturing hires
    Applied Materials used its fiscal third-quarter earnings call to lay out a multi-year capacity build rather than just a strong quarter. Alongside record results, the company said it...
    Friday 14 August 2026
    Hua Hong's fabs were already full — price is what finally made them profitable
    Hua Hong Grace Semiconductor has been running its fabs flat out for more than a year without earning an operating profit on the work. The June quarter ended that. Revenue reached a...
    Friday 14 August 2026
    SMIC's pricing power arrives as AI pushes mature-node work into China
    China's largest contract chipmaker has spent most of the past two years increasing volume without much to show for it in terms of margins. The June quarter broke that pattern. Semiconductor...
    Friday 14 August 2026
    Musk hints at FEL light source for Terafab; ASML eyes FEL-EUV push
    After EVs, rockets, and humanoid robots, Elon Musk appears to be turning his attention to optimizing the chip manufacturing process. When he unveiled a US$16.8 billion initial investment...
    Friday 14 August 2026
    Samsung chip design embraces AI, but loss of control and hallucinations remain a problem
    The AI wave is sweeping through the chip industry, but hallucinations, loss of control, and cybersecurity risks remain unresolved even as efficiency leaps. Youngsik Kim, head of the...
    Friday 14 August 2026
    SK Hynix advances Yongin fab construction for 2027 cleanroom launch
    SK hynix has pushed construction of its semiconductor campus in Yongin, Gyeonggi Province, South Korea, to 87% completion as it targets February 2027 for the start of operations at...
    Friday 14 August 2026
    Kioxia eyes customer trials for PCIe Gen6 optical SSD

    Kioxia is developing a PCIe Gen6 optical SSD and hopes to work with customers on its next prototype, as the Japanese memory maker tackles...

    Friday 14 August 2026
    Intel tests system memory to ease AI KV-cache pressure
    Intel tests presented at the OCP APAC Summit 2026 that moving the key-value cache used in large language model (LLM) inference from GPU memory to system DRAM can raise serving throughput...
    Friday 14 August 2026
    Rapidus targets 8-reticle interposers by 2030
    Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
    Friday 14 August 2026
    Samsung and SK hynix push AI deeper into fabs as semiconductor manufacturing enters autonomous era
    As the world enters an AI-powered era where the persistent need for more complex architectures is driven by rising demands for higher computing performance, one bottleneck confronting...
    Friday 14 August 2026
    PixArt revenue rises on game-console demand as margin pressure grows

    PixArt's latest results signal how shifting demand across consumer electronics and emerging sensor markets can reshape profitability...

    Friday 14 August 2026
    Interview: 'Modern warfare is a battle of PAs'–Transcom targets overseas defense, LEO satellite growth

    Amid escalating geopolitical tensions, defense awareness is rising rapidly worldwide, with drone and counter-drone technologies becoming...

    Friday 14 August 2026
    ABF substrate boom lifts Eternal Precision prices 20%

    Strong Ajinomoto Build-Up Film (ABF) substrate demand has driven a surge in orders for vacuum laminating equipment, with Eternal Precision...

    Friday 14 August 2026
    Beyond silicon and copper: OCP APAC looks under the hood of future AI infrastructure
    AI's appetite for compute is growing at such speeds that simply building bigger versions of today's data centers may no longer cut it.
    Friday 14 August 2026
    Korea's CNT pellicle race heats up as aweXome Ray pushes toward EUV commercialization
    As South Korea's major memory manufacturers race to secure next-generation lithography technologies for increasingly advanced process nodes, the approaching High-NA EUV era is adding...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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