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Friday 12 June 2026
Chinese chip foundry United Nova bets US$3B on AI power, optical interconnects
United Nova Technology (UNT) is expanding from automotive and industrial chips into AI server power management and optical interconnects through a CNY20 billion (US$3 billion) 12-inch...
Friday 12 June 2026
Powerlogic says AI server demand and rising memory costs hit May 2026 revenue
Powerlogic reported that a surge in demand for AI servers, a reallocation of supply-chain resources, higher memory prices, and delayed consumer upgrade cycles reduced short-term sales,...
Friday 12 June 2026
Official think tank lays out 2035 roadmap to reduce India's reliance on imported chips
India's official think tank NITI Aayog has outlined a 2035 roadmap for India to become a more central part of the global semiconductor industry, warning that continued reliance on...
Friday 12 June 2026
PCIM 2026: Overcoming thermal warping in direct-cooled EV power modules
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing...
Friday 12 June 2026
CXMT IPO rides HBM shift to shake DRAM order, but Koreans seen holding ground

ChangXin Memory Technologies (CXMT), China's largest DRAM maker, plans to raise approximately CNY29.5 billion (US$4.35 billion) through...

Friday 12 June 2026
China's memory firms chase capital as AI storage demand lifts Biwin, Longsys
As CXMT and YMTC move toward initial public offerings, other players across China's memory supply chain are also advancing expansion, fundraising, and listing plans. The activity spans...
Friday 12 June 2026
CXMT and YMTC chase IPOs as AI memory demand tests capacity, yield, and tool localisation
China's two leading memory chipmakers, CXMT and YMTC, are moving closer to the capital market, putting the country's memory industry back under the semiconductor spotlight.
Friday 12 June 2026
Taiwan OSAT firms gain from AI chip demand and foundry spillover
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers...
Friday 12 June 2026
Google TPU orders shift as MediaTek, Marvell, and Broadcom split market
Broadcom has acknowledged it will not win all of Google's TPU orders, highlighting how tensor processing units have become a competitive arena for multiple chipmakers. For global readers,...
Friday 12 June 2026
SuperAI Singapore: Arm and Cerebras push system-wide fixes to cut inference AI bottlenecks

Breaking the inference barrier requires a rethink of the whole system architecture, not just faster compute. This was the key takeaway...

Friday 12 June 2026
Power semiconductors race to cut resistance for GPU cooling
Power semiconductors are taking on a central role as AI data centers move from 800V high-voltage input down through multiple power-conversion stages to the ultra-low voltages used...
Friday 12 June 2026
Lenovo reportedly plans second PC price hike as memory costs squeeze supply chain
Chinese PC major Lenovo is reportedly set to raise prices across its entire product line from July 2026, with increases broadly in line with its first round of adjustments in March...
Friday 12 June 2026
DDR4 shortage tightens as Nanya capacity fills and prices climb

DDR4 memory supply remains tight, with the shortage affecting buyers worldwide, from cloud and server operators to industrial and networking...

Thursday 11 June 2026
Amkor Korea weighs KRW1 trillion Gwangju expansion amid reported TSMC order growth

Amkor Technology Korea is considering investing about KRW1 trillion (approx. US$650 million) to expand its chip packaging and testing...

Thursday 11 June 2026
Applied Materials CEO: AI reshapes semiconductor innovation
Applied Materials said artificial intelligence (AI) is reshaping the global semiconductor industry and could drive years of heavy investment in chipmaking, packaging, and materials...