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Wednesday 23 September 2026
YMTC wins German injunctions against Micron in latest round of NAND patent battle
Micron is facing fresh pressure on multiple fronts after Germany's Munich I Regional Court sided with Chinese memory maker YMTC and issued two injunctions over alleged infringement...
Wednesday 23 September 2026
Samsung LPDDR6 validated by Qualcomm for next-gen Snapdragon platform
AI workloads are pushing cloud, edge, and mobile devices toward tighter power budgets and heavier data traffic, making memory efficiency a growing global issue. Samsung is positioning...
Wednesday 23 September 2026
Biwin Storage commits US$672M to double down on 2.5D packaging, compute-memory integration

Biwin Storage Technology plans to invest CNY4.5 billion (approx. US$672 million) in the third phase of its wafer-level advanced packaging...

Wednesday 23 September 2026
ZDT prices US$800M ECB to expand AI server PCB push

Printed circuit board (PCB) maker Zhen Ding Technology (ZDT) Group completed pricing of its sixth overseas convertible bond issue on...

Wednesday 23 September 2026
Hermes-Epitek eyes CPO test revenue in 2027

Archie Hwang, the founder and chairman of Hermes-Epitek, appeared before the media alongside Hermes Testing Solutions Inc. (HTSI) executives...

Wednesday 23 September 2026
Nvidia's 800V power shift hands Taiwan's capacitor makers a new AI segment

As AI computing workloads surge, demand for higher GPU and CPU performance is triggering exponential growth in data center power density...

Wednesday 23 September 2026
Nexperia China turns 12-inch wafers into the backbone of its chip supply-chain reset

Nexperia China is accelerating production on its domestic 12-inch wafer platform as it rebuilds a locally controlled semiconductor supply...

Wednesday 23 September 2026
Episil says AI demand marks structural shift in semiconductor epitaxy
Episil Precision said AI-related demand is reshaping semiconductor epitaxy for the long term, with effects reaching global power and optical supply chains. The Taiwan-based maker is...
Wednesday 23 September 2026
SK hynix's venture arm moves beyond memory into optical interconnect and system software
SK hynix has launched a corporate venture capital (CVC) brand, SK hynix Ventures, and widened its investment scope beyond semiconductors and emerging technology to include AI computing,...
Wednesday 23 September 2026
MediaTek, Qualcomm target Googlebook with Arm push
Preorders have officially opened for "Googlebook," Google's new laptop category purpose-built for Gemini Intelligence. IC design powerhouses Qualcomm and MediaTek announced their entry...
Wednesday 23 September 2026
Taiwan's August export orders top US$100 billion as overseas production edges up

Taiwan's export orders topped US$100 billion in August 2026, reaching US$102.96 billion, up US$5.02 billion from the previous month,...

Wednesday 23 September 2026
Taiwan courts Indian IIT chief in bid to boost chip talent ties
Taiwan is stepping up outreach to India's engineering sector as global competition for chip and artificial intelligence talent intensifies. The planned cooperation could affect supply...
Wednesday 23 September 2026
Win Semiconductors expands optical communications capacity with DUV tools
Optical communications capacity is in short supply as surging computing demand from AI data centers turns transmission into a bottleneck for AI infrastructure. The market is shifting...
Wednesday 23 September 2026
Ascend 950 clears higher security bar in China's latest chip assessment: who else qualified?
China has tightened the security and reliability framework around its domestic computing stack, with the latest official evaluation placing Huawei's Ascend 950 at Level II and Kunlunxin's...
Wednesday 23 September 2026
Lightmatter launches an optical module that cuts AI cluster fiber in half
US photonics company Lightmatter has launched an optical module that sends and receives data over a single strand of fiber. The company says this halves the cabling needed to connect...