CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Tuesday 30 December 2025
Chinese GPU provider Lisuan Technology begins shipping self-developed 7G100 GPU
Chinese GPU developer Lisuan Technology has started shipping its 7G100 GPU, marking a significant step toward commercialization. Reported by Jiemian News, the GPU uses TSMC's...
Tuesday 30 December 2025
China's Univista rides domestic EDA surge to push for IPO
Univista Industrial Software Group filed for initial public offering guidance on December 26, seeking capital to support the development of domestic semiconductor design tools in...
Tuesday 30 December 2025
Huawei chair outlines resilience under years of sanctions
Huawei rotating chairwoman Sabrina Meng delivered the company's 2026 New Year speech on December 30, 2025, highlighting Huawei's resilient business strategy despite enduring years...
Tuesday 30 December 2025
Top tech topics in 2025 (1): a year of strategic realignment for global semiconductors
As 2025 draws to a close, the global semiconductor industry has undergone a fundamental transformation marked by heightened geopolitical tensions, supply chain restructuring, and...
Tuesday 30 December 2025
TSMC's Arizona red tape exposes reality of reshoring US manufacturing
TSMC's Arizona semiconductor complex illustrates the practical hurdles of re-shoring advanced manufacturing to the US. The project required navigating 18,000 unique rules and permits,...
Tuesday 30 December 2025
South Korea charts road to 0.2nm chips by 2040
The global semiconductor industry is poised to enter the "angstrom era" by 2040 as circuit dimensions shrink to one-tenth of current levels, according to a long-term technology roadmap...
Tuesday 30 December 2025
US reportedly eases chip tool curbs for Samsung, SK Hynix China plants

The US has reportedly adjusted export control procedures for Samsung Electronics and SK Hynix operations in China, easing near term operational...

Tuesday 30 December 2025
Taiwan quake damages key quartz tubes at fabs, putting chip recovery in focus

A magnitude 7.0 earthquake off Taiwan's eastern coast late on December 27 disrupted parts of the island's semiconductor supply chain, after...

Tuesday 30 December 2025
Samsung rumored to jump to 2nm at Texas fab, signaling US chip competition
Samsung Electronics is reportedly upgrading its Texas fab from 4nm to 2nm, aiming to rival TSMC in the US market. If confirmed, the move could reshape supply chains for major tech...
Tuesday 30 December 2025
Commentary: Why China chose multi-accelerator strategy in AI chip development
Facing US restrictions on high-end computing products, China is restructuring its AI chip industry by advancing GPU, TPU, and NPU technologies simultaneously. Domestic firms struggle...
Tuesday 30 December 2025
Analysis: Why TSMC's Kumamoto plant is unlikely to reach 2nm before 2028
TSMC is navigating a complex landscape of export controls and domestic competition as speculation grows around its second Kumamoto factory. The key question: will the Japanese facility...
Tuesday 30 December 2025
SMIC acquires remaining stake in wafer unit for US$5.8 billion
Semiconductor Manufacturing International Corp. (SMIC), China's largest contract chipmaker, said on Monday it will take full control of its SMNC wafer manufacturing unit in a transaction...
Tuesday 30 December 2025
AI infrastructure demand boosts Taiwan exports, while visibility beyond 2025 stays limited
As 2025 concludes, Taiwan's information and communication technology (ICT) and electronics sectors have experienced significant export growth driven by AI-related demand, particularly...
Tuesday 30 December 2025
Samsung Electronics supplies Exynos Auto chip to BMW iX3, marking automotive semiconductor push
Samsung Electronics has begun supplying its advanced Exynos Auto V720 processor to BMW's iX3 electric vehicle, signaling the company's formal entry into the automotive semiconductor...
Tuesday 30 December 2025
H200 exports to China point to controlled easing in US semiconductor policy
Nvidia has reportedly informed its Chinese customers of its intention to deliver H200 AI chips by mid-February 2026, with shipments targeting 5,000 to 10,000 modules. This volume...