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    China pushes domestic AI models to pair with local chips
    3h 4min ago
    Commentary: Stellantis is funding America's car future — and China may be the one building Europe's
    3h 4min ago
    GlobalWafers : Asian capacity is full; Texas ramp-up and square wafer shipments in 4Q26
    3h 4min ago
    Intel CEO Lip-Bu Tan set for Taiwan trip ahead of COMPUTEX 2026
    3h 4min ago
    Samsung launches first 6K gaming monitor to defend premium market
    3h 4min ago
    Samsung to shift P4 output toward HBM, tightening DRAM supply
    3h 5min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Monday 25 May 2026
    Beyond Silicon Valley: Lam Capital's startup contest goes global
    Lam Research's Lam Capital recently held its fourth startup competition, drawing teams from the US, South Korea, Singapore, India, and Taiwan to vie for a sizeable prize pool. US startup...
    Monday 25 May 2026
    Huawei reveals post-Moore semiconductor roadmap targeting 1.4nm-equivalent chip performance
    As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect,...
    Monday 25 May 2026
    Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs
    Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products...
    Monday 25 May 2026
    India-based Cyient Semiconductors raises US$30 million to scale power chips for global AI markets
    Cyient Semiconductors has secured a total of about US$30 million in financing from Edelweiss-managed funds and co-investors, comprising a US$10 million equity investment at a valuation...
    Monday 25 May 2026
    Nvidia's reporting pivot and AMD's US$10B Taiwan bet signal a new frontier in AI chip war
    Nvidia's structural pivot to isolate its ACIE market and AMD's US$10 billion investment in Taiwan infrastructure signal a profound realignment in the AI chip war. Both developments...
    Monday 25 May 2026
    Lam Research CEO: New fabs alone will not solve chip bottlenecks
    Lam Research CEO Tim Archer said artificial intelligence and robotics can help chipmakers improve fab productivity as the semiconductor industry faces memory capacity constraints,...
    Monday 25 May 2026
    Nvidia's Vera CPU push lifts LPDDR outlook for Samsung, SK Hynix
    Nvidia's decision to sell its Vera CPU as a standalone chip could create a new source of demand for low-power DRAM, adding another pressure point to the already tight memory supply...
    Monday 25 May 2026
    AI servers drive order growth; Weltrend's fan motor driver IC visibility strong
    At its earnings conference, Weltrend Semiconductor described the first quarter of 2026 as an exceptional one. Despite the period being historically slow, the company posted year-over-year...
    Monday 25 May 2026
    Nan Pao joint venture nears full capacity as semiconductor demand rises

    Nan Pao Resins Chemical is accelerating its push into the high-end semiconductor materials market through a joint venture with Advanced...

    Monday 25 May 2026
    Anthropic-Microsoft deal could broaden ASIC demand across cloud supply chains
    Anthropic has reportedly approached Microsoft about renting AI computing power running on Microsoft's in-house chips to expand support for its Claude model business. The move is a...
    Monday 25 May 2026
    AI data centers spark 800V HVDC rush for Taiwan lead frame suppliers

    The shift toward 800V high-voltage direct current (HVDC) power architectures in AI data centers is driving a surge in demand for power...

    Monday 25 May 2026
    Ample Electronic says AI demand is boosting MLCC-related passive components
    Ample Electronic said rising demand from artificial intelligence end customers has driven a stronger market for multilayer ceramic capacitors and related passive components, lifting...
    Monday 25 May 2026
    Huawei bypasses 3D NAND limits with 122TB AI SSD packaging breakthrough

    Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies...

    Monday 25 May 2026
    Analysis: Lisa Su moves on China — and Nvidia's CUDA moat
    For AMD CEO Lisa Su, the current moment presents an opening that Nvidia does not have. Nvidia's high-end chips have repeatedly faced scrutiny and export restrictions in China, and...
    Monday 25 May 2026
    Weekly news roundup: TSMC faces its first real rivals; Agibot claims 100% success rate in factory deployment
    Below are the most-read DIGITIMES Asia stories from the week of May 18-24, 2026:
    1/384 pages
    CPC
    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook