News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Thursday 30 October 2025

MXIC chair vows comeback after ninth straight quarterly loss

Memory chipmaker MXIC reported a net loss of NT$862 million (US$28.1 million) in the third quarter of 2025, marking its ninth consecutive quarterly deficit. Chairman Miin Wu candidly...

Thursday 30 October 2025

AMEC reports 46% sales jump on strong etching, thin-film tool momentum

Chinese semiconductor equipment maker Advanced Micro-Fabrication Equipment (AMEC) reported strong growth in the first three quarters of 2025, driven by surging demand for its etching...

Thursday 30 October 2025

Samsung 3Q25 marks the reset of the global memory hierarchy

Samsung Electronics staged a strong rebound in the third quarter of 2025 and set the tone for the next phase of the memory cycle, where AI infrastructure, premium product mix, and...

Thursday 30 October 2025

Singapore leverages advanced packaging to capture share of US$1 trillion chip market

Terence Gan, Executive Director of Singapore's Institute of Microelectronics (IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling...

Thursday 30 October 2025

STATS ChipPAC targets 600mm panel-level packaging in roadmap for next-generation AI chips

Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company's advanced packaging technology roadmap at the 2025 Advanced...

Thursday 30 October 2025

'Semiconductor paradox' defines next chip boom, says director of Singapore's SSIA

Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA), told attendees at the 2025 Advanced Packaging...

Thursday 30 October 2025

Analysis: Japan's new PM aims to replicate TSMC playbook with tech investment push

Japan's new Prime Minister Sanae Takaichi announced a growth strategy prioritizing "crisis management investment" in AI, semiconductors, and quantum technology to address economic...

Thursday 30 October 2025

Hanwha Semitech and Hanmi Semiconductor escalate HBM equipment patent dispute

Korean media have confirmed that Hanwha Semitech, previously sued by Hanmi Semiconductor for patent infringement, has now filed a counter-lawsuit against Hanmi, accusing Hanmi's HBM...

Thursday 30 October 2025

Wingtech urges the Netherlands to reverse takeover of Nexperia through Dutch public media

Chinese electronics manufacturer Wingtech Technology has filed a formal statement with the Dutch public broadcaster NOS, urging the Netherlands...

Thursday 30 October 2025

STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era

IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge...

Thursday 30 October 2025

GlobalFoundries to invest EUR1.1 billion to expand Dresden semiconductor facility

GlobalFoundries announced plans to invest EUR1.1 billion to expand its semiconductor manufacturing operations at its Dresden, Germany site. The investment, part of the project known...

Thursday 30 October 2025

Samsung 3Q25 profit surges on AI chip demand, beats estimates

Samsung reported consolidated revenue of KRW86.1 trillion (US$59.8 billion) and operating profit of KRW12.2 trillion for the quarter ended September 30, 2025, beating both its own...

Thursday 30 October 2025

AMD completes divestiture of ZT Systems manufacturing business to Sanmina

On October 27, 2025, AMD completed the divestiture of ZT Systems' US-headquartered data center infrastructure manufacturing business to Sanmina Corporation. Under the agreement, AMD...

Thursday 30 October 2025

China's 15th Five-Year tech doctrine to tilt global industry balance

China's next phase of technology strategy is injecting fresh uncertainty into global supply chains, signalling a new round of strategic...

Thursday 30 October 2025

Commentary: China's JCET bets on AI to challenge global packaging giants

Artificial intelligence (AI) is reshaping the global semiconductor supply chain and accelerating transformation in IC packaging and testing. As Qualcomm moves into the AI data center...

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